Method for manufacturing display device and display device manufactured by the method

Patent metadata

Field	Value
Publication number	US-2016197300-A1
Application number	US-201514727087-A
Country	US
Kind code	A1
Filing date	Jun 1, 2015
Priority date	Jan 5, 2015
Publication date	Jul 7, 2016
Grant date	—

Abstract

A method for manufacturing a display device, includes preparing a display panel including a base substrate, an encapsulation layer facing the base substrate, and an organic light emitting device formed between one surface of the base substrate and the encapsulation layer, attaching a support layer to the other surface of the base substrate through an adhesive layer, curing the adhesive layer through irradiation of UV light, and mounting a driving chip on one surface of the display panel. The adhesive layer includes an acryl-based compound, a UV curable compound, and a photoinitiator.

First claim

What is claimed is:

1 . A method for manufacturing a display device, comprising:
preparing a display panel, the preparation of the display panel comprising:
disposing a base substrate,
disposing an encapsulation layer facing a first surface the base substrate, and
disposing an organic light emitting device between one surface of the base substrate and the encapsulation layer;
disposing a support layer on a second surface of the base substrate using an adhesive layer; curing the adhesive layer using ultraviolet (UV) light irradiation; and mounting a driving chip on one surface of the display panel, wherein the adhesive layer comprises an acryl-based compound, a UV curable compound, and a photoinitiator.

2 . The method of claim 1 , wherein the acryl-based compound comprises buthylacrylate, ethylacrylate, acrylic acid, 2,2′-azobissiobutyronitrile (AIBN), or a mixture thereof.

3 . The method of claim 2 , wherein the acryl-based compound comprises 30-60 wt % of buthylacrylate, 30-60 wt % of ethylacrylate, 0.1-20 wt % of acrylic acid, and 0.1-20 wt % of 2,2′-azobissiobutyronitrile (AIBN).

4 . The method of claim 1 , wherein the UV curable compound comprises aliphatic urethane acrylate, trimethylolpropane triacrylate (TMPTA), 1,6 hexanediol diacrylate (HDDA), or a mixture thereof.

5 . The method of claim 4 , wherein the UV curable compound comprises 5-50 wt % of aliphatic urethane acrylate, 5-50 wt % of trimethylolpropane triacrylate (TMPTA), and 5-50 wt % of 1,6 hexanediol diacrylate (HDDA).

6 . The method of claim 1 , wherein a mixing ratio of the acryl-based compound and the UV curable compound is in the range of 95.5:0.5 to 70:30.

7 . The method of claim 1 , wherein the adhesive layer further comprises heat resistance additives.

8 . The method of claim 7 , wherein the heat resistance additives comprise at least one selected from the group consisting of hexa-fluoro di-methacrylate imide (6FDAI), melamine tri-acrylate, melamine buta-acrylate, melamine penta-acrylate, melamine hexa-acrylate, carbon nano tube, graphite, and graphine.

9 . The method of claim 7 , wherein a total composition of the adhesive layer comprises the heat resistance additives in the range of 0.1-30 wt %.

10 . The method of claim 1 , wherein curing the adhesive layer comprises radiation of UV light from the support layer toward the base substrate.

11 . The method of claim 1 , wherein a storage modulus of the adhesive layer after the curing of the adhesive layer is in the range of 106 to 107 Pa.

12 . The method of claim 1 , wherein the base substrate comprises polyimide.

13 . The method of claim 1 , wherein preparing a display panel further comprises:
portioning the display panel into a display portion and a pad portion, wherein the one surface of the display panel on which the driving chip is mounted is the pad portion.

14 . The method of claim 13 , wherein mounting the driving chip comprises:
seating the display panel on a stage; and mounting the driving chip on the pad portion using a pressure head.

15 . The method of claim 13 , wherein the driving chip is directly mounted on the pad portion.

16 . The method of claim 13 , further comprising:
disposing an anisotropic conductive film between a bump electrode part of the driving chip and the pad portion.

17 . A display device, comprising:
a base substrate; an encapsulation layer facing the base substrate; an organic light emitting device disposed between a first surface of the base substrate and the encapsulation layer; a support layer disposed on a second surface of the base substrate, the second surface opposite the first surface; an adhesive layer disposed between the base substrate and the support layer; and a driving chip disposed on the base substrate, wherein the adhesive layer comprises an acryl-based compound, a UV curable compound, and a photoinitiator.

18 . The display device of claim 17 , wherein the wherein the acryl-based compound comprises 30-60 wt % of buthylacrylate, 30-60 wt % of ethylacrylate, 0.1-20 wt % of acrylic acid, and 0.1-20 wt % of 2,2′-azobissiobutyronitrile (AIBN).

19 . The display device of claim 17 , wherein the UV curable compound comprises 5-50 wt % of aliphatic urethane acrylate, 5-50 wt % of trimethylolpropane triacrylate (TMPTA), and 5-50 wt % of 1,6 hexanediol diacrylate (HDDA).

20 . The display device of claim 17 , wherein the adhesive layer comprises 0.1-30 wt % of additives comprising at least one selected from the group consisting of hexa-fluoro di-methacrylate imide (6FDAI), melamine tri-acrylate, melamine buta-acrylate, melamine penta-acrylate, melamine hexa-acrylate, carbon nano tube, graphite, and graphine.

Assignees

• Samsung Display Co Ltd

Inventors

• Hwang Hyeon Deuk
• Kim Su Kyoung
• Joo So Yeon

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title