Apparatuses and systems for embedded thermoelectric generators
US-9203010-B2 · Dec 1, 2015 · US
US2016197256A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016197256-A1 |
| Application number | US-201414437119-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 18, 2014 |
| Priority date | Sep 27, 2013 |
| Publication date | Jul 7, 2016 |
| Grant date | — |
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Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 <Chemical Formula 1> Bi 2 Te x Se n−x In y M z where in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5<x<3.0, 3.0≦a<3.5, 0<y and 0≦z.
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1 . A compound semiconductor, represented by Chemical Formula 1 below: Chemical Formula 1 Bi2TexSea−xInyMz <Chemical Formula 1> where, in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5<x<3.0, 3.0≦a<3.5, 0<y and 0≦z. 2 . The compound semiconductor according to claim 1 , wherein, in Chemical Formula 1, y and z satisfy the conditions of 0<y<0.009 and 0≦z<0.09. 3 . The compound semiconductor according to claim 1 , wherein, in Chemical Formula 1, y+z satisfies the condition of 0.002<y+z<0.09. 4 . The compound semiconductor according to claim 1 , wherein, in Chemical Formula 1, y is 0.0068. 5 . The compound semiconductor according to claim 1 , wherein, in Chemical Formula 1, z is 0.0369. 6 . The compound semiconductor according to claim 1 , wherein, in Chemical Formula 1, a satisfies the condition of a>3.0. 7 . The compound semiconductor according to claim 1 , wherein the compound semiconductor is manufactured by a method including: forming a mixture containing Bi, Te and Se; thermally treating the mixture; adding In to the thermally treated mixture; and pressure-sintering the In-added mixture. 8 . The compound semiconductor according to claim 7 , wherein, in the In adding step, M is further added together with In. 9 . The compound semiconductor according to claim 7 , wherein the thermal treatment step is performed by means of solid-state reaction. 10 . The compound semiconductor according to claim 7 , wherein the pressure sintering step is performed by means of spark plasma sintering. 11 . A preparation method of a compound semiconductor defined in the claim 1 , comprising: forming a mixture containing Bi, Te and Se; thermally treating the mixture; adding In to the thermally treated mixture; and pressure-sintering the In-added mixture. 12 . The preparation method of a compound semiconductor according to claim 11 , wherein, in the In adding step, 0.1 wt % of In is added based on the entire weight of the mixture. 13 . The preparation method of a compound semiconductor according to claim 11 , wherein, in the In adding step, M is further added together with In. 14 . The preparation method of a compound semiconductor according to claim 11 , wherein the thermal treatment step is performed by means of solid-state reaction. 15 . The preparation method of a compound semiconductor according to claim 11 , wherein the pressure sintering step is performed by means of spark plasma sintering. 16 . A thermoelectric conversion device, which includes the compound semiconductor defined in claim 1 . 17 . The thermoelectric conversion device according to claim 16 , which includes the compound semiconductor defined in claim 1 as an N-type thermoelectric conversion material. 18 . A solar cell, which includes the compound semiconductor defined in claim 1 . 19 . A bulk-type thermoelectric material, which includes the compound semiconductor defined in claim 1 .
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