Casing, electronic device employing same and manufacturing method

Patent metadata

Field	Value
Publication number	US-2016192517-A1
Application number	US-201514826420-A
Country	US
Kind code	A1
Filing date	Aug 14, 2015
Priority date	Dec 24, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A casing includes a cover and a frame coupled to the cover. The frame includes a base body and a plurality of non-conductive portions. The base body defines a plurality of gaps spaced from each other. The non-conductive portions are correspondingly inserted into the gaps to insulate opposite sides of each gap. A manufacturing method and an electronic device of the casing are also provided.

First claim

What is claimed is:

1 . A casing comprising:
a cover; and a frame coupled to the cover and comprising:
a base body defining a plurality of gaps spaced from each other, each gap having opposite sides; and
a plurality of non-conductive portions correspondingly inserted into the gaps to insulate the opposite sides of each gap.

2 . The casing as claimed in claim 1 , wherein the base body defines a groove corresponding to the gaps and comprises a thin portion corresponding to the groove, the gaps are defined through the thin portion.

3 . The casing as claimed in claim 2 , wherein the base body comprises a first surface and a second surface opposite to the first surface, the groove is defined in the first surface or the second surface.

4 . The casing as claimed in claim 3 , wherein a thickness of the thin portion is 0.3-0.5 millimeter.

5 . The casing as claimed in claim 1 , wherein the gaps divide the base body into a plurality of metal pieces and base portions, the metal pieces and base portions adjacent to the metal pieces are connected via the non-conductive portions.

6 . The casing as claimed in claim 5 , wherein a width of each gap and each non-conductive portion is 0.03-0.15 millimeter.

7 . The casing as claimed in claim 5 , wherein each metal piece and each base portion define a plurality of nano holes on a surface connected to the non-conductive portion, each non-conductive portion comprises a plurality of ribs configured to engage to the nano holes of the metal piece and the base portion.

8 . The casing as claimed in claim 7 , wherein a diameter of the nano holes is 40-60 nanometer.

9 . The casing as claimed in claim 7 , wherein the frame further comprises a combination layer configured to couple the metal pieces, the base portions, and the non-conductive portions together.

10 . The casing as claimed in claim 9 , wherein the each metal piece and each base portion define a plurality of nano holes on a surface connected to the combination layer, the combination layer comprises a plurality of ribs portions configured to engage to the nano holes of the metal piece and the base portion.

11 . The casing as claimed in claim 10 , wherein the frame further comprises a connecting layer configured to couple the combination layer to the base portions; each base portion define a plurality of nano holes on a surface connected to the connecting layer, the connecting layer comprises a plurality of ribs sections configured to engage to the nano holes of the base portion.

12 . A manufacturing method of a casing comprising:
providing a base body and a cover made of metal material; incising a portion of the base body to form a plurality of gaps throughout the base body, the gaps dividing the base body into a plurality of metal pieces and a plurality of base portions; every adjacent metal piece and the base portion, and every adjacent metal pieces connected via at least one end; filling plastic material into the gaps to form a plurality of non-conductive portions; removing the at least one end connecting the adjacent metal pieces and the base portions, and the adjacent metal pieces to form independent metal pieces and base portions; and coupling the frame to the cover.

13 . The manufacturing method as claimed in claim 12 , further comprising:
thinning the portion of the base body to form a groove corresponding to the gaps.

14 . The manufacturing method as claimed in claim 12 , wherein each metal piece and each base portion includes a side surface and an internal surface adjacent to the side surface; the manufacturing method further comprises:
defining a plurality of nano holes on the side surface and the internal surface of the metal pieces and the base portions; forming a plurality of ribs from the non-conductive portions configured to engage to the nano holes of the side surface of the metal pieces and the base portions.

15 . The manufacturing method as claimed in claim 14 , further comprising:
forming a combination layer by insert molding with plastic material into the groove; forming a plurality of rib portions from the combination layer configured to engage to the nano holes of the internal surface of the metal pieces and the base portions.

16 . The manufacturing method as claimed in claim 15 , further comprising:
forming a connecting layer by secondary insert molding with plastic material; forming a plurality of rib sections from the connecting layer configured to engage to the nano holes of the internal surface of the base portions.

17 . The manufacturing method as claimed in claim 12 , further comprising:
processing surface treatment to the base body to form a protection layer on a surface of the base surface via anodicoxidation treatment or physical vapor deposition treatment.

18 . An electronic device comprising:
a main body; a frame comprising:
a base body defining a plurality of gaps spaced from each other, each gap having opposite sides; and
a plurality of non-conductive portions correspondingly inserted into the gaps to insulate the opposite sides of each gap;
a cover coupling the frame to the main body; and an antenna corresponding to the non-conductive portions.

19 . The electronic device as claimed in claim 18 , wherein the base body is coupled to the antenna to be an extra part of the antenna, signals transmitted and received by the antenna pass through the non-conductive portion.

20 . The electronic device as claimed in claim 18 , wherein the gaps divide the base body into a plurality of metal pieces and base portions, the metal pieces and base portions adjacent to the metal pieces are connected via the non-conductive portions.

Assignees

• Fih Hong Kong Ltd

Inventors

• Tsao Chia-Wen

Classifications

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• H04B1/3888 Primary

  Arrangements for carrying or protecting transceivers · CPC title

• H05K13/00 Primary

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title