Light-emitting device

Patent metadata

Field	Value
Publication number	US-2016190409-A1
Application number	US-201514757460-A
Country	US
Kind code	A1
Filing date	Dec 23, 2015
Priority date	Dec 24, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.

First claim

What is claimed is:

1 . A light-emitting device comprising:
a light-emitting diode comprising
an active layer;
an insulation layer formed on the active layer and having a side surface; and
a pad electrically connected to the active layer;
a metal bump formed on the pad; and a reflective insulation layer covering the side surface.

2 . The light-emitting device of claim 1 , wherein the light-emitting diode further comprising a substrate with a side surface covered by the reflective insulation layer.

3 . The light-emitting device of claim 1 , further comprising a wavelength conversion layer formed on the reflective insulation layer and the light-emitting diode.

4 . The light-emitting device of claim 3 , wherein the wavelength conversion layer has a top surface and a bottom surface, and has a particle concentration gradually decreasing from the top surface to the bottom surface.

5 . The light-emitting device of claim 3 , further comprising a plurality of scratched lines formed on the metal bump.

6 . The light-emitting device of claim 1 , wherein the light-emitting diode further comprises a semiconductor layer with a side surface covered by the reflective insulation layer.

7 . The light-emitting device of claim 1 , further comprising a wavelength conversion layer, wherein the light-emitting diode further comprises a substrate with a side surface covered by the wavelength conversion layer.

8 . The light-emitting device of claim 1 , further comprising a plurality of scratched lines formed on the reflective insulation layer.

9 . The light-emitting device of claim 1 , wherein the metal bump has a vertical side surface.

10 . The light-emitting device of claim 1 , wherein the metal bump is formed to outwardly extend beyond a surface of the reflective insulation layer.

11 . The light-emitting device of claim 1 , wherein the reflective insulation layer comprises a matrix with a refractive index of 1.5˜1.6.

Assignees

• Epistar Corp

Inventors

• Kuo Jai-Tai
• Hsieh Min-Hsun
• Lai Lung-Kuan
• Cheng Wei-Kang
• Liu Chien-Liang
• Renn Yih-Hua
• Chen Shou-Lung
• Ko Tsun-Kai
• Pu Chi-Chih

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10H20/841

  Reflective coatings, e.g. dielectric Bragg reflectors · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/856

  Reflecting means · CPC title