Method of forming a micro LED device with self-aligned metallization stack
US-9548332-B2 · Jan 17, 2017 · US
Laser assisted transfer welding process
US2016190091A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016190091-A1 |
| Application number | US-201514879581-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 9, 2015 |
| Priority date | Mar 29, 2010 |
| Publication date | Jun 30, 2016 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.
First claim
Opening claim text (preview).
That which is claimed: 1 . A method of printing transferable components, the method comprising: pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer; during pressing of the stamp on the target substrate, exposing the at least one transferable component to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer; and then separating the stamp from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate.
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Classifications
Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title
batch processes · CPC title
Means for applying energy, e.g. ovens or lasers · CPC title
On different surfaces · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
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- What does patent US2016190091A1 cover?
- A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable compon…
- Who is the assignee on this patent?
- Semprius Inc, Univ Illinois
- What technology area does this patent fall under?
- Primary CPC classification H10D86/0214. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).