Electronic component and method of manufacturing the same

US2016189840A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016189840-A1
Application numberUS-201514949425-A
CountryUS
Kind codeA1
Filing dateNov 23, 2015
Priority dateDec 30, 2014
Publication dateJun 30, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. The lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil parts to protrude externally from the ends of the internal coil parts.

First claim

Opening claim text (preview).

What is claimed is: 1 . An electronic component comprising: a magnetic body; and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body, wherein the lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil parts to protrude externally from the ends of the internal coil parts. 2 . The electronic component of claim 1 , wherein spaces between the plurality of protruding portions are filled with a material the same as a material forming the magnetic body. 3 . The electronic component of claim 1 , further comprising external electrodes disposed on outer surfaces of the magnetic body and connected to the lead parts. 4 . The electronic component of claim 3 , wherein the external electrodes are connected to the plurality of protruding portions of the lead parts. 5 . The electronic component of claim 4 , wherein spaces between the plurality of protruding portions are filled with a material the same as a material forming the magnetic body such that the plurality of protruding portions contact the external electrodes. 6 . The electronic component of claim 5 , wherein coupling force between the magnetic body and the external electrodes is greater than coupling force between the plurality of protruding portions and the external electrodes. 7 . The electronic component of claim 1 , wherein the coil pattern is formed by a plating process. 8 . The electronic component of claim 1 , wherein the coil pattern comprises a first coil pattern disposed on one surface of an insulating substrate and a second coil pattern disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate. 9 . The electronic component of claim 8 , wherein the insulating substrate includes a through-hole penetrating through a central portion thereof, and the through-hole of the insulating substrate is filled with a material the same as a material forming the magnetic body. 10 . The electronic component of claim 1 , wherein the magnetic body includes a magnetic metal powder and a thermosetting resin. 11 . A method of manufacturing an electronic component, the method comprising: forming coil patterns on an insulating substrate; and providing magnetic sheets on an upper surface and a lower surface of the insulating substrate on which the coil patterns are formed, to form a magnetic body, wherein the coil patterns include internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and exposed to surfaces of the magnetic body, and the lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil parts to protrude externally from the ends of the internal coil parts. 12 . The method of claim 11 , wherein spaces between the plurality of protruding portions are filled with a material the same as a material forming the magnetic body. 13 . The method of claim 11 , further comprising forming external electrodes on outer surfaces of the magnetic body to be connected to the lead parts. 14 . The method of claim 13 , wherein the external electrodes are formed to be connected to the plurality of protruding portions of the lead parts. 15 . The method of claim 14 , wherein the external electrodes are formed to be in contact with regions of spaces between the plurality of protruding portions in the magnetic body, the regions being filled with a material the same as a material forming the magnetic body. 16 . The method of claim 15 , wherein coupling force between the magnetic body and the external electrodes is greater than coupling force between the plurality of protruding portions and the external electrodes. 17 . The method of claim 11 , wherein the coil patterns is formed by a plating process. 18 . The method of claim 11 , further comprising: removing a central portion of the insulating substrate so as to form a core part hole; and filling the core part hole formed in the insulating substrate with a same magnetic material for forming the magnetic body.

Assignees

Inventors

Classifications

  • Surface mounted devices · CPC title

  • with magnetic core · CPC title

  • H01F17/00Primary

    Fixed inductances of the signal type {(coils in general H01F5/00)} · CPC title

  • Coils; Windings; Conductive connections · CPC title

  • H01F41/046Primary

    structurally combined with ferromagnetic material · CPC title

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What does patent US2016189840A1 cover?
An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. The lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil p…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01F17/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jun 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).