Method and system for controlling evaporative and heat withdrawal performance of an occupant support surface
US-9222685-B2 · Dec 29, 2015 · US
US2016184162A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016184162-A1 |
| Application number | US-201414586490-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 30, 2014 |
| Priority date | Dec 30, 2014 |
| Publication date | Jun 30, 2016 |
| Grant date | — |
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An applicator for use in treating a portion of skin includes an applicator tip that has an end configured to contact the portion of skin, a sonic source mechanically coupled to the applicator tip, a heat source thermally coupled to an end of the applicator tip, and a controller. The applicator tip includes a thermally-conductive material. During operation of the applicator, the controller controls operation of the sonic source to impart mechanical movements to the applicator tip at a sonic frequency and controls operation of the heat source to transfer heat to the end of the applicator tip via the thermally-conductive material of the applicator tip.
Opening claim text (preview).
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1 . An applicator for use in treating a portion of skin, the applicator comprising: an applicator tip having an end configured to contact the portion of skin, wherein the end of the applicator tip includes a thermally-conductive material; a sonic source mechanically coupled to the applicator tip; a heat source thermally coupled to the end of the applicator tip; and at least one controller configured to control operation of the sonic source and the heat source; wherein, during operation of the applicator, the at least one controller controls operation of the sonic source to impart mechanical movements to the applicator tip at a sonic frequency and controls operation of the heat source to transfer heat to the end of the applicator tip via the thermally-conductive material of the applicator tip. 2 . The applicator of claim 1 , wherein the heat source includes a heating disk. 3 . The applicator of claim 2 , wherein the heating disk includes a plurality of layers of electrical components positioned on an alumina substrate. 4 . The applicator of claim 1 , further comprising: a heat sensor configured to generate a signal based on a temperature of the applicator tip and to send the signal to the controller. 5 . The applicator of claim 4 , wherein the temperature of the applicator tip includes one or more of a temperature of the applicator tip or a temperature of the heat source. 6 . The applicator of claim 4 , wherein the at least one controller is configured to control the heat source based on the signal sent to the at least one controller by the heat sensor. 7 . The applicator of claim 1 , wherein the at least one controller is configured to control operation of the heat source based on a target temperature of the end of the applicator tip. 8 . The applicator of claim 7 , wherein the target temperature is in a range from about 32° C. to about 50° C. 9 . The applicator of claim 1 , wherein the mechanical movements at the sonic frequency are reciprocating mechanical movements. 10 . The applicator of claim 1 , wherein the mechanical movements at the sonic frequency are oscillatory mechanical movements. 11 . The applicator of claim 1 , further comprising: a contact member around the end of the applicator tip, wherein the contact member is configured to contact the portion of skin, and wherein the contact member and the end of the applicator tip form a concave pocket configured to contain formulation between the end of the applicator tip and the portion of skin. 12 . The applicator of claim 1 , wherein the end of the applicator tip is formed with a concave shape, and wherein the concave shape forms a pocket configured to contain formulation between the end of the applicator tip and the portion of skin. 13 . The applicator of claim 12 , wherein the thermally-conductive material forms the concave shape of the end of the applicator tip. 14 . The applicator of claim 1 , wherein the applicator tip includes a thermally-insulating material, and wherein the thermally-conductive material is embedded within the thermally-insulating material. 15 . A method for treating a portion of skin using an applicator that includes an applicator tip, wherein the applicator tip includes an end configured to contact the portion of skin, the method comprising: activating a sonic source of the applicator, wherein the sonic source is mechanically coupled to the applicator tip; activating a heat source of the applicator, wherein the heat source is thermally coupled to the end of the applicator tip; controlling operation of the sonic source to impart mechanical movements to the applicator tip at a sonic frequency; and controlling operation of the heat source to transfer heat to the end of the applicator tip via a thermally-conductive material of the applicator tip. 16 . The method of claim 15 , further comprising: applying a treatment formulation between the end of the applicator tip and the portion of skin during operation of the sonic source and operation of the heat source. 17 . The method of claim 16 , wherein applying the treatment formulation includes bringing the end of the applicator tip into contact with the treatment formulation when the treatment formulation is in a non-fluid form. 18 . The method of claim 17 , wherein the operation of the heat source is controlled such that heat transferred to the end of the applicator tip causes the treatment formulation to convert from the non-fluid form to a fluid form when the treatment formulation is in contact with the end of the applicator tip. 19 . The method of claim 18 , wherein applying the treatment formulation includes applying the treatment formulation in the fluid form to the portion of skin. 20 . The method of claim 16 , wherein the mechanical movements imparted to the applicator tip at the sonic frequency apply a shear stress to the treatment formulation that causes a viscosity of the treatment formulation to be lowered.
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