High density cabled midplanes and backplanes

Patent metadata

Field	Value
Publication number	US-2016181719-A1
Application number	US-201414578707-A
Country	US
Kind code	A1
Filing date	Dec 22, 2014
Priority date	Dec 22, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

First claim

1 . A method of manufacturing a cabled midplane, the method comprising:
providing a first support plate along a plane between a first connector set and a second connector set, the first connector set including a plurality of connectors to connect to respective line cards on a first side of the cabled midplane, the second connector set including a plurality of connectors to connect to respective line cards on a second side of the cabled midplane, connectors of the first connector set and the second connector set including a plurality of connector slices, the plurality of connector slices including at least a first connector slice that is a first distance along a first axis from the first support plate and a second connector slice that is a second distance, further than the first distance, along the first axis from the first support plate; and providing a first wiring sub-layer by mounting a first plurality of cable slices on the first support plate, each cable slice of the first plurality of cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set.

2 . The method of claim 1 , further comprising:
providing at least a second wiring sub-layer by connecting a second plurality of cable slices, each cable slice of the second plurality of cable slices to provide a connection between the second connector slice of a connector of the first connector set to the second connector slice of a connector of the second connector set, such that the second wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; and providing a second support plate, parallel to the first support plate and parallel to the first wiring sub-layer and the second wiring sub-layer, to encase the first wiring sub-layer and the second wiring sub-layer between the second support plate and the first support plate and to form a first wiring layer.

3 . The method of claim 2 , wherein providing the second wiring sub-layer includes connecting the second plurality of cable slices such that a connector of the first connector set is connected to a different connector of the second connector set in the second wiring sub-layer than the respective connector of the first connector set is connected to in the first wiring sub-layer.

4 . The method of claim 3 , further comprising:
providing a plurality of wiring sub-layers such that each connection in each connector in the first connector set is connected, through a separate connector slice, to each connection in each connector in the second connector set.

5 . The method of claim 4 , further comprising:
testing electrical connectivity within the first wiring sub-layer, prior to providing the second wiring sub-layer.

6 . The method of claim 2 , further comprising:
providing at least one opening in the first support plate between any two adjacent connectors of each of the first connector set and the second connector set; and preventing movement of the two adjacent connectors in a direction along a second axis different from the first axis by inserting a support element in the at least one opening.

7 . The method of claim 6 , wherein the support element includes a tab on at least one connector and a groove on at least the first support plate within which the tab is captured to prevent movement of the at least one connector.

8 . The method of claim 6 , wherein the support element includes a support rod.

9 . The method of claim 8 , further comprising:
providing a second wiring layer including at least a first wiring sub-layer mounted to a second side of the second support plate separated from the second wiring sub-layer of the first wiring layer, and further providing a third support plate to encase the first wiring sub-layer of the second wiring layer between the second support plate and the third support plate; and extending the support rod by a connector width of a third connector mounted to the second support plate, to join the first wiring layer and the second wiring layer.

10 . The method of claim 9 , further comprising:
providing a power layer between the second wiring layer and the first wiring layer, the power layer including power connections for providing power to line cards on the first side of the cabled midplane and to line cards on the second side of the cabled midplane.

11 . The method of claim 1 , wherein mounting the first plurality of cable slices includes mounting a plurality of conductors such that a conductor crosses over other conductors of the plurality of conductors at no more than one point in the plane between the first connector set and the second connector set.

12 . The method of claim 11 , wherein mounting the first plurality of cable slices further includes connecting the plurality of conductors such that any point on the plane between the first connector set and the second connector set includes no more than one instance of a conductor crossover between conductors of the plurality of conductors.

13 . The method of claim 1 , wherein providing the first support plate includes providing guide pins to displace the first support plate from the first wiring sub-layer by a distance along the first axis.

14 . A cabled midplane comprising:
a first support plate along a plane between a first connector set and a second connector set, the first connector set including a plurality of connectors to connect to respective line cards on a first side of the cabled midplane, the second connector set including a plurality of connectors to connect to respective line cards on a second side of the cabled midplane, connectors of the first connector set and the second connector set including a plurality of connector slices, the plurality of connector slices including at least a first connector slice that is a first distance along a first axis from the first support plate and a second connector slice that is a second distance, further than the first distance, along the first axis from the first support plate; a first wiring sub-layer including a first plurality of cable slices mounted on the first support plate, each cable slice of the first plurality of cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; at least a second wiring sub-layer including a second plurality of cable slices, each cable slice of the second plurality of cable slices to provide a connection between the second connector slice of a connector of the first connector set to the second connector slice of a connector of the second connector set, such that the second wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set and a second support plate, parallel to the first support plate, to encase the first wiring sub-layer and the second wiring sub-laver between the second support plate and the first support plate and to form a first wiring layer of the cabled midplane.

15 . (canceled)

16 . The cabled midplane of claim 15 , further including a power layer.

17 . The cabled

Assignees

• Intel Corp

Inventors

• Tamarkin Vladimir
• Genetti Wayne
• Mease Keith
• Wessel Mark

Classifications

• H01R13/502 Primary

  composed of different pieces (H01R13/514 takes precedence) · CPC title

• G02B6/4285 Primary

  Optical modules characterised by a connectorised pigtail · CPC title

• H04Q1/15

  Backplane arrangements · CPC title

• G02B6/4257

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• H01R43/20

  for assembling or disassembling contact members with insulating base, case or sleeve · CPC title