Touch sensor assembly

US2016178277A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016178277-A1
Application numberUS-201514977588-A
CountryUS
Kind codeA1
Filing dateDec 21, 2015
Priority dateDec 22, 2014
Publication dateJun 23, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a sensor assembly, a hole-shaped sensor support portion is formed at a sensor printed circuit board (PCB), a touch sensor is disposed at the sensor support portion, and an elastic member is installed at a rear surface of the sensor PCB. In addition, a sensor assembly according to an embodiment of the present invention may include a sensor PCB on which a copper coating film which constitutes a circuit is printed on a top surface of a plastic material, a touch sensor seated on a sensor support portion formed at the sensor PCB, and a cover member which is attached onto a rear surface of the sensor PCB and covers the sensor support portion.

First claim

Opening claim text (preview).

What is claimed is: 1 . A touch sensor assembly comprising: a sensor printed circuit board (PCB) having a conductive material forming a printed circuit on a top surface of an insulating substrate; a sensor support having a circular shape which passes through at least the conductive layer of the sensor PCB; a touch sensor including a circular metal plate provided at an upper side of the conductive layer to cover the sensor support, and a ceramic disc provided at a top surface of the metal plate and having a diameter less than that of the sensor support; a conductive foil covering the conductive layer and the touch sensor; and elastic members installed at a bottom surface of the sensor PCB corresponding to an outer side of the sensor support portion. 2 . The touch sensor assembly of claim 1 , wherein the sensor support comprises a hole passing through the insulating substrate of the sensor PCB. 3 . The touch sensor assembly of claim 2 , further comprising a cover film provided on the bottom surface of the sensor PCB to cover the sensor support. 4 . The touch sensor assembly of claim 3 , wherein the sensor support is formed in a lengthwise direction of the sensor PCB in a plural number, and the film cover is a sheet having a size to cover all of the plurality of sensor supports. 5 . The touch sensor assembly of claim 3 , wherein the sensor support is formed in a lengthwise direction of the sensor PCB in a plural number, and the film cover includes a plurality of individual films, each individual film having a size to cover one sensor support. 6 . The touch sensor assembly of claim 5 , wherein each individual film is provided between a pair of elastic members which face each other around the sensor support. 7 . The touch sensor assembly of claim 5 , wherein each individual film has a circular shape and the sensor support having stepped ledge at an inner circumferential surface, wherein each individual film is inserted onto the stepped ledge of the sensor support. 8 . The touch sensor assembly of claim 7 , wherein a surface of the individual film facing away from the hole of sensor support and the bottom surface of the sensor PCB are co-planar. 9 . The touch sensor assembly of claim 1 , wherein the touch sensor is a piezo sensor. 10 . The touch sensor assembly of claim 1 , further comprising a sensor housing configured to accommodate the sensor PCB therein, the sensor housing having a housing body to accommodate the sensor PCB and a housing cover coupled with a top surface of the housing body. 11 . The touch sensor assembly of claim 10 , further comprising a touch transfer plate provided at an opening formed at the housing cover, wherein the touch transfer plate is movable in the opening in a direction to which a touch pressure is applied so that the touch pressure on a front surface of the touch transfer plate is transferred to the ceramic disc. 12 . The touch sensor assembly of claim 11 , further comprising a protrusion protruding from a rear surface of the touch transfer plate corresponding to a position of the ceramic disc and being in contact with the ceramic disc. 13 . The touch sensor assembly of claim 12 , further comprising a conductive line formed on a bottom surface of the conductive foil and electrically connected to the ceramic disc and the circular metal plate. 14 . A touch sensor assembly comprising: a sensor printed circuit board (PCB) having a conductive line printed to form a circuit on an insulating substrate; a sensor support having a circular shape and passing through at least the conductive line of the sensor PCB; a touch sensor which includes a circular metal plate covering the sensor support and contacting an upper side of the conductive layer, and a ceramic disc provided at a top surface of the metal plate and having a diameter less than that of the sensor support; a spacer having a sensor hole formed at a position corresponding to a position of the touch sensor and provided over a top surface of the conductive layer; a conductive foil provided over a top surface of the spacer and having an inner guide line and an outer guide line on a rear surface of the conductive foil, the inner guide line having a diameter corresponding to a diameter of the ceramic disc and an outer guide line having a diameter corresponding to a diameter of the circular metal plate; and a film cover to cover a bottom surface of the sensor PCB corresponding to a position of the sensor support. 15 . The touch sensor assembly of claim 14 , further comprising a central conductive line extending from the center of a rear surface of the conductive foil in a lengthwise direction and electrically connecting the inner guide line and the outer guide line. 16 . The touch sensor assembly of claim 15 , further comprising a peripheral conductive line forming a mesh or grid shape at a rear surface of the conductive foil corresponding to an inner side of the inner guide line and an outer side of the outer guide line. 17 . The touch sensor assembly of claim 14 , wherein the sensor support is a hole passing through the insulating layer of the sensor PCB. 18 . The touch sensor assembly of claim 14 , wherein the sensor support is formed in a lengthwise direction of the sensor PCB in a plural number, and the film cover is sheet having a size to cover all of the plurality of sensor support portions. 19 . The touch sensor assembly of claim 14 , wherein the sensor support is formed in a lengthwise direction of the sensor PCB in a plural number, and the cover member includes a plurality of individual films, each individual film having a size to cover a corresponding sensor support. 20 . The touch sensor assembly of claim 19 , wherein each individual film has a circular shape and the sensor support having stepped ledge at an inner circumferential surface, wherein each individual film is inserted onto the stepped ledge of the sensor support. 21 . The touch sensor assembly of claim 20 , wherein a surface of the individual film facing away from the hole of sensor support and the bottom surface of the sensor PCB are co-planar. 22 . The touch sensor assembly of claim 14 , wherein the touch sensor is a piezo sensor. 23 . The touch sensor assembly of claim 14 , further comprising a sensor housing configured to accommodate the sensor PCB therein, the sensor housing having a housing body to accommodate the sensor PCB and a housing cover coupled with a top surface of the housing body. 24 . The touch sensor assembly of claim 23 , further comprising a touch transfer plate provided at an opening formed at the housing cover, wherein the touch transfer plate is movable in the opening in a direction to which a touch pressure is applied so that the touch pressure on a front surface of the touch transfer plate is transferred to the ceramic disc. 25 . The touch sensor assembly of claim 24 , further comprising a protrusion protruding from a rear surface of the touch transfer plate corresponding to a position of the ceramic disc and being in contact with the ceramic disc.

Assignees

Inventors

Classifications

  • Capacitive touch switches · CPC title

  • F25D29/005Primary

    Mounting of control devices · CPC title

  • using force sensing means to determine a position · CPC title

  • Touch pads, in which fingers can move on a surface · CPC title

  • Other arrangements on doors or windows, e.g. door-plates, windows adapted to carry plants, hooks for window cleaners {(edge protecting devices for door leaves E06B3/88; special glazing; emergency glazing; double glazing E06B3/66)} · CPC title

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What does patent US2016178277A1 cover?
In a sensor assembly, a hole-shaped sensor support portion is formed at a sensor printed circuit board (PCB), a touch sensor is disposed at the sensor support portion, and an elastic member is installed at a rear surface of the sensor PCB. In addition, a sensor assembly according to an embodiment of the present invention may include a sensor PCB on which a copper coating film which constitutes …
Who is the assignee on this patent?
Lg Electronics Inc
What technology area does this patent fall under?
Primary CPC classification F25D29/005. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Jun 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).