Led unit

Patent metadata

Field	Value
Publication number	US-2016178186-A1
Application number	US-201414893146-A
Country	US
Kind code	A1
Filing date	May 26, 2014
Priority date	May 29, 2013
Publication date	Jun 23, 2016
Grant date	—

Abstract

An LED unit ( 100 ) includes a base unit ( 1 ). The LED unit further includes a light emitting device ( 3 ) including: a package substrate ( 3 b ); and a light emitting portion ( 3 a ) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is formed of a molding in which a metal member ( 11 ) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.

First claim

1 . An LED unit comprising:
a base unit; and a light emitting device including: a package substrate; and a light emitting portion provided in the package substrate and having an LED chip, the light emitting device being placed on a front surface of the base unit, the base unit being formed of a molding in which a metal member is covered with thermally conductive resin having an electrical insulation property, the thermally conductive resin being interposed between the light emitting device and the metal member.

2 . The LED unit according to claim 1 , wherein the metal member is exposed on a rear surface of the base unit.

3 . The LED unit according to claim 1 , wherein thermal conductivity of the metal member is in a range of 50 to 400 W/m·K.

4 . The LED unit according to claim 1 , wherein a breakdown voltage between the front surface and the rear surface of the base unit is 5 kV/mm or greater.

5 . The LED unit according to claim 1 , wherein a Shore A hardness of the thermally conductive resin interposed between the light emitting device and the metal member is in a range of 10 or greater to less than 70.

6 . The LED unit according to claim 1 , further comprising:
an insulation and heat radiation moulding attached to the base unit to ensure electrical insulation between the light emitting device and the base unit, the insulation and heat radiation moulding being provided with a concavity in which the light emitting device is placed.

7 . The LED unit according to claim 6 , wherein a depth of the concavity is greater than a thickness of the package substrate.

8 . The LED unit according to claim 6 , wherein the insulation and heat radiation moulding is integrally formed with no joint.

9 . The LED unit according to claim 6 , wherein
the insulation and heat radiation moulding includes a bottom wall portion having one surface attached to the base unit and another surface on which the package substrate of the light emitting device is placed, and a side wall portion provided along a circumference of the bottom wall portion; and at least one of a recessed surface and a projecting surface is formed on an outer surface of the side wall portion.

10 . The LED unit according to claim 9 , wherein the package substrate is positioned by the side wall portion.

11 . The LED unit according to claim 9 , wherein the side wall portion is provided with a projection projecting outward.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Kusunoki Tomokazu
• Yoden Hiroyoshi
• Kotani Yuki
• Kotera Ryusuke

Classifications

• H10H20/8583

  not being in contact with the bodies · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H01L33/644

  Electricity · mapped topic

• F21K9/00

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title