Led lead frame array for general illumination

Patent metadata

Field	Value
Publication number	US-2016178133-A1
Application number	US-201414572911-A
Country	US
Kind code	A1
Filing date	Dec 17, 2014
Priority date	Dec 17, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmoulded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

First claim

What is claimed is:

1 . An LED lead frame assembly, comprising:
a circuit strip assembly; a plastic dam member overmoulded onto the circuit strip assembly; and a LED chip assembly disposed in a pocket of the plastic dam member, wherein the LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

2 . The LED lead frame assembly of claim 1 , wherein the circuit strip assembly comprises a pair of electrically conducting members and a heat dissipation member, the LED chip assembly being electrically coupled to the electrically conducting members and thermally coupled to the heat dissipation member.

3 . The LED lead frame assembly of claim 2 , wherein the plastic dam member electrically isolates the pair of electrically conducting members.

4 . The LED lead frame assembly of claim 2 , wherein the electrically conducting members are disposed on a first plane relative to the plastic dam member and the heat dissipation member is disposed on a second plane relative to the plastic dam member, wherein the first plane is in a different plane than the second plane.

5 . The LED lead frame assembly of claim 2 , wherein the heat dissipation member is thermally coupled to a bottom of the pocket of the plastic dam member.

6 . The LED lead frame assembly of claim 2 , wherein a bottom of the pocket of the plastic dam member is formed from the heat dissipation strip.

7 . The LED lead frame assembly of claim 1 , wherein the plastic dam member comprises a thermal-set plastic.

8 . The LED lead frame assembly of claim 1 , wherein a plurality of LED lead frame assemblies are electrically coupled together to form a LED lead frame array.

9 . The LED lead frame assembly of claim 1 , wherein the LED lead frame array assembly is bendable.

10 . A LED light, comprising:
a lighting fixture; and an LED lead frame array attached directly to the lighting fixture, wherein the LED lead frame array comprises one more LED modules, wherein an LED module comprises:
a circuit strip assembly;
a plastic dam member overmoulded onto the circuit strip assembly; and
a LED chip assembly disposed in a pocket of the plastic dam member, wherein the LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

11 . The LED light of claim 10 , wherein the circuit strip assembly comprises a pair of electrically conducting members and a heat dissipation member, the LED chip assembly being electrically coupled to the electrically conducting members and thermally coupled to the heat dissipation member.

12 . The LED light of claim 10 , wherein the lighting fixture comprises a heat sink and the LED lead frame array is attached to the heat sink.

13 . The LED light of claim 12 , wherein the heat sink has a curved shape and the LED lead frame array is bent to conform to the curved shape of the heat sink.

14 . The LED light of claim 10 , wherein the lighting fixture includes a channel, the channel being configured to receive the LED lead frame array.

Assignees

• Ge Lighting Solutions Llc

Inventors

• Kong Ming
• Bisberg Jeffrey
• Powell John

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• F21S4/005

  Mechanical Engineering · mapped topic

• F21V19/005

  by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound · CPC title