Polyamide resin composition and molded article

Patent metadata

Field	Value
Publication number	US-2016177058-A1
Application number	US-201514972823-A
Country	US
Kind code	A1
Filing date	Dec 17, 2015
Priority date	Dec 18, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

[Object]
It is intended to obtain a polyamide resin composition that is excellent in heat aging resistance and exhibits suppressed metal corrosive properties and copper-depositing properties.
[Means of solving the problems]
A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of phosphite compounds represented by the following general formula (1), and phosphonite compounds represented by the following general formula (2):
phosphite compound: (RO) m P(OH) 3-m   (1) and

phosphonite compound: (RO) n O(OH) 2-n (R)  (2)
wherein m represents 1, 2, or 3; n represents 1 or 2; R represents an alkyl group, a phenyl group, or a partially substituted alkyl group or phenyl group; and if each of m and n is 2 or more, a plurality of (RO) groups in the general formulas (1) and (2) are the same or different from each other.

First claim

1 . A polyamide resin composition comprising
a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus (D) compound selected from the group consisting of phosphite compounds represented by the following formula (1), and phosphonite compounds represented by the following formula (2):
phosphite compound: (RO) m P(OH) 3-m   formula (1) and

phosphonite compound: (RO) n P(OH) 2-n R)  formula (2)

wherein m represents 1, 2, or 3; n represents 1 or 2; R represents an aliphatic group, an aromatic group, or a partially substituted aliphatic group or aromatic group; and if each of m and n is 2 or more, a plurality of (RO) groups in the general formulas (1) and (2) are the same or different from each other.

2 . The polyamide resin composition according to claim 1 , wherein the copper compound (B) is a copper halide compound.

3 . The polyamide resin composition according to claim 1 , wherein a molar ratio of a halogen element/a copper element in the polyamide resin composition is 2/1 to 50/1.

4 . The polyamide resin composition according to claim 1 , further comprising at least one fatty acid compound (E) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts.

5 . The polyamide resin composition according to claim 4 , wherein the fatty acid compound (E) has an acid value of 10 mg/g or less.

6 . The polyamide resin composition according to claim 4 , wherein the fatty acid compound (E) is a higher fatty acid metal salt with a metal content of 3.5 to 11.5% by mass.

7 . The polyamide resin composition according to claim 1 , wherein the content of the copper element in the polyamide resin composition is 0.005% by mass or more with respect to the total mass of the polyamide resin composition.

8 . The polyamide resin composition according to claim 1 , wherein the mass ratio [x/y] of the bromide of alkali metal and/or bromide of alkaline earth metal (C) [x] to the phosphorus compound (D) [y] contained in the polyamide resin composition is 100/1 to 1/100.

9 . The polyamide resin composition according to claim 1 , further comprising an inorganic filler (F).

10 . The polyamide resin composition according to claim 1 , wherein the polyamide resin composition does not cause the deposition of the copper element on the surface of a rolled steel (SS400) after the polyamide resin composition is in contact with the rolled steel at a temperature 30° C. higher than the melting point of the polyamide resin (A) for 12 hours.

11 . A molded article comprising a polyamide resin composition according to claim 1 .

12 . The molded article according to claim 11 , wherein the molded article is a vehicle part.

Assignees

• Asahi Kasei Chemicals Corp

Inventors

• Sakuma Teruaki
• Terada Kazunori

Classifications

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08K3/16

  Halogen-containing compounds · CPC title

• C08K5/098

  Metal salts of carboxylic acids · CPC title

• C08K5/527 Primary

  Cyclic esters · CPC title

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title