Method of detaching sub-substrate from substrate

Patent metadata

Field	Value
Publication number	US-2016176181-A1
Application number	US-201514731537-A
Country	US
Kind code	A1
Filing date	Jun 5, 2015
Priority date	Dec 17, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

A method of detaching a sub-substrate from a substrate includes providing a first sub-substrate attached to a first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction, inserting a separating member between the first sub-substrate and the first substrate to partially detach therebetween, attaching a plurality of pads arranged in a matrix pattern to the first sub-substrate, lifting first pads among the plurality of pads arranged in a third direction crossing the first and second directions, lifting second pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction, and lifting third pads arranged in the second direction.

First claim

What is claimed is:

1 . A method of detaching a sub-substrate from a substrate, the method comprising:
providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction; inserting a separating member between the first sub-substrate and the first substrate to partially detach the first sub-substrate from the first substrate; attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns; lifting first pads among the plurality of pads, the first pads being arranged in a third direction crossing the first and second directions; lifting second pads among the plurality of pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction; and lifting third pads among the plurality of pads, the third pads being arranged in the second direction.

2 . The method as claimed in claim 1 , wherein:
the plurality of pads includes a fixing pad attached to an edge of the first sub-substrate, and the method further comprises:
before lifting the first pads, separating the edge of the first sub-substrate from the first substrate by lifting the fixing pad; and
dropping the fixing pad back on the edge of the first sub-substrate, such that the first sub-substrate contacts the first substrate.

3 . The method as claimed in claim 1 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

4 . The method as claimed in claim 1 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

5 . The method as claimed in claim 1 , further comprising:
providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and combining the first substrate with the second substrate.

6 . The method as claimed in claim 5 , wherein a thickness of the second substrate is about 0.01 mm to about 0.1 mm.

7 . The method as claimed in claim 5 , wherein a thickness of the second sub-substrate is about 0.3 mm to about 0.7 mm.

8 . A method of detaching a sub-substrate from a substrate, the method comprising:
providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction; inserting a separating member between the first sub-substrate and the first substrate to partially detach the first-sub substrate from the first substrate; attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns; substantially simultaneously lifting first pads and second pads among the plurality of pads, the first pads being adjacent to a first edge and being arranged in a third direction crossing the first and the second directions, and the second pads being adjacent to a second edge and being arranged in the third direction.

9 . The method as claimed in claim 8 , wherein:
the plurality of pads includes a first fixing pad attached to the first edge of the first sub-substrate, and a second fixing pad attached to the second edge of the first sub-substrate, and the method further comprises:
before lifting the first and second pads, separating the first and second edges of the first sub-substrate from the first substrate by lifting the first fixing pad and the second fixing pad; and
dropping the first and second fixing pads back on the first and second edges of the first sub-substrate, respectively, such that the first and second sub-substrates contact the first and second substrates, respectively.

10 . The method as claimed in claim 8 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

11 . The method as claimed in claim 8 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

12 . The method as claimed in claim 8 , further comprising:
providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and joining the first substrate with the second substrate.

13 . A method of detaching a sub-substrate from a substrate, the method comprising:
providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction; inserting a separating member between the first sub-substrate and the first substrate to partially detach the first sub-substrate from the first substrate: attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns; substantially simultaneously lifting first pads and second pads among the plurality of pads, the first pads being adjacent to a first edge and being arranged in a third direction crossing the first and second directions, and the second pads being adjacent to a second edge and being arranged in the third direction; and substantially simultaneously lifting third pads and fourth pads among the plurality of pads, the third pads being adjacent to the first edge, some of the third pads being arranged in the second direction, other of the third pads being arranged in the third direction, the fourth pads being adjacent to the second edge, some of the fourth pads being arranged in the second direction, and other of the fourth pads being arranged in the third direction.

14 . The method as claimed in claim 13 , wherein:
the plurality of pads includes a first fixing pad attached to the first edge of the first sub-substrate and a second fixing pad attached to the second edge of the first sub-substrate, and the method further comprises:
before lifting the first and second pads, separating the first and second edges of the first sub-substrate from the first substrate by lifting the first fixing pad and the second fixing pad; and
dropping the first and second fixing pads back on the first and second edges of the first sub-substrate, respectively, such that the first and second sub-substrates contact the first and second substrates, respectively.

15 . The method as claimed in claim 13 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

16 . The method as claimed in claim 13 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

17 . The method as claimed in claim 13 , further comprising:
providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and joining the first substrate with the second substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Tae-Hwan
• Na Man-Hong
• Lee Jong-Hwan

Classifications

• B32B43/006 Primary

  Delaminating · CPC title

• B32B38/10 Primary

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• Y10T156/1967

  Cutting delaminating means · CPC title

• Y10T156/1989

  Corner edge bending delaminating means · CPC title

• Y10T156/1944

  Vacuum delaminating means [e.g., vacuum chamber, etc.] · CPC title