Electroporation of tissue products
US-2015343101-A1 · Dec 3, 2015 · US
US2016174553A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016174553-A1 |
| Application number | US-201414578379-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 20, 2014 |
| Priority date | Dec 20, 2014 |
| Publication date | Jun 23, 2016 |
| Grant date | — |
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Various embodiments disclosed relate to a composition that includes (or is formed from): (a) hydrogen peroxide; (b) an organic acid; (c) chelator; and (d) surfactant, wherein the composition includes less than about 0.1 wt. % of an anticorrosive agent. Kits that include the composition, as well as methods of using the composition (e.g., as a disinfectant) are provided.
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1 . A composition comprising: a. hydrogen peroxide; b. organic acid; c. chelator; and d. surfactant, wherein the composition comprises less than about 0.1 wt. % of an anticorrosive agent. 2 . The composition of claim 1 , wherein the composition further comprises peracetic acid. 3 . The composition of claim 1 , wherein the composition further comprises peracetic acid formed by the reaction of acetic acid with hydrogen peroxide. 4 . The composition of claim 1 , wherein the composition further comprises peracetic acid, present in about 5.0 wt. % to about 10.0 wt. % of the composition. 5 . The composition of claim 1 , wherein the balance (q.s.) of the composition is water. 6 . The composition of claim 1 , which is a liquid disinfectant. 7 . The composition of claim 1 , comprising less than about 0.1 wt. % buffer. 8 . The composition of claim 1 , wherein the hydrogen peroxide is present in about 10 wt. % to about 50 wt. % of the composition. 9 . The composition of claim 1 , wherein the organic acid comprises acetic acid. 10 . The composition of claim 1 , wherein the organic acid comprises acetic acid, present in at least about 3 wt. % of the composition. 11 . The composition of claim 1 , wherein the chelator comprises Dequest® 2010 (1-hydroxyethylidene-1,1,-diphosphonic acid, HEDP). 12 . The composition of claim 1 , wherein the chelator comprises Dequest® 2010 (1-hydroxyethylidene-1,1,-diphosphonic acid, HEDP), present in at least about 0.1 wt. % of the composition. 13 . The composition of claim 1 , wherein the surfactant comprises Pluronic® 10R5 surfactant block copolymer. 14 . The composition of claim 1 , wherein the surfactant comprises Pluronic® 10R5 surfactant block copolymer, present in at least about 0.1 wt. % of the composition. 15 . A composition comprising: a. hydrogen peroxide, present in a concentration of about 28 wt. %; b. acetic acid, present in a concentration of about 16 wt. %; c. Dequest® 2010, present in a concentration of about 1.0 wt. %; and d. Pluronic® 10R5 surfactant block copolymer, present in a concentration of about 2.0 wt. %; wherein the composition comprises less than about 0.1 wt % of an anticorrosive agent. 16 . The composition of claim 15 , wherein the balance (q.s.) of the composition is water. 17 . The composition of claim 15 , wherein the balance (q.s.) of the composition is deionized water. 18 . The composition of claim 15 , wherein the composition further comprises peracetic acid, present in about 6.8 wt. % to about 7.5 wt. % of the composition. 19 . A composition comprising: a. hydrogen peroxide, present in a concentration of about 20 wt. % to about 26.0 wt. %; b. acetic acid, present in a concentration of about 9.0 to about 11.0 wt. %; c. peracetic acid, present in about 6.8 wt. % to about 7.5 wt. % of the composition; d. Dequest® 2010, present in a concentration of about 1.0 wt. %; and e. Pluronic® 10R5 surfactant block copolymer, present in a concentration of about 2.0 wt. %; wherein the composition comprises less than about 0.1 wt. % of an anticorrosive agent. 20 . The composition of claim 19 , wherein the balance (q.s.) of the composition is deionized water. 21 . A method of reducing the number of microbes located upon a substrate, the method comprising contacting the substrate with an effective amount of a composition comprising: a. hydrogen peroxide; b. organic acid; c. chelator; and d. surfactant wherein the composition comprises less than about 0.1 wt. % of an anticorrosive agent, for a sufficient period of time, effective to reduce the number of microbes located upon the substrate. 22 . The method of claim 21 , wherein the microbe or microorganism comprises at least one of a virus, fungus, mold, slime mold, algae, yeast, mushroom and bacterium. 23 . The method of claim 21 , wherein the substrate is a medical device. 24 . The method of claim 21 , wherein the substrate is an endoscope. 25 . The method of claim 21 , wherein up to about 7.12 logs of desired microorganism is inactivated in about 5 minutes, or less. 26 . The method of claim 21 , wherein up about 7.12 logs of Mycobacterium terrae is inactivated in about 5 minutes, or less. 27 . The method of claim 21 , wherein about 1 wt. % of the composition is employed, in combination with about 99 wt. % carrier. 28 . The method of claim 21 , wherein about 1 wt. % of the composition is employed, in combination with about 99 wt. % water.
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