Pcm cooling

Patent metadata

Field	Value
Publication number	US-2016174418-A1
Application number	US-201414906300-A
Country	US
Kind code	A1
Filing date	Oct 22, 2014
Priority date	Nov 29, 2013
Publication date	Jun 16, 2016
Grant date	—

Abstract

Temperature and threshold parameters relating to the cooling system are received. A control condition suitable for the cooling system is determined. If the ambient temperature is lower than the first temperature threshold, the working fluid passage between the free cooling device and the system to be cooled and the working fluid passage between the free cooling device and the PCM cooling device are turned on, in addition to the PCM cooling device is set into the first working mode. If the ambient temperature, AT, is higher than the second temperature threshold and the temperature of the PCM material is lower than the melted state temperature threshold, the working fluid passage between the PCM cooling device and the system to be cooled is turned on, the working fluid passages relating to the free cooling device is turned off, and the PCM cooling device is set into the second working mode.

First claim

1 . A cooling device comprising:
a cooling tank with one or more sidewalls; a tube filled with Phase Change Material (PCM) material, arranged in the cooling tank; an inlet module, configured to introduce working fluid from a free cooling device in a first working mode, and to introduce working fluid from a system to be cooled in a second working mode; a distribution system used to distribute the working fluid introduced from the inlet module, such that it is in contact with the tube; and an outlet module, configured to discharge the working fluid having contacted with the tube into the free cooling device in the first working mode, and to discharge the working fluid having contacted with the tube into the system to be cooled in the second working mode.

2 . The cooling device of claim 1 , further comprising an air inlet arranged on one sidewall of the cooling tank, for introducing outside air into the cooling tank in the first working mode.

3 . The cooling device of claim 1 , wherein the cooling tank includes at least two opposing sidewalls, the cooling device further comprising:
holes formed through the opposing sidewalls to support the tube; and protection covers are arranged on the outside of the opposing sidewalls to cover the ends of the tube extending out of the cooling tank.

4 . The cooling device of claim 1 , wherein the distribution system comprises at least one of:
a plurality of nozzles, for spraying the working fluid onto the surface of the tube; and slender fluid pipes filled with working fluid, twining on the surface of the tube.

5 . The cooling device of claim 1 , further comprising support ribs attached to the bottom of the cooling tank for supporting the tube, wherein the support ribs have through-holes formed therein to facilitate air flow in the cooling tank.

6 . The cooling device of claim 1 , wherein the inlet module comprises a first fluid inlet which is connected to the free cooling device and is open in the first working mode and closed in the second working mode, and a second fluid inlet which is connected to the system to be cooled and is closed in the first working mode and open in the second working mode.

7 . A cooling system comprising:
a free cooling device for providing cooled working fluid in a predetermined temperature condition;
a working fluid passage connecting the free cooling device and a PCM cooling device in parallel with a system to be cooled;
a working fluid passage connecting a fluid outlet of the free cooling device with an inlet module of the PCM cooling device;
a working fluid passage connecting a fluid inlet of the free cooling device with an outlet module of the PCM cooling device; and
passage control components for controlling a plurality of working fluid passages by turning on and turning off the plurality of working fluid passages.

8 . The cooling system of claim 7 , wherein the cooling system includes a compression-type cooling device, the plurality of working fluid passages further comprising:
a working fluid passage connecting the compression-type cooling device, together with the free cooling device and the PCM cooling device in parallel, to the system to be cooled.

9 . A method comprising:
receiving temperature parameters and threshold parameters relating to a PCM cooling device, wherein the temperature parameters comprise ambient temperature, AT, and a temperature, T p , of a PCM material in the PCM cooling device, and the threshold parameters comprise:
a first temperature threshold, T 1 , representing an ambient temperature required for solidification of the PCM material in the PCM cooling device;
a second temperature threshold, T 2 , representing an ambient temperature required for proper functioning of a free cooling device;
a solidified state temperature threshold, T s1 , indicating that the PCM material is in a solid state; and
a melted state temperature threshold, T s2 , indicating that the PCM material is in a liquid state;
comparing the temperature parameters with the threshold parameters to determine a control condition suitable for the PCM cooling device; responsive to determining that the ambient temperature, AT, is lower than the first temperature threshold, T 1 , turning on a working fluid passage between the free cooling device and the system to be cooled, turning on a working fluid passage between the free cooling device and the PCM cooling device, and setting the PCM cooling device into a first working mode; and responsive to determining that the ambient temperature, AT, is higher than the second temperature threshold, T 2 , and the temperature, T p , of the PCM material is lower than the melted state temperature threshold, T s2 , turning on a working fluid passage between the PCM cooling device and a system to be cooled, turning off a working fluid passages relating to the free cooling device, and setting the PCM cooling device into a second working mode.

10 . The method of claim 9 , wherein during setting the PCM cooling device into the first working mode, the change of the temperature, T p , of the PCM material is monitored; and
responsive to determining that the temperature, T p , is lower than the solidified state temperature threshold, T s1 , an operation of the PCM cooling device is stopped.

11 . The method of claim 9 , wherein responsive to determining that the ambient temperature, AT, is higher than the first temperature threshold, T 1 , and lower than the second temperature threshold, T 2 , the method further comprising:
turning on the working fluid passage between the free cooling device and the system to be cooled, and turning off the working fluid passages relating to the PCM cooling device.

12 . The method according to claim 9 , wherein the cooling system includes a compression-type cooling device that is connected, together with the free cooling device and the PCM cooling device in parallel, to the system to be cooled, the method further comprising:
responsive to determining that the ambient temperature, AT, is higher than the second temperature threshold, T 2 , and the temperature, T p , of the PCM material is higher than the melted state temperature threshold, T s2 , turning on a working fluid passage between the compression-type cooling device and the system to be cooled, and turning off the working fluid passages relating to the PCM cooling device and the free cooling device.

13 . The method of claim 9 , wherein the temperature parameters comprise an actual temperature, T in , of the system to be cooled, the threshold parameters comprise a set cooling temperature, T set , of the system to be cooled, the method further comprising:
responsive to determining that T in is lower than T set , decreasing cooling efficiency of the cooling device connected operatively to the system to be cooled; and responsive to determining that T in is higher than T set , increasing a cooling efficiency of the cooling device connected operatively to the system to be cooled.

14 . The method of claim 13 , wherein the cooling system includes a compression-type cooling device that is connected, together with the free cooling device and the PCM cooling device in parallel, to the system to be cooled, further comprising:
responsive to determining that the cooling efficiency of the cooling device connected operatively to the system to be cooled has been adjusted to the maximum value but T in is still higher than T set , turning on the working fluid passage between a compression-type cooling device and the system to be cooled.

15 . (canceled)

Assignees

• IBM

Inventors

• He yong lin
• Wang Xue Feng

Classifications

• F28D20/021

  the latent heat storage material and the heat-exchanging means being enclosed in one container (F28D20/023 - F28D20/028 take precedence) · CPC title

• H05K7/20827

  within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D7/0008

  the conduits for one medium being in heat conductive contact with the conduits for the other medium · CPC title

• H05K7/208

  Liquid cooling with phase change · CPC title