Conductive substrate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016174383-A1
Application number	US-201414909357-A
Country	US
Kind code	A1
Filing date	Aug 18, 2014
Priority date	Aug 16, 2013
Publication date	Jun 16, 2016
Grant date	—

Abstract

Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.

First claim

1 . A method for preparing a conducting substrate, comprising:
a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.

2 . The method of claim 1 , wherein the conducting layer is a patterned conducting layer.

3 . The method of claim 1 , wherein step a) comprises:
forming the conducting layer on a substrate and patterning the conducting layer.

4 . The method of claim 1 , wherein the conducting layer comprises a transparent conducting oxide.

5 . The method of claim 4 , wherein the transparent conducting oxide is an oxide including one or more selected from indium (In), tin (Sn), zinc (Zn), gallium (Ga), cerium (Ce), cadmium (Cd), magnesium (Mg), beryllium (Be), silver (Ag), molybdenum (Mo), vanadium (V), copper (Cu), iridium (Ir), rhodium (Rh), ruthenium (Ru), tungsten (W), cobalt (Co), nickel (Ni), manganese (Mn), aluminum (Al), and lanthanum (La).

6 . The method of claim 2 , wherein step b) comprises:
forming the metal layer on the entire surface of the substrate and the patterned conducting layer.

7 . The method of claim 1 , wherein the metal layer is a single layer or a multilayer including silver, aluminum, copper, neodymium, molybdenum, chromium, or an alloy thereof.

8 . The method of claim 1 , wherein the method of forming the insulating layer pattern uses a printing method, a photolithography method, a photography method, a method using a mask, or laser transfer.

9 . The method of claim 1 , wherein a taper angle of the insulating layer pattern is more than 0° and less than 90°.

10 . The method of claim 1 , wherein during an over-etching process of the metal layer, an undercut is formed below the edge of the insulating layer pattern.

11 . The method of claim 2 , wherein at the end of the patterned conducting layer, at least a part of the insulating layer pattern is formed to contact the substrate.

12 . A conducting substrate, comprising:
a substrate; a conducting pattern formed on the substrate; a metal layer pattern formed on the conducting pattern; and an insulating layer pattern covering the metal layer pattern.

13 . The conducting substrate of claim 12 , wherein the conducting pattern includes a transparent conducting oxide.

14 . The conducting substrate of claim 12 , wherein the transparent conducting oxide is an oxide including one or more selected from indium (In), tin (Sn), zinc (Zn), gallium (Ga), cerium (Ce), cadmium (Cd), magnesium (Mg), beryllium (Be), silver (Ag), molybdenum (Mo), vanadium (V), copper (Cu), iridium (Ir), rhodium (Rh), ruthenium (Ru), tungsten (W), cobalt (Co), nickel (Ni), manganese (Mn), aluminum (Al), and lanthanum (La).

15 . The conducting substrate of claim 12 , wherein the metal layer pattern includes silver, aluminum, copper, neodymium, molybdenum, chromium, or an alloy thereof.

16 . The conducting substrate of claim 12 , wherein at the end of the conducting layer, at least a part of the insulating layer pattern has a structure to contact the substrate.

17 . A display device including the conducting substrate of claim 12 .

18 . An illumination device including the conducting substrate of claim 12 .

Assignees

• Lg Chemical Ltd

Inventors

• Kang Minsoo
• Park Hyunsik
• Moon Young Kyun

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• H05K2201/10128

  Display · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title