Novel compound

US2016170302A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016170302-A1
Application numberUS-201615053246-A
CountryUS
Kind codeA1
Filing dateFeb 25, 2016
Priority dateJun 24, 2011
Publication dateJun 16, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R 1 and R 2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R 1 and R 2 may be bonded to form a ring structure and may contain a hetero atom bond. R 3 represents a single bond or an organic group. R 4 to R 9 each independently represents a hydrogen atom, an organic group, etc., but R 6 and R 7 are not hydroxyl groups. R 10 represents a hydrogen atom or an organic group.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for generating a base by irradiating with an electromagnetic wave, or by heating, a compound represented by the following formula (1): wherein R 1 and R 2 each independently represents a hydrogen atom or an organic group, provided that at least one of R 1 and R 2 represents an organic group; R 1 and R 2 may be bonded to form a ring structure and may contain a hetero atom bond; R 3 represents a single bond or an organic group; R 4 and R 5 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an organic group; R 6 , R 2 , R 8 , and R 9 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or an organic group, provided that R 6 and R 2 are not hydroxyl groups; two or more of R 6 , R 7 , R 8 , and R 9 may be bonded to form a ring structure and may contain a hetero atom bond; and R 10 represents a hydrogen atom or an organic group. 2 . A method for enhancing adhesion between a negative-type photosensitive resin composition and a substrate using a compound represented by the following formula (1): wherein R 1 and R 2 each independently represents a hydrogen atom or an organic group, provided that at least one of R 1 and R 2 represents an organic group; R 1 and R 2 may be bonded to form a ring structure and may contain a hetero atom bond; R 3 represents a single bond or an organic group; R 4 and R 5 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an organic group; R 6 , R 7 , R 8 , and R 9 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or an organic group, provided that R 6 and R 7 are not hydroxyl groups; two or more of R 6 , R 7 , R 8 , and R 9 may be bonded to form a ring structure and may contain a hetero atom bond; and R 10 represents a hydrogen atom or an organic group.

Assignees

Inventors

Classifications

  • G03F7/085Primary

    Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives (G03F7/075 takes precedence) · CPC title

  • with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

  • having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a six-membered aromatic ring · CPC title

  • from carboxylic acids or from esters, anhydrides, or halides thereof by reaction with ammonia or amines · CPC title

  • Organic compounds not covered by group G03F7/029 · CPC title

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What does patent US2016170302A1 cover?
A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R 1 and R 2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R 1 and R 2 may be bo…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd, Daicel Corp
What technology area does this patent fall under?
Primary CPC classification G03F7/085. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jun 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).