A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
US2016168716A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016168716-A1 |
| Application number | US-201414903942-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 9, 2014 |
| Priority date | Jul 9, 2013 |
| Publication date | Jun 16, 2016 |
| Grant date | — |
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Plated polymeric articles having a composite layup structure and method of making the same are disclosed. A plated polymeric article comprises a composite layup having first and second polymer layers. The plated polymeric article further comprises a first metal plated onto the polymer. Additionally, methods for fabricating a plated polymeric article are disclosed. A composite layup is provided and compression molded into a desired shape having an outer surface. The outer surface of the article is prepared to receive a catalyst and then is activated with the catalyst. A first metallic layer is then plated onto the outer surface.
Opening claim text (preview).
What is claimed is: 1 . A plated polymeric article, comprising: a composite layup, the composite layup having a first layer and a second layer, the first layer comprising a first polymer, the second layer comprising a second polymer, the composite layup formed into a desired shape having an outer surface; a first metal plated onto the outer surface to form a structure; and a second metal deposited onto the structure. 2 . The plated polymeric article of claim 1 wherein the first polymer is selected from the group consisting of polyetherimide (PEI), polyimide, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polysulfone, nylon, polyphenylsulfide, and polyester. 3 . The plated polymeric article of claim 1 wherein the second polymer is selected from the group consisting of polyetherimide (PEI), polyimide, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polysulfone, nylon, polyphenylsulfide, and polyester. 4 . The plated polymeric article of claim 1 wherein the composite layup further comprises reinforcing fiber. 5 . The plated polymeric article of claim 4 wherein the reinforcing fiber is selected from the group consisting of carbon-fiber and glass-fiber. 6 . The plated polymeric article of claim 1 wherein the first metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 7 . The plated polymeric article of claim 1 wherein the first metal has a thickness ranging from about 0.1 to about 10 microns. 8 . The plated polymeric article of claim 1 wherein the second metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 9 . The plated polymeric article of claim 1 wherein the second metal has a thickness ranging from about 0.1 to about 10 microns. 10 . A method for fabricating a plated polymeric article, the method comprising: providing a composite layup; compression molding the composite layup into a desired shape having an outer surface; preparing the outer surface to receive a catalyst; activating the outer surface with the catalyst; and plating a first metal onto the outer surface and the catalyst to form a first layer to form a structure. 11 . The method of claim 10 further including depositing a second metal onto the structure. 12 . The method of claim 11 further including alloying the structure. 13 . The method of claim 12 wherein the alloying is a process selected from the group consisting of transient liquid phase (TLP) bonding, brazing, diffusion bonding, heat treating and combinations thereof. 13 . The method of claim 10 wherein the preparing of the outer surface to receive the catalyst includes a process selected from the group consisting of etching, abrading, reactive ion etching, ionic activation, and deposition of a conductive material. 14 . The method of claim 10 wherein the catalyst is selected from the group consisting of palladium, platinum, gold, and combinations thereof. 15 . The method of claim 10 wherein the catalyst is deposited on the outer surface in an atomic layer thickness. 16 . The method of claim 10 wherein the first metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 17 . The method of claim 10 wherein the first layer has a thickness ranging from about 0.1 to about 10 microns. 18 . The method of claim 10 wherein the composite layup comprises reinforcing fiber. 19 . The plated polymeric article of claim 18 wherein the reinforcing fiber is selected from the group consisting of carbon-fiber and glass-fiber. 20 . A method for fabricating a plated polymeric article, the method comprising: providing a composite layup having reinforcing fiber; compression molding the composite layup into a desired shape having an outer surface; activating the outer surface with palladium; electroless plating nickel onto the outer surface and palladium having a thickness ranging from about 2.54 to about 1270 microns to form a first layer; and electrolytically plating copper onto the first layer to form a second layer.
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