Plated polymer composite molding

US2016168716A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016168716-A1
Application numberUS-201414903942-A
CountryUS
Kind codeA1
Filing dateJul 9, 2014
Priority dateJul 9, 2013
Publication dateJun 16, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Plated polymeric articles having a composite layup structure and method of making the same are disclosed. A plated polymeric article comprises a composite layup having first and second polymer layers. The plated polymeric article further comprises a first metal plated onto the polymer. Additionally, methods for fabricating a plated polymeric article are disclosed. A composite layup is provided and compression molded into a desired shape having an outer surface. The outer surface of the article is prepared to receive a catalyst and then is activated with the catalyst. A first metallic layer is then plated onto the outer surface.

First claim

Opening claim text (preview).

What is claimed is: 1 . A plated polymeric article, comprising: a composite layup, the composite layup having a first layer and a second layer, the first layer comprising a first polymer, the second layer comprising a second polymer, the composite layup formed into a desired shape having an outer surface; a first metal plated onto the outer surface to form a structure; and a second metal deposited onto the structure. 2 . The plated polymeric article of claim 1 wherein the first polymer is selected from the group consisting of polyetherimide (PEI), polyimide, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polysulfone, nylon, polyphenylsulfide, and polyester. 3 . The plated polymeric article of claim 1 wherein the second polymer is selected from the group consisting of polyetherimide (PEI), polyimide, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polysulfone, nylon, polyphenylsulfide, and polyester. 4 . The plated polymeric article of claim 1 wherein the composite layup further comprises reinforcing fiber. 5 . The plated polymeric article of claim 4 wherein the reinforcing fiber is selected from the group consisting of carbon-fiber and glass-fiber. 6 . The plated polymeric article of claim 1 wherein the first metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 7 . The plated polymeric article of claim 1 wherein the first metal has a thickness ranging from about 0.1 to about 10 microns. 8 . The plated polymeric article of claim 1 wherein the second metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 9 . The plated polymeric article of claim 1 wherein the second metal has a thickness ranging from about 0.1 to about 10 microns. 10 . A method for fabricating a plated polymeric article, the method comprising: providing a composite layup; compression molding the composite layup into a desired shape having an outer surface; preparing the outer surface to receive a catalyst; activating the outer surface with the catalyst; and plating a first metal onto the outer surface and the catalyst to form a first layer to form a structure. 11 . The method of claim 10 further including depositing a second metal onto the structure. 12 . The method of claim 11 further including alloying the structure. 13 . The method of claim 12 wherein the alloying is a process selected from the group consisting of transient liquid phase (TLP) bonding, brazing, diffusion bonding, heat treating and combinations thereof. 13 . The method of claim 10 wherein the preparing of the outer surface to receive the catalyst includes a process selected from the group consisting of etching, abrading, reactive ion etching, ionic activation, and deposition of a conductive material. 14 . The method of claim 10 wherein the catalyst is selected from the group consisting of palladium, platinum, gold, and combinations thereof. 15 . The method of claim 10 wherein the catalyst is deposited on the outer surface in an atomic layer thickness. 16 . The method of claim 10 wherein the first metal is selected from the group consisting of nickel, copper, gold, silver, graphite and combinations thereof. 17 . The method of claim 10 wherein the first layer has a thickness ranging from about 0.1 to about 10 microns. 18 . The method of claim 10 wherein the composite layup comprises reinforcing fiber. 19 . The plated polymeric article of claim 18 wherein the reinforcing fiber is selected from the group consisting of carbon-fiber and glass-fiber. 20 . A method for fabricating a plated polymeric article, the method comprising: providing a composite layup having reinforcing fiber; compression molding the composite layup into a desired shape having an outer surface; activating the outer surface with palladium; electroless plating nickel onto the outer surface and palladium having a thickness ranging from about 2.54 to about 1270 microns to form a first layer; and electrolytically plating copper onto the first layer to form a second layer.

Assignees

Inventors

Classifications

  • Blades, e.g. for helicopters · CPC title

  • of short lengths, e.g. chopped filaments, staple fibres or bristles · CPC title

  • 2 layers · CPC title

  • Dumb-bell specimens · CPC title

  • using electric or magnetic means (G01D5/06 takes precedence) · CPC title

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What does patent US2016168716A1 cover?
Plated polymeric articles having a composite layup structure and method of making the same are disclosed. A plated polymeric article comprises a composite layup having first and second polymer layers. The plated polymeric article further comprises a first metal plated onto the polymer. Additionally, methods for fabricating a plated polymeric article are disclosed. A composite layup is provided …
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification C23C18/1653. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jun 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).