Additive For A Silicone Encapsulant

Patent metadata

Field	Value
Publication number	US-2016168359-A1
Application number	US-201414906575-A
Country	US
Kind code	A1
Filing date	Feb 9, 2014
Priority date	Sep 3, 2013
Publication date	Jun 16, 2016
Grant date	—

Abstract

An additive for a silicone encapsulant has the structure: (I) R 1 Ce(OSi—R 2 ) I I a R 3 wherein a is 3 or 4, wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.

First claim

1 . An additive for a silicone encapsulant, said additive having the structure:

wherein subscript a is 3 or 4,
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups.

2 . The additive of claim 1 wherein at least 20 mol percent of a total of the groups R 3 -R 6 are methyl groups.

3 . The additive of claim 1 wherein at least 20 mol percent of a total of the groups R 3 -R 6 are phenyl groups.

4 . The additive of claim 1 wherein each R 3 , R 4 , and R 6 is a methyl group.

5 . The additive of claim 1 wherein each R 3 , R 4 , and R 6 is a phenyl group.

6 . The additive of claim 1 that is further defined as having the structure:

wherein Me is methyl.

7 . The additive of claim 1 that is further defined as having the structure:

wherein Me is methyl.

8 . The additive of claim 1 that is further defined as having the structure:

wherein Me is methyl and Ph is phenyl.

9 . The additive of any preceding claim that is further defined as:
a reaction product of a reaction of a cerium alkoxide and a hydroxyl functional organosiloxane; or a reaction product of a reaction of cerium ammonium nitrate and a hydroxyl functional organosiloxane; or a reaction product of a reaction of cerium metal and a hydroxyl functional organosiloxane; or an exchange reaction product of a reaction of a trifunctional silyloxy cerium (III) or (IV) compound and a hydroxyl functional organosiloxane.

10 . The additive of claim 9 wherein the hydroxyl functional organosiloxane has the formula M 1 D R,OH M 2 , wherein R is chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups

11 . The additive of claim 1 having a density of from 0.95 to 1.2 g/cm 3 .

12 . The additive of claim 1 that is free of an alkaline metal salt and/or alkaline earth metal salt.

13 . The additive of claim 1 that comprises 3 to 25 weight percent of cerium based on a total weight of said additive.

14 . A cerium silyloxide cluster comprising 2 to 10 units of the additive of claim 1 .

15 . A silicone encapsulant comprising said additive of claim 1 and a silicone.

16 . A silicone encapsulant comprising:
A. an additive having the structure:

wherein subscript a is 3 or 4,
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups; and
B. a polyorganosiloxane.

17 . A device comprising an optoelectronic component and said encapsulant of claim 16 .

18 . A method of making an additive having the structure:

wherein subscript a is 3 or 4,
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups,
wherein the method comprises the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane.

Assignees

• Dow Corning

Inventors

• Kleyer Don L
• Nishida Fumito
• Schmidt Randall G
• Tomasik Adam C

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C08K9/10

  Encapsulated ingredients · CPC title

• C08K5/5419 Primary

  containing at least one Si—C bond · CPC title

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title