Thermal interface material and method for manufacturing thermal interface material

Patent metadata

Field	Value
Publication number	US-2016168037-A1
Application number	US-201514798515-A
Country	US
Kind code	A1
Filing date	Jul 14, 2015
Priority date	Dec 10, 2014
Publication date	Jun 16, 2016
Grant date	—

Abstract

A method for manufacturing a thermal interface material is provided. The thermal interface material including a thermal conductive filler, a polymer matrix having an elastic force and applied to the thermal conductive filler, and an insulating coating layer applied to sides of the thermal conductive filler and the polymer matrix may be manufactured by: providing the thermal conductive filler in a plate film form as a filler material forming the thermal conductive filler is dissolved in a solvent; and coating the thermal conductive filler in a plate film form with the polymer matrix. As such, the high heat radiation thermal interface material (a maximum of thermal conductivity of 20 W/mK) may be manufactured in more various thickness than the conventional thermal interface material (a maximum of thermal conductivity of 5 W/mK).

First claim

What is claimed is:

1 . A method for manufacturing a thermal interface material that includes a thermal conductive filler, a polymer matrix having an elastic force and applied to the thermal conductive filler, and an insulating coating layer applied to sides of the thermal conductive filler and the polymer matrix, comprising:
providing the thermal conductive filler in a plate film form; and coating the thermal conductive filler in the plate film form with the polymer matrix, wherein the thermal conductive filler is formed by dissolving a filler material in a solvent.

2 . The method according to claim 1 , wherein the thermal conductive filler is provided by extruding.

3 . The method according to claim 1 , further comprising:
forming the insulating coating layer by spraying a liquid having the same component as the polymer matrix on the sides of the polymer matrix and the thermal conductive filler.

4 . The method according to claim 1 , wherein the polymer matrix is made of any one of styrene-based thermoplastic elastomer (TPE), olefin-based thermoplastic elastomer, polyester-based thermoplastic elastomer, and polyamide-based thermoplastic elastomer.

5 . The method according to claim 1 , wherein the polymer matrix is made of any one of styrene-butadiene-styrene (SBS) block copolymer, styrene-butadiene-ethylene-styrene (SBES) block copolymer, styrene-isoprene-styrene block copolymer (SIS).

6 . The method according to claim 1 , wherein the thermal conductive filler comprises at least one of carbon black, graphite, expanded graphite granule (EGG), graphene and grahphne oxide.

7 . The method according to claim 6 , wherein thermal conductive filler is contained at a content of about 20-65 wt %, based on the total weight of the thermal interface material.

8 . The method according to claim 6 , wherein thermal conductive filler further includes any one selected from the group consisting of carbon nanotube(CNT) and carbon fiber(CF).

9 . The method according to claim 8 , wherein the CNT or the CF may be contained at a content of about 0-20 wt %, based on the total weight of the thermal interface material.

10 . The method according to claim 8 , wherein the CNT or the CF is embedded in the thermal conductive filler to provide directivity.

11 . The method according to claim 1 , wherein the solvent is a same component of the polymer matrix.

12 . A thermal interface material, comprising:
a thermal conductive filler; a polymer matrix configured to have an elastic force and applied to the thermal conductive filler; and an insulating coating layer applied to sides of the thermal conductive filler and the polymer matrix.

13 . The thermal interface material according to claim 12 , wherein the thermal conductive filler is formed in a film shape and the polymer matrix is coated on the thermal conductive filler.

14 . The thermal interface material according to claim 12 , wherein the insulating coating layer is made of the same component as the polymer matrix.

15 . The thermal interface material according to claim 9 , wherein the thermal conductive filler comprises at least one of carbon black, graphite, and expanded graphite granule (EGG), graphene and grahphne oxide.

16 . The thermal interface material according to claim 15 , wherein thermal conductive filler is contained at a content of about 20-65 wt %, based on the total weight of the thermal interface material.

17 . The thermal interface material according to claim 15 , wherein thermal conductive filler further includes any one selected from the group consisting of carbon nanotube(CNT) and carbon fiber(CF).

18 . The thermal interface material according to claim 17 , wherein the CNT or the CF may be contained at a content of about 0-20 wt %, based on the total weight of the thermal interface material.

19 . A high heat radiation composite sheet including a thermal interface material including a thermal conductive filler and a polymer matrix coated on the thermal conductive filler.

Assignees

• Hyundai Motor Co Ltd

Inventors

• Chu In Chang
• Jeon Yoon Cheol
• Park Hyun Dal
• Kim Gyung Bok
• Lee Seung Jae
• Lyo In Woong

Classifications

• C08K3/041

  Carbon nanotubes · CPC title

• C08K3/042

  Graphene or derivatives, e.g. graphene oxides · CPC title

• C08K7/06

  Elements · CPC title

• C04B35/52 Primary

  based on carbon, e.g. graphite · CPC title

• B29C41/20

  incorporating preformed parts or layers, e.g. moulding inserts or for coating articles · CPC title