Apparatuses and Methods For Seaming Substrates

US2016167354A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016167354-A1
Application numberUS-201615049165-A
CountryUS
Kind codeA1
Filing dateFeb 22, 2016
Priority dateFeb 22, 2012
Publication dateJun 16, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed to join the substrate portions together at the overlap area.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for forming a seam, the method comprising the steps of: rotating a heating cylinder about an axis of rotation, the forming cylinder comprising a plurality of fluid outlets disposed about a periphery of the heating cylinder, wherein each of the plurality of fluid outlets are in communication with a fluid chamber; advancing a first substrate in a machine direction on the forming cylinder; advancing a second substrate in the machine direction wherein the first substrate is between the second substrate and the forming cylinder; heating a fluid within the fluid chamber to a temperature sufficient to at least partially melt the substrates; directing a jet of the heated fluid through the fluid outlet and onto an overlap area of the first and second substrates; partially melting the overlap area; advancing the first and second substrates to a nip formed between an anvil cylinder and a pressure applying cylinder; rotating the anvil cylinder and the pressure applying cylinder; and compressing the overlap area in a nip between the pressure applying member and the anvil cylinder. 2 . The method of claim 1 , comprising the step of wrapping the first and second substrates around at least a portion of the rotating heating cylinder. 3 . The method of claim 1 , wherein the pressure applying cylinder comprises an outer circumferential surface, wherein a pressure applying member is disposed about the outer circumferential surface of the pressure applying cylinder. 4 . The method of claim 1 , wherein the separation distance between the periphery of the heating cylinder and the first substrate is no greater than about 5 mm. 5 . The method of claim 1 , wherein the jet of heated fluid is at a temperature ranging from a lower melting point of the first and second substrates minus 30° C. to the lower melting point of the first and second substrates plus 100° C. 6 . The method of claim 1 , wherein the jet of heated fluid is directed at the first and second substrates at a pressure in the range of about 0.1×10 5 Newtons per square meter to about 1×10 6 Newtons per square meter. 7 . The method of claim 1 , wherein the fluid is ambient air. 8 . The method of claim 1 , wherein the jet of the heating fluid is directed at the overlap area for between about 5 milliseconds and about 2000 milliseconds. 9 . The method of claim 1 , wherein the compressing step cuts the overlap area. 10 . A disposable absorbent article made according to the method of claim 1 . 11 . The method of claim 1 , comprising advancing a third substrate in the machine direction, wherein the third substrate is between the second substrate and the first substrate. 12 . A method for forming a seam, the method comprising the steps of: rotating a heating cylinder about an axis of rotation, the forming cylinder comprising a plurality of fluid outlets disposed about a periphery of the heating cylinder, wherein each of the plurality of fluid outlets are in communication with a fluid chamber; advancing a first substrate in a machine direction on the forming cylinder; advancing a second substrate in the machine direction wherein the first substrate is between the second substrate and the forming cylinder; heating a fluid within the fluid chamber to a temperature sufficient to at least partially melt the substrates; directing a jet of the heated fluid through the fluid outlet and onto an overlap area of the first and second substrates; partially melting the overlap area; removing the first and second substrates from the heating cylinder; advancing the first and second substrates to a nip formed between an anvil cylinder and a pressure applying cylinder; rotating the anvil cylinder and the pressure applying cylinder; and compressing the overlap area in a nip between the pressure applying member and the anvil cylinder, wherein the pressure applying member comprises a pressure applying member configured to engage the anvil cylinder. 13 . The method of claim 12 , wherein the jet of heated fluid is at a temperature ranging from a lower melting point of the first and second substrates minus 30° C. to the lower melting point of the first and second substrates plus 100° C. 14 . The method of claim 12 , comprising the step of wrapping the first and second substrates around at least a portion of the rotating heating cylinder. 15 . A method for forming a seam, the method comprising the steps of: rotating a heating cylinder about an axis of rotation, the forming cylinder comprising a plurality of fluid outlets disposed about a periphery of the heating cylinder, wherein each of the plurality of fluid outlets are in communication with a fluid chamber; advancing a first substrate in a machine direction on the forming cylinder; advancing a second substrate in the machine direction wherein the first substrate is between the second substrate and the forming cylinder; heating a fluid within the fluid chamber to a temperature sufficient to at least partially melt the substrates; directing a jet of the heated fluid through the fluid outlet and onto an overlap area of the first and second substrates; partially melting the overlap area; removing the first and second substrates from the heating cylinder; advancing the first and second substrates between an anvil block and a pressure applying member; traversing at least one of the anvil block and the pressure applying member; and compressing the overlap area between the pressure applying member and the anvil block. 16 . The method of claim 15 , wherein the separation distance between the fluid outlet and the first substrate is no greater than about 5 mm. 17 . The method of claim 15 , wherein the jet of heated fluid is at a temperature ranging from a lower melting point of the first and second substrates minus 30° C. to the lower melting point of the first and second substrates plus 100° C. 18 . The method of claim 15 , wherein the jet of heated fluid is directed at the first and second substrates at a pressure in the range of about 0.1×10 5 Newtons per square meter to about 1×10 6 Newtons per square meter. 19 . The method of claim 15 , wherein the fluid is ambient air. 20 . The method of claim 15 , further comprising heating the substrate portions using the jet of the heating fluid for between about 5 milliseconds and about 2000 milliseconds.

Assignees

Inventors

Classifications

  • with cutting, punching, tearing or severing · CPC title

  • of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part · CPC title

  • using hot gases {(e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined} · CPC title

  • Cam mechanisms; Wedges; Eccentric mechanisms · CPC title

  • Sealing, e.g. involving cutting · CPC title

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What does patent US2016167354A1 cover?
A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate p…
Who is the assignee on this patent?
Procter & Gamble
What technology area does this patent fall under?
Primary CPC classification A61F13/15739. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu Jun 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).