Laminate and application thereof

Patent metadata

Field	Value
Publication number	US-2016167337-A1
Application number	US-201615052122-A
Country	US
Kind code	A1
Filing date	Feb 24, 2016
Priority date	Aug 30, 2013
Publication date	Jun 16, 2016
Grant date	—

Abstract

Provided are a temporary bonding layer laminate for producing a semiconductor device, which can reliably and easily provide a temporary support for the device wafer when the device wafer is subjected to a mechanical or chemical treatment and can easily provide a release from the temporary support for the device wafer while not damaging the device wafer even after undergoing a process at a high temperature; and a composition for forming a protective layer, a composition for forming a release layer, and a kit, each of which is used for the production of the laminate.
The laminate has a device wafer, a protective layer, a release layer, and a support substrate in this order, in which the protective layer is in contact only with the device wafer and the release layer, the release layer is in contact only with the protective layer and the support substrate, and the release layer contains a fluorine atom and/or a silicon atom.

First claim

What is claimed is:

1 . A laminate comprising:
a device wafer; a protective layer; a release layer; and a support substrate in this order, wherein the protective layer is in contact only with the device wafer and the release layer, the release layer is in contact only with the protective layer and the support substrate, and the release layer contains a fluorine atom and/or a silicon atom.

2 . The laminate according to claim 1 , wherein the release layer has a three-dimensional crosslinked product containing a fluorine atom and/or a silicon atom.

3 . The laminate according to claim 1 , wherein the release layer includes a three-dimensional crosslinked product and 50% by mass or more of the three-dimensional crosslinked product is constituted with fluorine atoms.

4 . The laminate according to claim 1 , wherein the release layer includes at least one of a radical polymerization product of a bifunctional or higher functional radically polymerizable monomer or oligomer containing a fluorine atom and a condensate of an alkoxysilane compound containing a fluorine atom.

5 . The laminate according to claim 1 , wherein the protective layer includes a thermoplastic resin.

6 . The laminate according to claim 5 , wherein the thermoplastic resin includes at least one of a polycarbonate resin, a polystyrene resin, and a polystyrene copolymerized resin.

7 . The laminate according to claim 1 , wherein the softening point of the protective layer is 200° C. or lower.

8 . The laminate according to claim 1 , wherein the protective layer further includes a plasticizer.

9 . The laminate according to claim 1 , wherein the protective layer further includes an antioxidant.

10 . The laminate according to claim 1 , wherein at least one of the release layer and the protective layer further includes a polymer compound containing a fluorine atom with a non-three-dimensional crosslinked structure.

11 . The laminate according to claim 1 , wherein the average thickness of the device wafer is 500 μm or more.

12 . The laminate according claim 1 , wherein the average thickness of the device wafer is less than 500 μm.

13 . The laminate according to claim 1 , wherein the device wafer has a structure having a height of 5 μm to 100 μm and the average thickness of the protective layer is more than the height of the structure.

14 . A kit for forming the laminate according to claim 1 , comprising a composition for forming a protective layer including a solvent and a resin, and a composition for forming a release layer, including a material containing a fluorine atom and/or a silicon atom and a solvent.

15 . The kit for forming the laminate according to claim 14 , wherein the thermoplastic resin includes at least one of a polycarbonate, a polystyrene resin, and a polystyrene-copolymerized resin.

16 . The kit for forming the laminate according to claim 14 , wherein the softening point of the resin is 200° C. or lower.

17 . The kit for forming the laminate according to claim 14 , wherein the material containing a fluorine atom and/or a silicon atom includes at least one of a bifunctional or higher functional radically polymerizable monomer or oligomer containing a fluorine atom, and an alkoxysilane compound containing a fluorine atom.

Assignees

• Fujifilm Corp

Inventors

• Koyama Ichiro
• Iwai Yu
• Kamochi Yoshitaka

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title