Chip form ultracapacitor
US-12165808-B2 · Dec 10, 2024 · US
US2016167132A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016167132-A1 |
| Application number | US-201514957849-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 3, 2015 |
| Priority date | Dec 10, 2014 |
| Publication date | Jun 16, 2016 |
| Grant date | — |
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Techniques for additive deposition are disclosed herein. In one embodiment, a method includes depositing a first portion of a precursor material onto a deposition platform, the precursor material including a suspension of nano-particles and forming a first solid structure of the nano-particles on the deposition platform from the deposited first layer of the precursor material. The method can also include depositing a second portion of the precursor material onto the formed first solid structure of the nano-particles and forming a second solid structure on the first solid structure from the deposited second layer of the precursor material. The three dimensional structure thus formed can be partly or fully cured or sintered during deposition or after deposition resulting in a controlled hierarchical porosity at multiple levels, from mesoscale (e.g., about 10 μm to about 250 μm) to nanoscale (e.g., about 900 nm or less) in the same structure.
Opening claim text (preview).
I/We claim: 1 . A method for additive manufacturing of a porous scaffold structure, comprising: depositing a first layer of a precursor material onto a deposition platform in a deposition pattern, the precursor material including a suspension of nano-particles; sintering the deposited first layer of the precursor material to form a first solid structure of the nano-particles on the deposition platform; depositing a second layer of the precursor material onto the first solid structure of the nano-particles; and sintering the deposited second layer of the precursor material to form a second solid structure on the first solid structure, wherein the first and second solid structures forming a scaffold structure having hierarchical mesoscale of about 10 μm to about 250 μm to nanoscale of less than about 500 nm) porosity. 2 . The method of claim 1 , further comprising: prior to depositing the second layer of the precursor material, depositing a sacrificial material onto the first solid structure on the deposition platform, the sacrificial material providing mechanical support to the first solid structure; and removing the sacrificial material subsequent to sintering the deposited second layer of the precursor material. 3 . The method of claim 1 wherein depositing the first layer includes depositing the first layer of the precursor material onto the deposition platform in a deposition pattern having a plurality of voids, and wherein sintering the deposited first layer includes forming the first solid structure having the plurality of voids. 4 . The method of claim 1 wherein depositing the first layer includes controlling deposition of the first layer of the precursor material onto the deposition platform based on a target structure profile of the first solid structure. 5 . The method of claim 1 wherein: depositing the first layer includes depositing the first layer of a first precursor material; and depositing the second layer includes depositing the second layer of a second precursor material different than the first precursor material. 6 . The method of claim 1 wherein: depositing the first layer includes depositing the first layer of the precursor material onto the deposition platform in a first deposition pattern; and depositing the second layer includes depositing the second layer of the precursor material onto the deposition platform in a second deposition pattern different than the first deposition pattern. 7 . The method of claim 1 wherein: sintering the deposited first layer or second layer includes sintering the deposited first layer or second layer of the precursor material to form a first grid or a second grid having a plurality of rows and columns, respectively; and the rows and columns are spaced apart from neighboring rows and columns by corresponding voids. 8 . The method of claim 1 wherein: sintering the deposited first layer or second layer includes sintering the deposited first layer or second layer of the precursor material to form a first grid or a second grid having a plurality of rows and columns, respectively; and the individual rows and columns include additional porosity in addition to the hierarchical mesoscale of about 10 μm to about 250 μm to nanoscale of less than about 500 nm porosity of the scaffold structure. 9 . A method for additive manufacturing of a porous scaffold structure, comprising: depositing a first portion of a precursor material onto a deposition platform, the precursor material including a suspension of nano-particles; forming a first solid structure of the nano-particles on the deposition platform from the deposited first layer of the precursor material; depositing a second portion of the precursor material onto the formed first solid structure of the nano-particles; and forming a second solid structure on the first solid structure from the deposited second layer of the precursor material, wherein the first and second solid structures being separated from one another by a plurality of hierarchical mesoscale of about 10 μm to about 250 μm or nanoscale of less than about 500 nm pores. 10 . The method of claim 9 wherein forming the second solid structure includes forming the second solid structure on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles. 11 . The method of claim 9 wherein forming the second solid structure includes forming the second solid structure on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles, and wherein the vertices are spaced apart from one another at a dimension of mesoscale of about 10 μm to about 250 μm or nanoscale of less than about 500 nm. 12 . The method of claim 9 wherein forming the second solid structure includes forming the second solid structure on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles, and wherein the vertices and the frame members are spaced apart from one another to form the mesoscale of about 10 μm to about 250 μm or nanoscale of less than about 500 nm pores. 13 . The method of claim 9 wherein: forming the first solid structure includes forming the first solid structure on the deposition platform in a first pattern; and forming the second solid structure includes forming the second solid structure on the first solid structure in a second pattern different than the first pattern. 14 . The method of claim 9 wherein: forming the second solid structure includes forming the second solid structure on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles; and the frame members individually having porosity in addition to the mesoscale of about 10 μm to about 100 μm or nanoscale of less than about 500 nm porosity of the matrix. 15 . A computing system having a processor and a memory containing instructions executable by the processor to cause the processor to perform a process comprising: instructing a deposition head to deposit a first portion of a precursor material onto a deposition platform, the precursor material including a suspension of nano-particles; instructing an energy source to provide a first energy stream toward the first portion of the precursor material, thereby sintering the first portion of the precursor material to form a first solid structure of the nano-particles on the deposition platform; instructing the deposition head to deposit a second portion of the precursor material onto the formed first solid structure of the nano-particles; and instructing the energy source to provide a second energy stream toward the second portion of the precursor material, thereby sintering the deposited second layer of the precursor material, wherein the first and second solid structures being separated from one another by a plurality of hierarchical mesoscale of about 10 μm to about 100 μm or nanoscale of less than about 500 nm pores. 16 . The computing system of claim 15 wherein the second solid structure is on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles. 17 . The computing system of claim 15 wherein the second solid structure is on the first solid structure to form a matrix having multiple vertices interconnected by corresponding frame members of the nano-particles, and wherein the vertices
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