Metallic Copper Dispersion, Method For Manufacturing Same, And Usage For Same

Patent metadata

Field	Value
Publication number	US-2016167130-A1
Application number	US-201414907010-A
Country	US
Kind code	A1
Filing date	Jul 24, 2014
Priority date	Jul 25, 2013
Publication date	Jun 16, 2016
Grant date	—

Abstract

The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g. The metallic copper dispersion is manufactured by reducing copper oxide in an aqueous solvent in the presence of gelatin, then performing solid-liquid separation, and then mixing the obtained metallic copper particles having gelatin on the particle surface and the polymer dispersant into the organic solvent.

First claim

1 . A metallic copper dispersion liquid comprising at least metallic copper particles having a gelatin on surfaces thereof, a polymeric dispersant, and an organic solvent, wherein
the polymeric dispersant has an amine value has an amine value of 10 to 150 mgKOH/g, and the metallic copper particles have a 50% cumulative particle diameter (D50) of 1 to 130 nm and a 90% cumulative particle diameter (D90) of 10 to 300 nm.

2 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant has a specific heat capacity of 1.0 to 2.0 J/(g·K) at a glass transition point of the polymeric dispersant.

3 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant has a glass transition point within a range of −70 to 10° C.

4 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant is a straight-chain type acrylic polymer or a straight-chain type acrylic copolymer.

5 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant has a mass average molecular weight of 1000 to 100000 g/mol.

6 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant has an amine value of 10 to 90 mgKOH/g and a glass transition point of −70 to 10° C.

7 . The metallic copper dispersion liquid according to claim 1 , wherein the metallic copper particles have a 50% cumulative particle diameter (D50) of 10 to 120 nm and a 90% cumulative particle diameter (D90) of 40 to 250 nm.

8 . The metallic copper dispersion liquid according to claim 1 , wherein the metallic copper particles have an SD value of 0.6 to 3.5, wherein
the SD value is calculated from the values of a 10% cumulative particle diameter (D10), the 50% cumulative particle diameter (D50), and the 90% cumulative particle diameter (D90) using the following equation 1.
SD value=( D 90− D 10)/ D 50  Equation 1:

9 . The metallic copper dispersion liquid according to claim 1 , wherein the gelatin existing on the surfaces of the metallic copper particles has a mass average molecular weight of 2000 to 200000.

10 . The metallic copper dispersion liquid according to claim 1 , wherein the organic solvent is at least one selected from the group consisting of hydrocarbons, alcohols, ketones, esters, ethers, glycols, glycol ethers, and glycol esters.

11 . The metallic copper dispersion liquid according to claim 1 , wherein the polymeric dispersant is blended in an amount of 0.1 to 20 parts by mass based on 100 parts by mass of the metallic copper particles.

12 . The metallic copper dispersion liquid according to claim 1 , having a viscosity of 100 mPa·s or less.

13 . The metallic copper dispersion liquid according to claim 1 , having a concentration of the metallic copper particles of 15% by mass or more and a viscosity of 100 mPa·s or less.

14 . A process for preparing a metallic copper dispersion liquid, comprising the steps of:
reducing a copper oxide in the presence of a gelatin in an aqueous solvent; thereafter performing a solid-liquid separation; and subsequently mixing and dispersing metallic copper particles having the gelatin on surfaces thereof, obtained by the solid-liquid separation with a polymeric dispersant in an organic solvent; wherein the polymeric dispersant has an amine value of 10 to 150 mgKOH/g, and the metallic copper particles have a 50% cumulative particle diameter (D50) of 1 to 130 nm and a 90% cumulative particle diameter (D90) of 10 to 300 nm.

15 . The process for preparing a metallic copper dispersion liquid according to claim 14 , wherein the polymeric dispersant has a specific heat capacity of 1.0 to 2.0 J/(g·K) at a glass transition point of the polymeric dispersant.

16 . The process for preparing a metallic copper dispersion liquid according to claim 14 , wherein the polymeric dispersant has a glass transition point within a range of −70 to 10° C.

17 . The process for preparing a metallic copper dispersion liquid according to claim 14 , wherein the polymeric dispersant is a straight-chain type acrylic polymer or a straight-chain type acrylic copolymer.

18 . The process for preparing a metallic copper dispersion liquid according to claim 14 , wherein the polymeric dispersant has a mass average molecular weight of 1000 to 100000 g/mol.

19 . An electrode formed using the metallic copper dispersion liquid according to claim 1 .

20 . A wiring pattern formed using the metallic copper dispersion liquid according to claim 1 .

21 . A coating film formed using the metallic copper dispersion liquid according to claim 1 .

22 . A decorative article forming the coating film according to claim 21 formed on at least one part of a surface of a base material.

23 . An antimicrobial article forming the coating film according to claim 21 formed on at least one part of a surface of a base material.

24 . A process for producing a metallic copper-containing film, comprising a step (a) of adhering the metallic copper dispersion liquid according to claim 1 on a surface of a base material.

25 . The process for producing a metallic copper-containing film, comprising a step (b) of heating the metallic copper-containing film produced by the step (a) according to claim 24 under a reducing gas atmosphere.

26 . The process for producing a metallic copper-containing film, comprising a step (c) of irradiating a whole or one partial region of the metallic copper-containing film produced by the step (a) according to claim 24 with light.

27 . The process for producing a metallic copper-containing film, comprising a step (d) of irradiating a whole or one partial region of the metallic copper-containing film produced by the step (a) according to claim 24 with plasma.

28 . The process for producing a metallic copper-containing film, comprising a step (e) of removing the metallic copper-containing film in an unirradiated region after preforming the step (c) according to claim 26 .

29 . The process for producing a metallic copper-containing film, comprising a step (f) of transferring, on another base material, a whole or one partial region of the metallic copper-containing film produced on the base material by the step according to claim 24 .

30 . The process for producing a metallic copper-containing film, comprising a step (e) of removing the metallic copper-containing film in an unirradiated region after preforming the step (d) according to claim 27 .

Assignees

• Ishihara Sangyo Kaisha

Inventors

• Ida Kiyonobu
• Watanabe Mitsuru

Classifications

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• C09D11/52

  Electrically conductive inks · CPC title

• C09D11/037

  characterised by the pigment · CPC title

• C23C24/08

  by application of heat or pressure and heat (C23C24/04 takes precedence) · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title