Mems microphone package

Patent metadata

Field	Value
Publication number	US-2016165358-A1
Application number	US-201414586086-A
Country	US
Kind code	A1
Filing date	Dec 30, 2014
Priority date	Dec 5, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

First claim

1 . A microelectromechanical system (MEMS) microphone package, comprising:
a substrate, comprising:
at least one first hole;
an upper surface;
a bottom surface;
a side surface with two sides connected to the upper surface and the bottom surface, respectively, and the two sides being opposite to each other;
at least one first electrically conductive layer disposed on the upper surface; and
at least one second electrically conductive layer disposed on the bottom surface;
at least one MEMS microphone electrically coupled to the substrate; at least one IC chip electrically coupled to the substrate; and an electrically conductive cover comprising at least one second hole; wherein, the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary, the first boundary of the opening is a part of a boundary of the at least one first hole, and the second boundary of the opening is a part of a boundary of the at least one second hole.

2 . The MEMS microphone package according to claim 1 , wherein the electrically conductive cover further comprises a top portion and a side portion, the side portion surrounds and is connected to the top portion, and the at least one second hole is disposed on the side portion.

3 . The MEMS microphone package according to claim 1 , wherein the electrically conductive cover further comprises a top portion, a side portion and a brim portion, the side portion surrounds and is connected to the top portion, the brim portion surrounds and is connected to the side portion, the at least one second hole is disposed on the brim portion.

4 . The MEMS microphone package according to claim 1 , wherein the electrically conductive cover further comprises a top portion, a side portion and a brim portion, the side portion surrounds and is connected to the top portion, the brim portion surrounds and is connected to the side portion, a boundary of the at least one second hole extends from the brim portion to the side portion.

5 . The MEMS microphone package according to claim 2 , wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not in contact with the side surface and the bottom surface to form a blind hole.

6 . The MEMS microphone package according to claim 2 , wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

7 . The MEMS microphone package according to claim 2 , wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

8 . The MEMS microphone package according to claim 2 , wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

9 . The MEMS microphone package according to claim 8 , wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, and the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

10 . The MEMS microphone package according to claim 9 , wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

11 . The MEMS microphone package according to claim 3 , wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not contact with the side surface and the bottom surface to form a blind hole.

12 . The MEMS microphone package according to claim 3 , wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

13 . The MEMS microphone package according to claim 3 , wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

14 . The MEMS microphone package according to claim 3 , wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

15 . The MEMS microphone package according to claim 14 , wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

16 . The MEMS microphone package according to claim 15 , wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer outside the MEMS microphone package such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

17 . The MEMS microphone package according to claim 4 , wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not in contact with the side surface and the bottom surface to form a blind hole.

18 . The MEMS microphone package according to claim 4 , wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

19 . The MEMS microphone package according to claim 4 , wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

20 . The MEMS microphone package according to claim 4 , wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

21 . The MEMS microphone package according to claim 20 , wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

22 . The MEMS microphone package according to claim 21 , wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second

Assignees

• Ind Tech Res Inst

Inventors

• Ho Tzong-Che
• Fan Yu-Wen
• Chen Hong-Ren
• Huang Chao-Ta

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B7/007

  Interconnections between the MEMS and external electrical signals · CPC title

• H04R23/00 Primary

  Transducers other than those covered by groups H04R9/00 - H04R21/00 {(diaphragms for transducers of the distributed-mode type H04R7/045)} · CPC title