High Frequency Signal Feed Through

Patent metadata

Field	Value
Publication number	US-2016164154-A1
Application number	US-201514880315-A
Country	US
Kind code	A1
Filing date	Oct 12, 2015
Priority date	Dec 4, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A high frequency signal feed through by which the ends of an input side coaxial cable and an output side coaxial cable, to be connected to each other, each comprising an interior conductor and an exterior conductor surrounding the interior conductor, are coupled to each other, showing a housing, a preferably pressure-resistant signal feed through arranged in the housing for the interior conductor, with the interior conductor being coupled at a conductive structure, arranged preferably centrally in the housing and capable of handling high frequencies, with at least one element for the galvanic separation being arranged between an input side and an output side, with the housing showing the structure for the galvanically separated coupling of the exterior conductor.

First claim

We claim:

1 . A high frequency signal feed through, by which ends of an input-side coaxial cable and an output side coaxial cable to be connected to each other, each comprising an interior conductor and an exterior conductor surrounding the interior conductor, are coupled to each other, with a housing, a pressure-resistant signal feed through arranged in said housing for the interior conductor, characterized in that the interior conductor is coupled to the conductive structure, preferably arranged centrally in the housing and capable of handling high frequencies, with at least one element being arranged between an input side and an output side for the galvanic separation, with the housing showing the structure for the galvanically separated coupling of the exterior conductor.

2 . The high frequency signal feed through of claim 1 , wherein the interior conductor is coupled to a circuit-board arranged in the housing and provided on a first side with a conductive structure capable of handling high frequencies, showing at least one separating element arranged on the circuit-board for the galvanic signal separation, with a second side of the circuit-board opposite the first side showing a second conductive structure coupled to the exterior conductor.

3 . The high frequency signal feed through of claim 1 , wherein the exterior conductor is coupled to a third conductive structure arranged on the first side, surrounding the first conductive structure at the outside.

4 . The high frequency signal feed through of claim 2 , wherein the second conductive structure is connected to the third conductive structure in an electrically conductive fashion, particularly via throughplatings.

5 . The high frequency signal feed through of claim 1 , wherein the housing is embodied at least sectionally surrounding the circuit-board in the direction of a longitudinal axis in a cylindrical fashion, with the housing comprising at least one conductive interior layer and a conductive exterior layer, galvanically separated from the interior layer, which at least overlap such that they are capacitively coupled, with an exterior conductor at the input side being connected to the interior layer and an exterior conductor at the output side to the exterior layer.

6 . The high frequency signal feed through of claim 1 , wherein the conductive exterior layer is embodied cylindrically and is galvanically separated from each other by an isolation.

7 . The high frequency signal feed through of claim 6 , wherein the interior layer is embodied as a first cylindrical tube arranged inside the exterior layer.

8 . The high frequency signal feed through of claim 6 , wherein the isolation is embodied as a second cylindrical tube, at the passing side preferably at least partially closed, in which the first cylindrical tube is supported.

9 . The high frequency signal feed through of claim 7 , wherein the exterior layer is embodied as a third cylindrical tube, which preferably completely surrounds the first cylindrical tube in the direction of the longitudinal axis.

10 . The high frequency signal feed through of claim 7 , wherein the circuit-board is supported in the first cylindrical tube.

11 . The high frequency signal feed through of claim 10 , wherein the circuit-board is held in two grooves preferably arranged radially opposite in the first cylindrical tube.

12 . The high frequency signal feed through of claim 10 , wherein the first cylindrical tube is formed from two half-shells, with the circuit-board placed therebetween.

13 . The high frequency signal feed through of claim 10 , wherein the circuit-board is pressed into the first cylindrical tube.

14 . The high frequency signal feed through of claim 1 , wherein the exterior conductor at the input side and the second conductive structure and the third conductive structure are connected in a conductive fashion to the interior layer via soldering or spring contacts.

15 . The high frequency signal feed through of claim 1 , wherein additional electronic components are arranged on the circuit-board.

Assignees

• Grieshaber Vega Kg

Inventors

• Baur Roland

Classifications

• H01P1/045 Primary

  Coaxial joints · CPC title

• H01R24/54

  Intermediate parts, e.g. adapters, splitters or elbows · CPC title

• H01R31/065 Primary

  with built-in electric apparatus · CPC title

• H01R13/665

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

• H01P1/202

  Coaxial filters (cascaded coaxial cavities H01P1/205) · CPC title