Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate

Patent metadata

Field	Value
Publication number	US-2016163955-A1
Application number	US-201615044181-A
Country	US
Kind code	A1
Filing date	Feb 16, 2016
Priority date	May 12, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

First claim

1 - 5 . (canceled)

6 . A piezoelectric element with a cable substrate, comprising:
a piezoelectric element including a plurality of piezoelectric bodies that are aligned via grooves; a cable substrate including a plurality of substrate electrodes that are aligned on an insulating substrate; first solder that connects the plurality of substrate electrodes and a plurality of element electrodes provided on surfaces of the plurality of piezoelectric bodies at a first opposing position where the plurality of substrate electrodes and the plurality of element electrodes are opposed to each other; and a thermosetting resin that is adjacent to the first solder and connects the plurality of piezoelectric bodies and the insulating substrate, wherein the piezoelectric element has a cut-out portion that is adjacent to the plurality of element electrodes and defines a gap between the piezoelectric element and the plurality of substrate electrodes, the gap being greater than a gap between the plurality of element electrodes and the plurality of substrate electrodes at the first opposing position.

7 . The piezoelectric element with a cable substrate according to claim 6 , further comprising
second solder in the cut-out portion, the second solder being connected to the first solder located at the first opposing position.

8 . The piezoelectric element with a cable substrate according to claim 7 ,
wherein the thermosetting resin partially enters and cures in the grooves between the plurality of piezoelectric bodies that are aligned.

9 . An inkjet head that discharges ink through a nozzle hole by driving the piezoelectric element with a cable substrate according to claim 6 .

10 . An inkjet apparatus that applies the ink to a workpiece by using the inkjet head according to claim 9 .

11 . An inkjet head that discharges ink through a nozzle hole by driving the piezoelectric element with a cable substrate according to claim 7 .

12 . An inkjet head that discharges ink through a nozzle hole by driving the piezoelectric element with a cable substrate according to claim 8 .

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Irie Kazunobu
• Ohtsuka Futoshi
• Kita Takeshi
• Hatanaka Motoi

Classifications

• H01L41/08

  Electricity · mapped topic

• H01L41/047 Primary

  Electricity · mapped topic

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title

• B41J2/14209 Primary

  of finger type, chamber walls consisting integrally of piezoelectric material · CPC title

• B23K31/02

  relating to soldering or welding · CPC title