Heat dissipating circuit board and electronic device

Patent metadata

Field	Value
Publication number	US-2016163618-A1
Application number	US-201615041167-A
Country	US
Kind code	A1
Filing date	Feb 11, 2016
Priority date	Aug 16, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.

First claim

What is claimed is:

1 . A heat dissipating circuit board for a power semiconductor, comprising:
an electrode material on which the power semiconductor is mounted on a front surface thereof; and a member bonded to a front surface side of the electrode material, wherein the member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.

2 . The heat dissipating circuit board according to claim 1 , wherein the member is formed in an annular shape along an outer circumference of the front surface of the electrode material.

3 . The heat dissipating circuit board according to claim 1 , wherein a plurality of the members are provided, the plural members being arranged along an outer circumference of the front surface of the electrode material.

4 . The heat dissipating circuit board according to claim 1 , wherein two of the members are bonded at linearly symmetric positions.

5 . The heat dissipating circuit board according to claim 1 , wherein a portion of the member extends out in a transverse direction beyond an outer circumference of the front surface of the electrode material.

6 . The heat dissipating circuit board according to claim 1 , wherein entirety of the member is bonded within the front surface of the electrode material.

7 . The heat dissipating circuit board according to claim 1 , wherein:
a portion of the front surface of the electrode material includes a recess therein; and the member is bonded in the recess.

8 . The heat dissipating circuit board according to claim 1 , further comprising a ceramic substrate, which is bonded to a rear surface of the electrode material.

9 . The heat dissipating circuit board according to claim 8 , wherein at least material properties and thicknesses of the member and the ceramic substrate are adjusted so as to suppress warping of the heat dissipating circuit board.

10 . The heat dissipating circuit board according to claim 8 , wherein a constituent material of the member is a ceramic material, which is the same as the ceramic material of the ceramic substrate.

11 . The heat dissipating circuit board according to claim 8 , wherein a constituent material of the ceramic substrate is silicon nitride.

12 . The heat dissipating circuit board according to claim 8 , further comprising another electrode material, which is bonded to an end surface of the ceramic substrate.

13 . The heat dissipating circuit board according to claim 12 , wherein a thickness of the electrode material is greater than a thickness of the other electrode material.

14 . The heat dissipating circuit board according to claim 13 , wherein an inequality
t1>tb>t2
is satisfied, where tb represents a thickness of the ceramic substrate, t 1 represents the thickness of the electrode material, and t 2 represents the thickness of the other electrode material.

15 . An electronic device comprising:
a heat dissipating circuit board for a power semiconductor; and a power semiconductor, which is mounted on a front surface of an electrode material of the heat dissipating circuit board, the heat dissipating circuit board comprising: the electrode material; and a member bonded to a front surface side of the electrode material, wherein the member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.

Assignees

• Ngk Insulators Ltd

Inventors

• Tani Makoto
• Tanaka Yoshihiro
• Ebigase Takashi

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title