Systems and methods for applying metallic laminates to cables

Patent metadata

Field	Value
Publication number	US-2016163418-A1
Application number	US-201414563625-A
Country	US
Kind code	A1
Filing date	Dec 8, 2014
Priority date	Dec 8, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A laminated cable includes a metal laminate surrounding a cable core having first and second ends. Solder is applied adjacent the ends of the laminate, and is heated and subsequently cooled to form a metal seal. The solder can be melted in a plastic jacketing extruder as the extruder applies a plastic jacket over the metal laminate.

First claim

1 . A cable comprising:
a cable core; a metallic jacket disposed radially outward relative to the core, the jacket having a first end and second end proximate to the first end; and a seal including solder in contact with the first and second ends.

2 . The cable of claim 1 , wherein at least a portion of the first end overlaps at least a portion of the second end, and the seal is disposed circumferentially between the at least a portion of the first end and the at least a portion of the second end.

3 . The cable of claim 1 , wherein at least a portion of the first end overlaps at least a portion of the second end, and the seal is disposed radially outwardly of both the at least a portion of the first end and the at least a portion of the second end.

4 . The cable of claim 1 , wherein at least a portion of the first end overlaps at least a portion of the second end, and the seal is disposed radially inward relative to both the at least a portion of the first end and the at least a portion of the second end.

5 . The cable of claim 4 , wherein at least a portion of a metallic strip is disposed radially inward of the seal.

6 . A method of making cable, comprising:
at least partially surrounding a cable core with a metallic laminate having a first circumferential end and second circumferential end; disposing solder adjacent to the first end and second end; and, forming a seal including the solder in contact with the first end and second end.

7 . The method of claim 6 , wherein the disposing step includes disposing a solder tape including a metal substrate layer and the solder adjacent the first end and second end.

8 . The method of claim 7 wherein the disposing step includes disposing a solder tape including a metal substrate layer and the solder, such that the substrate layer is radially inward relative to the solder.

9 . The method of claim 7 wherein the disposing step includes disposing a solder tape including a metal substrate layer, flux and the solder, such that the substrate layer is radially inward of the solder and flux.

10 . The method of claim 9 wherein the disposing step includes disposing a solder tape including a metal substrate layer, layer of flux and layer of solder, such that the substrate layer is radially inward of the solder layer and the solder layer is radially inward of the flux layer.

11 . The method of claim 10 , wherein the forming step includes melting the solder in a plastic jacketing extruder.

12 . The method of claim 6 , wherein the forming step includes melting the solder in a plastic jacketing extruder.

13 . An apparatus, comprising:
an elongate cable core extending from an input side of a heat source to an output side of the heat source; a metallic laminate at least partially surrounding the cable core and having a first circumferential end and second circumferential end; solder disposed proximate to at least one of the first and second circumferential end; a solder seal in contact with the first end and second end extending along a longitudinal axis of the core from proximate to the heat source to the output side of the heat source.

14 . The apparatus of claim 13 , wherein the solder is disposed on a metallic substrate disposed radially inward of the metallic laminate proximate to the heat source.

15 . The apparatus of claim 13 , further comprising a plastic jacket surrounding the metallic laminate, the jacket extending from proximate to the heat source to the output side of the heat source.

16 . The apparatus of claim 15 wherein the heat source is a plastic jacketing extruder.

17 . The apparatus of claim 13 , wherein the solder is low temperature solder.

Assignees

• Abb Technology Ag

Inventors

• Hobson Robert Wayne

Classifications

• H01B13/14

  by extrusion {(extrusion in general B29C48/00)} · CPC title

• H01B7/285 Primary

  by completely or partially filling interstices in the cable · CPC title

• H01B7/0275

  comprising one or more extruded layers of insulation · CPC title

• H01B13/221

  filling-up interstices · CPC title

• H01B13/24

  by extrusion {(extrusion of cables with plastic material in general B29C48/15)} · CPC title