Thermal Profile Based on Temperature Information for Computing Device Location

Patent metadata

Field	Value
Publication number	US-2016162297-A1
Application number	US-201314893950-A
Country	US
Kind code	A1
Filing date	Aug 30, 2013
Priority date	Aug 30, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

A computing device may detect an ambient temperature and receive temperature information for a location of the computing device. The computing device may select a thermal profile for the computing device based on the ambient temperature. The computing device may modify the thermal profile based on the received temperature information.

First claim

1 . A computing device comprising:
a thermal sensor to detect an ambient temperature of the computing device; a thermal dissipation component to reduce an operating temperature of the computing device; a communication component to receive temperature information corresponding to a location of the computing device; and a controller to select a first thermal profile for the thermal dissipation component based on the ambient temperature in response to the computing device powering on and the controller to select a second thermal profile for the thermal dissipation component based on the received temperature information and the ambient temperature after the computing device completes a boot process.

2 . The computing device of claim 1 wherein the computing device powers on from at least one of a power off state and a low power state to start the boot process.

3 . The computing device of claim 1 wherein the boot process includes executing at least one of a BIOS (Basic Input/Output System) and an operating system of the computing device; and
wherein the boot process is complete once at least one of the BIOS and the operating system have been executed.

4 . The computing device of claim 1 wherein the controller identifies the location of the computing device based on a network address of the computing device.

5 . The computing device of claim 1 further comprising a location component to detect a geographic coordinate of the computing device.

6 . The computing device of claim 1 wherein the communication component transmits the location of the computing device to another device and the communication component receives the temperature information from the other device as a weather forecast corresponding to the location of the computing device.

7 . The computing device of claim 1 wherein the controller selects the second thermal profile based on the received temperature information to anticipate dissipating heat at an earlier time or to anticipate increasing an amount of thermal dissipation.

8 . A method for managing thermal dissipation of a computing device comprising:
selecting a thermal profile for a thermal dissipation component of the computing device based on an ambient temperature of the computing device in response to the computing device powering on; detecting a location of the computing device after the computing device completes a boot process and receiving temperature information of the location of the computing device; and modifying the thermal profile for the thermal dissipation component based on the received temperature information of the location.

9 . The method for managing thermal dissipation of a computing device of claim 8 further comprising receiving and storing a weather forecast as temperature information in a storage component of the computing device.

10 . The method for managing thermal dissipation of a computing device of claim 9 further comprising modifying the thermal profile with the stored weather forecast if a connection is unavailable to receive the temperature information.

11 . The method for managing thermal dissipation of a computing device of claim 8 wherein modifying the thermal profile includes reducing a temperature threshold of the computing device in a passive mode for the thermal dissipation component to increase thermal dissipation of the computing device.

12 . The method for managing thermal dissipation of a computing device of claim 8 wherein modifying the thermal profile includes increasing an operating speed for a fan component of the thermal dissipation component if the computing device is in an active mode.

13 . A non-volatile computer readable medium comprising instructions that if executed cause a controller to:
detect an ambient temperature of a computing device before the computing device powers on; launch a thermal profile for the computing device based on the ambient temperature in response to the computing device powering on; receive information of a location of the computing device after the computing device completes a boot process and receive weather information including temperature information for the location; and modify the thermal profile of the computing device based on the received temperature information.

14 . The non-volatile computer readable medium of claim 13 wherein a thermal dissipation component of the computing device increases thermal dissipation of the computing device if the received weather information includes temperature information which is higher than the ambient temperature.

15 . The non-volatile computer readable medium of claim 13 wherein a thermal dissipation component of the computing device delays thermal dissipation of the computing device if the received weather information includes temperature information which is lower than the ambient temperature.

Assignees

• Hewlett Packard Development Co

Inventors

• Shao Hua

Classifications

• G06F9/4401 Primary

  Bootstrapping (security arrangements therefor G06F21/57) · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• Y02D10/00

  Energy efficient computing, e.g. low power processors, power management or thermal management · CPC title