Resin composition and gate insulating film

Patent metadata

Field	Value
Publication number	US-2016160012-A1
Application number	US-201414907037-A
Country	US
Kind code	A1
Filing date	Jul 28, 2014
Priority date	Jul 31, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

A resin composition containing a resin (A) which contains a hydroxyl group and a cyanoalkyl group, an epoxy compound (B) which has two or more epoxy groups in its molecule, a curing agent (C) which has two or more hydroxyl groups in its molecule and has a hydroxyl value of 150 to 300 mgKOH/g, and a cross-linking agent (D) which has a structure represented by the general formula (1).

(In the general formula (1), R 1 and R 2 are C 1 to C 20 alkyl groups, where R 1 and R 2 may be the same as each other or different from each other.)

First claim

1 . A resin composition comprising:
a resin (A) containing a hydroxyl group and a cyanoalkyl group; an epoxy compound (B) having two or more epoxy groups in its molecule; a curing agent (C) having two or more hydroxyl groups in its molecule and having a hydroxyl value of 150 to 300 mgKOH/g; and a cross-linking agent (D) having a structure represented by the following general formula (1), wherein, in the general formula (1), R 1 and R 2 are C 1 to C 20 alkyl groups, where R 1 and R 2 are the same as each other or different from each other.

2 . The resin composition according to claim 1 , wherein the resin (A) is one obtained by cyanoalkylating part of hydroxyl groups contained in a hydroxyl group-containing organic compound.

3 . The resin composition according to claim 2 , wherein the hydroxyl group-containing organic compound is pullulan or a polyvinyl alcohol.

4 . The resin composition according to claim 1 , wherein the epoxy compound (B) is an aromatic hydrocarbon structure-containing epoxy compound having two or more epoxy groups in its molecule.

5 . The resin composition according to claim 1 , wherein the curing agent (C) has phenolic hydroxyl groups as the hydroxyl groups.

6 . The resin composition according to claim 1 , further comprising a phenol compound (E) having a phenolic hydroxyl group in its molecule and having a hydroxyl value of less than 150 mgKOH/g.

7 . The resin composition according to claim 1 , further comprising a curing catalyst (F).

8 . The resin composition according to claim 1 , wherein a ratio of the hydroxyl group and the cyanoalkyl group which are contained in the resin (A) is, by molar ratio of “hydroxyl group:cyanoalkyl group”, 50:50 to 2:98.

9 . The resin composition according to claim 1 , wherein the cross-linking agent (D) is at least one type of compound represented by the following general formulas (2) to (4),
R 1 and R 2 in the general formulas (2) to (4) are same as the general formula (1), R 3 and R 4 in the general formula (3) are C 1 to C 20 alkyl groups, and
all or any of R 1 , R 2 , R 3 , and R 4 in the general formula (3) are the same as each other or different from each other.

10 . A gate insulating film obtained using a resin composition according to claim 1 .

11 . The resin composition according to claim 1 , wherein the cross-linking agent (d) is represented by any one of following formulas (5) to (10).

Assignees

• Zeon Corp

Inventors

• Tsutsumi Takashi

Classifications

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H10D30/6739

  Conductor-insulator-semiconductor electrodes · CPC title

• H01L29/4908

  Electricity · mapped topic

• C08L5/00 Primary

  Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00 · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title