Stress isolated mems device with asic as cap

Patent metadata

Field	Value
Publication number	US-2016159642-A1
Application number	US-201414564340-A
Country	US
Kind code	A1
Filing date	Dec 9, 2014
Priority date	Dec 9, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A package includes a MEMS die and an integrated circuit (IC) die coupled to and stacked with the MEMS die. The MEMS die includes a substrate having a recess formed therein. A cantilevered platform structure of the MEMS die has a platform and an arm suspended over the recess, where the arm is fixed to the substrate. A MEMS device resides on the platform. The IC die is coupled to the MEMS die to serve as a protective cap for MEMS device. The MEMS die may be a pressure sensor die, and the MEMS device residing on the platform may be a sensor diaphragm. Thus, the IC die can include access vents extending through it for passage of a fluid from an external environment so that the sensor diaphragm can detect the pressure of the fluid.

First claim

1 . A package comprising:
a microelectromechanical systems (MEMS) die including:
a substrate having a recess formed therein;
a cantilevered platform structure having a platform and an arm extending from said platform, wherein said platform and said arm are suspended over said recess, and said arm is fixed to said substrate; and
a MEMS device formed on said platform, wherein said MEMS device does not extend beyond an outer perimeter of said platform; and
an integrated circuit (IC) die coupled to and in a stacked relationship with said MEMS die, wherein said IC die is spaced apart from said MEMS die to provide a clearance space between said MEMS device and said IC die.

2 . The package of claim 1 wherein said MEMS die comprises a pressure sensor, and said MEMS device comprises a pressure sensor diaphragm formed on and overlying said platform, said pressure sensor diaphragm being movable relative to said platform.

3 . The package of claim 1 wherein said IC die is coupled to a surface of said substrate surrounding said recess.

4 . The package of claim 1 further comprising through-vias extending through said IC die, said through-vias being electrically interconnected with said MEMS die.

5 . The package of claim 4 further comprising electrical contacts provided on an outer surface of said IC die, wherein said through-vias are electrically connected with said electrical contacts.

6 . The package of claim 5 wherein:
said electrical contacts are first electrical contacts;
said package further comprises a package substrate having second electrical contacts;
said MEMS die comprises a first surface and a second surface, said first surface being coupled to said package substrate; and
said IC die comprises an inner surface opposing said outer surface, said inner surface being coupled to said second surface of said MEMS die such that said MEMS die is interposed between said package substrate and said IC die, wherein bond wires interconnect said first electrical contacts with said second electrical contacts.

7 . The package of claim 1 further comprising an access vent extending through said IC die from an exterior of said package to said clearance space so that said MEMS device is vented to an external environment via said access vent.

8 . The package of claim 7 further comprising a through-via extending through said IC die, said through-via being electrically interconnected with said MEMS die, and said through-via being laterally displaced away from said access vent.

9 . The package of claim 7 further comprising a molded body formed at least partially around said MEMS die and around said IC die, without covering said access vent.

10 . The package of claim 1 further comprising a structural layer fixed to a surface of said substrate surrounding said recess, wherein said cantilevered platform structure extends from said structural layer to reside over said recess, and said arm is a sole attachment point of said platform to said structural layer.

11 . The package of claim 1 wherein said recess has a depth that is less than a thickness of said substrate.

12 . A package comprising:
a pressure sensor die including:
a substrate having a recess formed therein;
a cantilevered platform structure having a platform and an arm extending from said platform, wherein said platform and said arm are suspended over said recess, and said arm is fixed to said substrate; and
a pressure sensor formed on said platform that does not extend beyond an outer perimeter of said platform said pressure sensor including a pressure sensor diaphragm overlying said platform, said pressure sensor diaphragm being movable relative to said platform; and
an integrated circuit (IC) die coupled to and in a stacked relationship with said pressure sensor die, said IC die being spaced apart from said pressure sensor die to provide a clearance space between said pressure sensor diaphragm and said IC die, wherein said IC die includes:
an access vent extending through said IC die from an exterior of said package to said clearance space so that said pressure sensor diaphragm is vented to an external environment via said access vent; and
a through-via extending through said IC die, said through-via being electrically interconnected with said pressure sensor die, and said through-via being laterally displaced away from said access vent.

13 . The package of claim 12 further comprising a structural layer fixed to a surface of said substrate surrounding said recess, wherein said IC die is coupled to said structural layer, said cantilevered platform structure extends from said structural layer to reside over said recess, and said arm is a sole attachment point of said platform to said structural layer.

14 . The package of claim 12 further comprising electrical contacts provided on an outer surface of said IC die, wherein said through-via is electrically connected with said electrical contacts.

15 . The package of claim 14 wherein:
said electrical contacts are first electrical contacts;
said package further comprises a package substrate having second electrical contacts;
said pressure sensor die comprises a first surface and a second surface, said first surface being coupled to said package substrate; and
said IC die comprises an inner surface opposing said outer surface, said inner surface being coupled to said second surface of said pressure sensor die such that said MEMS die is interposed between said package substrate and said IC die, wherein bond wires interconnect said first electrical contacts with said second electrical contacts.

16 . The package of claim 14 further comprising a molded body formed at least partially around said pressure sensor and around said IC die without covering said access vent, wherein said molded body covers said through-via.

17 - 20 . (canceled)

Assignees

• Freescale Semiconductor Inc

Inventors

• Hooper Stephen R
• Dawson Chad S

Classifications

• B81B7/0048

  between the MEMS die and the substrate · CPC title

• B81B7/0058 Primary

  for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations · CPC title

• B81B2207/07

  Interconnects · CPC title

• B81B2203/0118

  Cantilevers · CPC title

• B81B2201/0264

  Pressure sensors · CPC title