Functionalized Metal Oxide Soldering Methods and UV Sensor Manufactured Thereof

Patent metadata

Field	Value
Publication number	US-2016158864-A1
Application number	US-201514623155-A
Country	US
Kind code	A1
Filing date	Feb 16, 2015
Priority date	Dec 3, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

Provided are a method of soldering a functionalized metal oxide, and an electronic device manufactured thereby, and more particularly, a method of soldering a functionalized metal oxide which is capable of growing a solder structure by a hydrothermal synthesis method using a pulsed laser, and is usable in a UV sensor, and an electronic device manufactured thereby. According to the present invention, thermal diffusion generated from a laser is limited due to the use of a pulsed laser, and thus, nanosolder having high density and a shape to be precisely adjustable may be prepared by a hydrothermal synthesis method by the pulsed laser, thereby facilitating the joining of the nanostructure, and further, the nanosolder is formed between the nanostructures, thereby being usable as a metal oxide structure having functionality.

First claim

What is claimed is:

1 . A method of soldering a functionalized metal oxide comprising:
forming nanostructures on a substrate; dipping the substrate on which the nanostructures are formed in a precursor solution for hydrothermal synthesis; and irradiating the nanostructures with a pulsed laser to form a solder bump.

2 . The method of claim 1 , wherein two or more nanostructures are formed on the substrate, and any one of the two or more nanostructures is irradiated with the pulsed laser to produce and grow the solder bump, so that the two or more nanostructures are connected to each other by the grown solder bump.

3 . The method of claim 1 , wherein the nanostructures have a light absorption layer for absorbing light energy of the laser, formed on at least a portion thereof.

4 . The method of claim 1 , wherein the precursor solution for hydrothermal synthesis is a mixed solution of an aqueous precursor solution and an aqueous amine compound solution.

5 . The method of claim 4 , wherein the aqueous precursor solution includes any one of metal precursors and semiconductor precursors.

6 . The method of claim 4 , wherein the amine compound is one or more selected from the group consisting of hexamethyleneamine, hexamethylenetetramine (HMT), cyclohexylamine, monoethanolamine, diethanolamine, and triethanolamine.

7 . The method of claim 3 , wherein as the light absorption layer, different materials are used depending on a wavelength of the laser.

8 . The method of claim 3 , wherein the light absorption layer is one selected from the group consisting of metals and semiconductors.

9 . The method of claim 2 , further comprising annealing the solder bump, after the forming of the solder bump.

10 . The method of claim 1 , wherein the pulsed laser has a pulse duty ratio of 5% to 20%.

11 . The method of claim 1 , wherein the pulsed laser has a pulse width controlled in a range of 100 ns to 3000 ns.

12 . The method of claim 1 , wherein the pulsed laser has peak power controlled in a range of 5 mW/μm 2 to 20 mW/μm 2 , in case where an oxide film having a thickness of 50 nm, and a tungsten absorption layer having a thickness of 40 nm are deposited on a silicon substrate under a normal pressure.

13 . The method of claim 1 , further comprising covering the substrate with a transparent substrate, after the dipping of the substrate on which the nanostructures are formed in a precursor solution for hydrothermal synthesis.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Yu Kyoungsik
• Kwon Kyungmook
• Shim Jaeho
• Choi Kyunghan

Classifications

• C23C18/143

  Radiation by light, e.g. photolysis or pyrolysis · CPC title

• C23C18/1216

  Metal oxides (C23C18/1212 takes precedence) · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title

• B23K1/20 Primary

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H10W72/07236

  Soldering or alloying · CPC title