Light-Emitting Device, Electronic Device, Lighting Device, and Method for Manufacturing the Light-Emitting Device

Patent metadata

Field	Value
Publication number	US-2016155993-A1
Application number	US-201615014715-A
Country	US
Kind code	A1
Filing date	Feb 3, 2016
Priority date	Aug 26, 2011
Publication date	Jun 2, 2016
Grant date	—

Abstract

A light-emitting device in which deterioration of an organic EL element due to impurities such as moisture or oxygen is suppressed is provided. The light-emitting device includes a first substrate and a second substrate facing each other, a light-emitting element provided over the first substrate, a first sealant provided so as to surround the light-emitting element, and a second sealant provided so as to surround the first sealant. One of the first sealant and the second sealant is a glass layer and the other is a resin layer. A dry agent is provided in a first space surrounded by the first sealant, the second sealant, the first substrate, and the second substrate, or in the resin layer. The light-emitting element is included in a second space surrounded by the first sealant, the first substrate, and the second substrate.

First claim

What is claimed is:

1 - 14 . (canceled)

15 . A method for manufacturing a light-emitting device, comprising the steps of:
providing a first electrode over a first substrate, a layer containing a light-emitting organic compound over the first electrode, and a second electrode over the layer to form a light-emitting element, whereby a light-emitting portion is formed; applying a frit paste over a second substrate and heating to form a glass layer; applying a resin including a dry agent over the second substrate in an inert atmosphere to form a resin layer; providing the first substrate and the second substrate so as to face each other; irradiating the resin layer with light under reduced pressure to form a closed space surrounded by the resin layer, the first substrate, and the second substrate; and irradiating the glass layer with laser light in the air to form a closed space surrounded by the glass layer, the first substrate, and the second substrate, wherein the glass layer is provided so as to surround the light-emitting portion and the resin layer is provided so as to surround the glass layer.

16 . The method for manufacturing a light-emitting device, according to claim 15 , wherein the resin layer comprises a photocurable resin.

17 . The method for manufacturing a light-emitting device, according to claim 15 , wherein the step of irradiating the glass layer with laser light is performed from the second substrate side.

18 . The method for manufacturing a light-emitting device, according to claim 15 , further comprising a step of heat treatment before the step of irradiating the glass layer with laser light.

19 . The method for manufacturing a light-emitting device, according to claim 15 , wherein the frit paste comprises an absorber which absorbs light having a wavelength of the laser light.

20 . The method for manufacturing a light-emitting device, according to claim 15 , further comprising a step of planarizing a top surface of the glass layer.

21 . The method for manufacturing a light-emitting device, according to claim 15 , wherein the step of irradiating the resin layer with light is performed with use of a shielding plate.

22 . A method for manufacturing a light-emitting device, comprising the steps of:
providing a first electrode over a first substrate, a layer containing a light-emitting organic compound over the first electrode, and a second electrode over the layer to form a light-emitting element, whereby a light-emitting portion is formed; applying a fit paste over a second substrate and heating to form a glass layer; applying a resin including a first dry agent over the second substrate in an inert atmosphere to form a resin layer; providing a second dry agent over the second substrate; providing the first substrate and the second substrate so as to face each other; irradiating the resin layer with light under reduced pressure to form a closed space surrounded by the resin layer, the first substrate, and the second substrate; and irradiating the glass layer with laser light in the air to form a closed space surrounded by the glass layer, the first substrate, and the second substrate, wherein the glass layer is provided so as to surround the light-emitting portion and the resin layer is provided so as to surround the glass layer.

23 . The method for manufacturing a light-emitting device, according to claim 22 , wherein the resin layer comprises a photocurable resin.

24 . The method for manufacturing a light-emitting device, according to claim 22 , wherein the step of irradiating the glass layer with laser light is performed from the second substrate side.

25 . The method for manufacturing a light-emitting device, according to claim 22 , further comprising a step of heat treatment before the step of irradiating the glass layer with laser light.

26 . The method for manufacturing a light-emitting device, according to claim 22 , wherein the fit paste comprises an absorber which absorbs light having a wavelength of the laser light.

27 . The method for manufacturing a light-emitting device, according to claim 22 , further comprising a step of planarizing a top surface of the glass layer.

28 . The method for manufacturing a light-emitting device, according to claim 22 , wherein the step of irradiating the resin layer with light is performed with use of a shielding plate.

Assignees

• Semiconductor Energy Lab

Inventors

• Nishido Yusuke
• Yamazaki Shunpei

Classifications

• H10K59/874

  including getter material or desiccant · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H05B33/04 Primary

  Sealing arrangements {, e.g. against humidity} · CPC title

• H01L51/56 Primary

  Electricity · mapped topic