Method for manufacturing display device
US-2024393634-A1 · Nov 28, 2024 · US
US2016154261A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016154261-A1 |
| Application number | US-201514745067-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 19, 2015 |
| Priority date | Nov 28, 2014 |
| Publication date | Jun 2, 2016 |
| Grant date | — |
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A display device and a method of manufacturing the display device are provided. The display device includes a display panel having a first substrate and a second substrate bonded to the first substrate and in which a display area displaying an image and a non-display area extending towards the outside of the display area are formed; a sealant arranged between the first substrate and the second substrate and surrounding the display area; wirings arranged on the first substrate; and a black matrix arranged on the second substrate, wherein a heat energy passing portion through which a heat energy applied from the outside towards the sealant passes is formed in the display panel.
Opening claim text (preview).
What is claimed is: 1 . A display device comprising: a display panel having a first substrate and a second substrate bonded to the first substrate and in which a display area displaying an image and a non-display area extending towards the outside of the display area are formed; a sealant arranged between the first substrate and the second substrate and surrounding the display area; wirings arranged on the first substrate; and a black matrix arranged on the second substrate, a heat energy passing portion through which a heat energy applied from the outside towards the sealant passes is formed in the display panel. 2 . The display device of claim 1 , at least a portion of the black matrix vertically overlaps the sealant, and the heat energy passing portion is a space generated by removing the portion of the black matrix overlapping the sealant. 3 . The display device of claim 2 , a heat energy blocking portion is formed on the first substrate in a pathway of the heat energy passing from an upper portion of the second substrate through the heat energy passing portion. 4 . The display device of claim 3 , the heat energy blocking portion has a dam shape formed of a polymer resin. 5 . The display device of claim 3 , the heat energy blocking portion is a blue photoresist. 6 . The display device of claim 2 , an over-coating layer completely covering the black matrix is further formed on the second substrate, and a common electrode is formed on the over-coating layer. 7 . The display device of claim 1 , the sealant has a black color. 8 . The display device of claim 1 , the wirings are arranged below the sealant, a passivation layer covering the wirings are formed between the wirings and the sealant, and the heat energy passing portion is a space generated by removing a portion of the wirings. 9 . The display device of claim 8 , the black matrix is located on the second substrate in a pathway of the heat energy passing from a bottom portion of the first substrate through the heat energy passing portion. 10 . The display device of claim 9 , an over-coating layer completely covering the black matrix is further formed on the second substrate, a common electrode is formed on the over-coating layer, and and the common electrode is electrically connected to the wirings through a short point. 11 . The display device of claim 10 , the sealant includes a material having electrical conductivity, and the sealant and the wirings are electrically connected to each other by a connection portion in order to form the short point between the common electrode and the wirings. 12 . The display device of claim 10 , an electrically conductive spacer is provided between the first substrate and the second substrate, and the common electrode and the wirings are electrically connected to each other by the electrically conductive spacer in order to form the short point between the common electrode and the wirings. 13 . The display device of claim 10 , widths of the wirings increase in order from the wirings adjacent to the heat energy passing portion to the wirings apart from the heat energy passing portion. 14 . The display device of claim 10 , gaps between the wirings increase in order from the wirings adjacent to the heat energy passing portion to the wirings apart from the heat energy passing portion. 15 . The display device of claim 1 , a liquid crystal is formed between the first substrate and the second substrate, and the display device further comprises a liquid crystal display in which a backlight unit irradiating light towards the display panel is provided, below the display panel. 16 . A method of manufacturing a display device, the method comprising: preparing a display panel in which a display area and a non-display area extending toward the outside of the display area are formed and which has a first substrate on which wirings are arranged and a second substrate on which a black matrix is formed; forming a sealant between the first substrate and the second substrate and bonding the first substrate and the second substrate; and cutting the first substrate and the second substrate by applying a heat energy, a heat energy passing portion through which the heat energy applied from the outside towards the sealant passes is formed in the display panel, and the heat energy passes through the heat energy passing portion and is applied to a portion in which the sealant is formed. 17 . The method of claim 16 , at least a portion of the black matrix overlaps the sealant, the heat energy passing portion is a space generated by removing the portion of the black matrix overlapping the sealant, and the heat energy is applied to the sealant by passing from the outside of the second substrate through the space generated by removing the black matrix. 18 . The method of claim 17 , a heat energy blocking portion is further formed on the first substrate in a pathway of the heat energy passing from an upper portion of the second substrate through the heat energy passing portion. 19 . The method of claim 16 , the wirings are arranged below the sealant, a passivation layer covering the wirings is formed between the wirings and the sealant, the heat energy passing portion is a space generated by removing a portion of the wirings, and the heat energy is applied to the sealant by passing from an outside of the first substrate through the space generated by removing the wirings. 20 . The method of claim 19 , the black matrix is located on the second substrate in a pathway of the heat energy passing from a bottom portion of the first substrate through the heat energy passing portion.
Manufacturing of individual cells out of a plurality of cells, e.g. by dicing · CPC title
Light shielding layers, e.g. black matrix (G02F1/136209 takes precedence) · CPC title
Gaskets; Spacers; Sealing of cells · CPC title
characterised by their geometrical arrangement · CPC title
Direct backlight · CPC title
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