Transparent conductive laminated film, method for manufacturing same, and touch panel

Patent metadata

Field	Value
Publication number	US-2016152002-A1
Application number	US-201314392175-A
Country	US
Kind code	A1
Filing date	Oct 17, 2013
Priority date	Jun 24, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

A transparent conductive laminated film, comprising a laminated film comprising a plurality of transparent film substrates and a transparent cured adhesive layer having a storage modulus of 1×107 Pa or more at 140° C., wherein the plurality of transparent film substrates include a first transparent film substrate and a second transparent film substrate and are laminated with the transparent cured adhesive layer interposed between adjacent ones of the film substrates; and, a first transparent conductive layer provided on a surface of the first film substrate opposite to the transparent cured adhesive layer.

First claim

1 . A transparent conductive laminated film, comprising:
a laminated film comprising a plurality of transparent film substrates and a transparent cured adhesive layer having a storage modulus of 1×10 7 Pa or more at 140° C., wherein the plurality of transparent film substrates include a first transparent film substrate and a second transparent film substrate and are laminated with the transparent cured adhesive layer interposed between adjacent ones of the film substrates; and a first transparent conductive layer provided on a surface of the first film substrate opposite to the transparent cured adhesive layer.

2 . The transparent conductive laminated film according to claim 1 , wherein there is a difference in shrinkage rate of 0.3% or less between the transparent conductive laminated film and the laminated film after the film is heat-treated at 140° C. for 30 minutes.

3 . The transparent conductive laminated film according to claim 1 , wherein the transparent cured adhesive layer is made from an active energy ray-curable adhesive composition comprising, as curable components, (A) a radically polymerizable compound with an SP value of 29.0 (kJ/m 3 ) 1/2 to 32.0 (kJ/m 3 ) 1/2 , (B) a radically polymerizable compound with an SP value of 18.0 (kJ/m 3 ) 1/2 to less than 21.0 (kJ/m 3 ) 1/2 , and (C) a radically polymerizable compound with an SP value of 21.0 (kJ/m 3 ) 1/2 to 23.0 (kJ/m 3 ) 1/2 , wherein the content of the radically polymerizable compound (B) is from 25 to 80% by weight based on 100% by weight of the total amount of the composition.

4 . The transparent conductive laminated film according to claim 3 , wherein the active energy ray-curable adhesive composition further comprises (D) an acrylic oligomer formed by polymerization of a (meth)acrylic monomer.

5 . The transparent conductive laminated film according to claim 4 , wherein the active energy ray-curable composition contains 20% by weight or less of the acrylic oligomer (D) formed by polymerization of a (meth)acrylic monomer based on 100% by weight of the total amount of the composition.

6 . The transparent conductive laminated film according to claim 3 , wherein the active energy ray-curable adhesive composition contains 3 to 40% by weight of the radically polymerizable compound (A) and 5 to 55% by weight of the radically polymerizable compound (C) based on 100% by weight of the total amount of the composition.

7 . The transparent conductive laminated film according to claim 3 , wherein the active energy ray-curable adhesive composition comprises the radically polymerizable compounds (A), (B), and (C) in a total amount of 85 parts by weight or more and further comprises 15 parts by weight or less of (E) a radically polymerizable compound with an SP value of more than 23.0 (kJ/m 3 ) 1/2 to less than 29.0 (kJ/m 3 ) 1/2 based on 100 parts by weight of the total amount of the radically polymerizable compounds.

8 . The transparent conductive laminated film according to claim 1 , wherein the active energy ray-curable adhesive composition further comprises (F) a radically polymerizable compound having an active methylene group and (G) a radical polymerization initiator having a hydrogen-withdrawing function.

9 . The transparent conductive laminated film according to claim 8 , wherein the active methylene group is an acetoacetyl group.

10 . The transparent conductive laminated film according to claim 8 , wherein the radically polymerizable compound (F) having an active methylene group is acetoacetoxyalkyl(meth)acrylate.

11 . The transparent conductive laminated film according to claim 8 , wherein the radical polymerization initiator (F) is a thioxanthone radical polymerization initiator.

12 . The transparent conductive laminated film according to claim 8 , wherein the active energy ray-curable adhesive composition contains 1 to 50% by weight of the radically polymerizable compound (F) having an active methylene group and 0.1 to 10% by weight of the radical polymerization initiator (G) based on 100% by weight of the total amount of the composition.

13 . The transparent conductive laminated film according to claim 1 , wherein the active energy ray-curable adhesive composition further comprises (H) a photo-acid generator.

14 . The transparent conductive laminated film according to claim 13 , wherein the photo-acid generator (H) includes a photo-acid generator having at least one counter anion selected from the group consisting of PF 6 − , SbF 6 − , and AsF 6 − .

15 . The transparent conductive laminated film according to claim 1 , wherein the active energy ray-curable adhesive composition further comprises (I) a compound having either an alkoxy group or an epoxy group in addition to the photo-acid generator (H).

16 . The transparent conductive laminated film according to claim 1 , wherein the active energy ray-curable adhesive composition further comprises (J) an amino group-containing silane coupling agent.

17 . The transparent conductive laminated film according to claim 16 , wherein the active energy ray-curable adhesive composition contains 0.01 to 20% by weight of the amino group-containing silane coupling agent (J) based on 100% by weight of the total amount of the composition.

18 . The transparent conductive laminated film according to claim 1 , wherein the first film substrate has a thickness of 15 μm to 75 μm.

19 . The transparent conductive laminated film according to claim 1 , wherein the transparent cured adhesive layer has a thickness of 0.01 μm to 10 μm.

20 . The transparent conductive laminated film according to claim 1 , further comprising a second transparent conductive layer on a surface of the laminated film opposite to the first transparent conductive layer.

21 . The transparent conductive laminated film according to claim 1 , wherein the film substrates are made of any one of a polyester resin, a cyclic polyolefin resin, or a polycarbonate resin.

22 . The transparent conductive laminated film according to claim 1 , wherein the transparent conductive layer is made of any one of indium tin oxide or indium zinc oxide.

23 . The transparent conductive laminated film according to claim 1 , wherein the transparent conductive layer is crystallized.

24 . The transparent conductive laminated film according to claim 1 , wherein the transparent conductive layer is patterned.

25 . A touch panel comprising at least one piece of the transparent conductive laminated film according to claim 1 .

26 . A method for producing the transparent conductive laminated film according to claim 1 , the method comprising the steps of:
(a) preparing a transparent conductive film comprising a first film substrate and a first transparent conductive layer provided on one surface of the first film substrate; (b) bonding a second film substrate to another surface of the first film substrate with a transparent uncured adhesive layer, wherein the another surface of the first film substrate is opposite to the surface on which the first transparent conductive layer is provided, and the transparent uncured adhesive layer is capable of forming a transparent cured adhesive layer having a storage modulus of 1×10 7 Pa or more at 140° C. when cured; and (c) curing the transparent uncured adhesive layer.

27 . The method according to claim 26 , further comprising the step (d) of heat-treating the transparent co

Assignees

• Nitto Denko Corp

Inventors

• Inui Kunihiro
• Saito Takeshi
• Okamoto Miki
• Akizuki Shinsuke

Classifications

• B32B37/0015

  to avoid warp or curl · CPC title

• B32B27/36

  comprising polyesters · CPC title

• B32B2037/1253

  curable adhesive · CPC title

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title

• C09J4/00

  Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title