Printed circuit board copper plane repair

Patent metadata

Field	Value
Publication number	US-2016150647-A1
Application number	US-201615010480-A
Country	US
Kind code	A1
Filing date	Jan 29, 2016
Priority date	Dec 31, 2013
Publication date	May 26, 2016
Grant date	—

Abstract

A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

First claim

What is claimed is:

1 . An assembly, comprising:
a printed circuit board having:
a back side,
a first number of insulating layers,
a second number of printed circuit board conductive layers,
at least two conductive vias that penetrate into the printed circuit board, and
a plurality of apertures, each substantially concentric with a respective one of the conductive vias and which partially penetrates the printed circuit board from the back side, wherein at least two of the plurality of apertures have an upper region having a first diameter and a lower region having a second diameter, the first diameter being smaller than the second diameter; and
a device having:
a base with a mounting surface with a length; and
a plurality of stacks on the base, each stack with:
one or more diameters, each diameter smaller than the length and fastened to the mounting surface,
a plurality of stack conductive layers made substantially of copper, wherein at least one stack conductive layer in the plurality of stack conductive layers further comprises a stack conductive assembly having a top disk, a bottom disk, and an expansive element positioned between and attached to the top disk and the bottom disk, the expansive element being selected from a group consisting of a plurality of spheres, a plurality of cylinders, a plurality of flexible ribbons, and a plurality of fins, and
a plurality of insulating layers separating each of the plurality of stack conductive layers in a manner configured to align the plurality of stack conductive layers with corresponding printed circuit board conductive layers in the printed circuit board when the stack is inserted into one of the apertures in the printed circuit board,

wherein at least a first stack of the plurality of stacks includes:
an upper stack region with a third diameter and a first edge; and
a lower stack region with a fourth diameter larger than the third diameter of the upper stack region, a second edge, and an interfacial surface, the interfacial surface being located at a boundary position between one of the plurality of stack conductive layers and one of the plurality of insulating layers,
the at least first stack having:
a corner where the first edge meets the interfacial surface, and
a shoulder where the second edge of the lower stack region meets the interfacial surface,

wherein at least a second stack of the plurality of stacks includes:
an upper stack region with a fifth diameter and a first edge;
a lower stack region with a sixth diameter larger than the fifth diameter of the upper stack region, a second edge, and an interfacial surface,
the at least second stack having:
a corner where the first edge meets the interfacial surface, and
a shoulder where the second edge of the lower stack region meets the interfacial surface, and

a stepped layer having:
an upper layer part with the fifth diameter and the first edge of the upper stack region,
a lower layer part with the sixth diameter and the second edge of the lower stack region, and
the interfacial surface, wherein the stepped layer is one of the plurality of stack conductive layers,

the plurality of stacks on the device being positioned to concentrically penetrate respective ones of the at least two apertures in the printed circuit board, wherein at least one of the plurality of stack conductive layers of at least one of the stacks makes electrical contact with at least one printed circuit board conductive layer in the printed circuit board.

Assignees

• IBM

Inventors

• Bohra Mahesh
• Chun Sungjun
• Montanez Jesus
• Rodriguez Daniel I

Classifications

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/144 Primary

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/325

  by abutting or pinching; Mechanical auxiliary parts therefor · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title