Method of forming a light emitting diode structure and a light diode structure

US2016149084A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016149084-A1
Application numberUS-201514918342-A
CountryUS
Kind codeA1
Filing dateOct 20, 2015
Priority dateMay 18, 2010
Publication dateMay 26, 2016
Grant date

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  1. Title

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  5. First independent claim

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Abstract

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A method of forming a vertical III-nitride based light emitting diode structure 5 and a vertical III-nitride based light emitting diode structure can be provided. The method comprises forming a III-nitride based light emitting structure on a silicon-oninsulator (SOI) substrate; forming a metal-based electrode structure on the III-nitride based light emitting structure; and removing the SOI substrate by a layer transfer process such that the metal-based electrode structure functions as a metal-based 10 substrate of the light emitting structure.

First claim

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1 - 24 . (canceled) 25 . A vertical III-nitride based light emitting diode structure, the structure comprising, a III-nitride based light emitting structure for light emission formed on a metal-based substrate; wherein the III-nitride based light emitting diode structure is formed by layer transfer from a patterned silicon-on-insulator (SOI) substrate, and wherein a Group III metal content in the vertical III-nitride based light emitting diode structure is inhomogeneous for modulating light emission of the light emitting diode structure. 26 . The structure as claimed in claim 25 , further comprising a metal seed layer formed between the III-nitride based light emitting structure and the metal-based substrate for facilitating the layer transfer. 27 . The structure as claimed in claim 26 , wherein the seed layer comprises nickel having a thickness ranging from about 100 nm to about 1000 nm. 28 . The structure of claim 26 , wherein the seed layer is bonded to the metal-based substrate using electroplating, electroless deposition or both. 29 . (canceled) 30 . The structure of claim 25 , further comprising a reflective mirror layer capable of functioning as a p-type contact electrode, the mirror layer being formed between the metal-based substrate and the III-nitride based light emitting structure. 31 . The structure as claimed in claim 25 , wherein the reflective mirror layer comprises a plurality of layers selected from a group of material consisting of nickel, gold, platinum, silver, palladium and ruthenium. 32 . The structure of claim 25 , further comprising photonic crystal (PhC) structures formed on an n-doped III-nitride layer of the III-nitride based light emitting diode structure, the PhC structures having lateral and vertical dimensions of less than about 400 nm. 33 . The structure of claim 25 , further comprising photonic crystal (PhC) structures formed on an n-doped III-nitride layer of the III-nitride based light emitting diode structure by nanoscale surface patterning to create periodic patterns selected from a group consisting of nanopillars, nanoholes and nanopyramid structures. 34 . The structure of claim 25 , further comprising an n-type contact electrode structure formed on the III-nitride based light emitting structure. 35 . The structure as claimed in claim 34 , wherein the n-type contact electrode structure comprises a plurality of layers selected from a group of material consisting of titanium, aluminium, gold, chromium and nickel. 36 . An III-nitride based light emitting diode structure, the structure comprising, a patterned buried oxide layer of a silicon-on-insulator (SOI) substrate; a III-nitride based light emitting structure for light emission formed on the patterned SOI substrate; and wherein a Group III metal content in the active layers of the III-nitride based light emitting structure is inhomogeneous for modulating an emission of the light emitting diode structure. 37 . The structure of claim 36 , wherein the III-nitride based light emitting structure comprises one or more nitride-based buffer layers formed directly on the patterned SOI substrate. 38 - 39 . (canceled)

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Classifications

  • Periodic patterns for optical field-shaping, e.g. photonic bandgap structures · CPC title

  • characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping · CPC title

  • the light-emitting regions comprising nitride materials · CPC title

  • Reflective materials · CPC title

  • of the light-emitting regions, e.g. non-planar junctions · CPC title

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What does patent US2016149084A1 cover?
A method of forming a vertical III-nitride based light emitting diode structure 5 and a vertical III-nitride based light emitting diode structure can be provided. The method comprises forming a III-nitride based light emitting structure on a silicon-oninsulator (SOI) substrate; forming a metal-based electrode structure on the III-nitride based light emitting structure; and removing the SOI subs…
Who is the assignee on this patent?
Agency Science Tech & Res
What technology area does this patent fall under?
Primary CPC classification H10H20/01335. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu May 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).