Light-emitting element having an optical function film including a reflection layer

Patent metadata

Field	Value
Publication number	US-2016148973-A1
Application number	US-201615007362-A
Country	US
Kind code	A1
Filing date	Jan 27, 2016
Priority date	Aug 7, 2013
Publication date	May 26, 2016
Grant date	—

Abstract

A light-emitting element includes a light-emitting layer, and an optical function film. The light-emitting layer is configured to include a first plane with a first electrode, a second plane with a second electrode, and a circumferential plane connecting the first and second planes, the second plane being opposing to the first plane, and the light-emitting layer being made of a semiconductor. The optical function film is configured to include a reflection layer being able to reflect light coming from the light-emitting layer, the reflection layer being provided with first and second regions, the first region covering the second plane and the circumferential plane, the second region protruding from the first region to an outside of the light-emitting layer to expose an end plane thereof.

First claim

What is claimed is:

1 . A light-emitting-element wafer, comprising:
a support substrate; and a plurality of light-emitting elements each configured to include
a light-emitting layer configured to include a first plane with a first electrode, a second plane with a second electrode, and a circumferential plane connecting the first and second planes, the second plane being opposing to the first plane, and the light-emitting layer being made of a semiconductor, and
an optical function film configured to include a reflection layer being able to reflect light coming from the light-emitting layer, the reflection layer being provided with first and second regions, the first region covering the second plane and the circumferential plane, the second region protruding from the first region to an outside of the light-emitting layer to expose an end plane thereof, and
to be arranged on the support substrate, the support substrate being opposing to the second plane with the optical function film being sandwiched therebetween.

2 . The light-emitting-element wafer according to claim 1 , further comprising:
an attachment layer configured to attach the support substrate and the plurality of light-emitting elements.

3 . The light-emitting element wafer according to claim 1 , wherein
the optical function film further includes
a first insulation layer formed between the light-emitting layer and the reflection layer, and
a second insulation layer formed on the reflection layer.

4 . The light-emitting element wafer according to claim 1 , wherein
the second region protrudes in a direction parallel to the first plane.

5 . The light-emitting element wafer according to claim 1 , wherein
the second region protrudes in a direction parallel to the circumferential plane.

6 . The light-emitting element wafer according to claim 1 , further comprising:
an inorganic insulation film configured to cover the first plane.

7 . The light-emitting element wafer according to claim 1 , wherein
the first plane is in a concave-convex structure.

8 . The light-emitting element wafer according to claim 1 , wherein
the first plane is formed to be larger than the second plane.

9 . The light-emitting element wafer according to claim 8 , wherein
the first region includes first and second reflection planes, the first reflection plane being opposing to the second plane, the second reflection plane being opposing to the circumferential plane, and
the second reflection plane forms a first tilt angle with the first plane, and the circumferential plane forms a second tilt angle with the first plane, the first tilt angle being smaller than the second tilt angle.

10 . The light-emitting element wafer according to claim 1 , wherein
the light-emitting layer emits red light.

11 . The light-emitting element wafer according to claim 10 , wherein
the semiconductor includes at least any one of an AsP compound semiconductor, an AlGaInP compound semiconductor, and a GaAs compound semiconductor.

12 . The light-emitting element wafer according to claim 1 , wherein the reflection layer includes a metallic material.

13 . An electronic apparatus, comprising:
a substrate formed with a driving circuit; and at least one first semiconductor light-emitting element configured to include
a light-emitting layer configured to include a first plane with a first electrode connected to the driving circuit, a second plane with a second electrode connected to the driving circuit, and a circumferential plane connecting the first and second planes, the second plane being opposing to the first plane, and the light-emitting layer being made of a semiconductor, and
an optical function film configured to include a reflection layer being able to reflect light coming from the light-emitting layer, the reflection layer being provided with first and second regions, the first region covering the second plane and the circumferential plane, the second region protruding from the first region to an outside of the light-emitting layer to expose an end plane thereof, and
to be arranged on the substrate, the substrate being opposing to the second plane with the optical function film being sandwiched therebetween.

14 . The electronic apparatus according to claim 13 , wherein
the first semiconductor light-emitting element and other first semiconductor light-emitting elements emit red light, the electronic apparatus further includes
a plurality of second semiconductor light-emitting elements that emit blue right, and
a plurality of third semiconductor light-emitting elements that emit green light, and
the first, second, and third semiconductor light-emitting elements are arranged on the substrate.

15 . The electronic apparatus according to claim 13 , wherein
the optical function film further includes
a first insulation layer formed between the light-emitting layer and the reflection layer, and
a second insulation layer formed on the reflection layer.

Assignees

• Sony Corp

Inventors

• Saito Daisuke
• Naito Hiroki
• Aoki Sayaka
• Kobayashi Arata
• Sakoda Gen

Classifications

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/82

  Roughened surfaces, e.g. at the interface between epitaxial layers · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/841 Primary

  Reflective coatings, e.g. dielectric Bragg reflectors · CPC title

• H10H20/822

  Materials of the light-emitting regions · CPC title