Metrology method and apparatus

US2016146740A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016146740-A1
Application numberUS-201514945257-A
CountryUS
Kind codeA1
Filing dateNov 18, 2015
Priority dateNov 21, 2014
Publication dateMay 26, 2016
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method to determine an overlay error between a first structure and a second structure, wherein the first structure and second structures are on different layers on a substrate and are imaged onto the substrate by a lithographic process, the method comprising: obtaining an apparent overlay error; obtaining a systematic error caused by a factor other than misalignment of the first and second structures; and determining the overlay error by removing the systematic error from the apparent overlay error. The method may alternatively comprise obtaining apparent characteristics of diffraction orders of diffraction by an overlapping portion of the first and second structures; obtaining corrected characteristics of the diffraction orders; determining the overlay error from the corrected characteristics; and adjusting a characteristic of the lithographic process based on the overlay error.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method to determine an overlay error between a first structure and a second structure, wherein the first structure and second structures are on different layers on a substrate and are imaged onto the substrate by a lithographic process, the method comprising: obtaining an apparent overlay error; obtaining a systematic error caused by a factor other than misalignment of the first and second structures; and determining the overlay error by removing the systematic error from the apparent overlay error. 2 . The method of claim 1 , wherein obtaining the systematic error comprises determining the systematic error after the first structure is fabricated and before the second structure is fabricated. 3 . The method of claim 1 , wherein obtaining the systematic error comprises determining the systematic error after both the first and second structures are fabricated. 4 . The method of claim 1 , wherein part of the first structure but not part of the second structure is in a first area, wherein parts of both the first and second structures are in a third area. 5 . The method of claim 4 , wherein part of the second structure but not part of the first structure is in a second area. 6 . The method of claim 4 , wherein obtaining the systematic error comprises obtaining an apparent characteristic of diffraction orders of both the first and second structures in the third area, and a characteristic of the first structure in the first area. 7 . The method of claim 5 , wherein obtaining the systematic error comprises obtaining an apparent characteristic of diffraction orders of both the first and second structures in the third area, a characteristic of the first structure in the first area, and a characteristic of the second structure in the second area. 8 . The method of claim 6 , wherein the characteristic of the first structure comprises periodicity, shape, size or a combination thereof, of the first structure; or wherein the characteristic of the second structure comprises periodicity, shape, size or a combination thereof, of the second structure. 9 . The method of claim 1 , wherein the first structure is a first grating at least partially overlapping the second structure, and/or wherein the second structure is a second grating at least partially overlapped by the first structure. 10 . The method of claim 1 , wherein obtaining the apparent overlay error comprises interpolating or extrapolating from a fitted curve. 11 . The method of claim 1 , further comprising adjusting a characteristic of the lithographic process based on the overlay error. 12 . A method to determine an overlay error between a first structure and a second structure, wherein the first structure and second structures are on different layers on a substrate and are imaged onto the substrate by a lithographic process, the method comprising: obtaining an apparent characteristic of diffraction orders of diffraction by an overlapping portion of the first and second structures; obtaining a corrected characteristic of the diffraction orders; and determining the overlay error from the corrected characteristic. 13 . The method of claim 12 , wherein obtaining the corrected characteristic comprises subtracting from the apparent characteristic a contribution of a factor other than misalignment of the first and second structures. 14 . The method of claim 12 , wherein obtaining the corrected characteristic comprises determining the contribution after the first structure is fabricated and before the second structure is fabricated. 15 . The method of claim 12 , wherein obtaining the corrected characteristic comprises determining the contribution after both the first and second structures are fabricated. 16 . The method of claim 12 , wherein part of the first structure but not part of the second structure is in a first area, wherein parts of both the first and second structures are in a third area. 17 . The method of claim 12 , wherein the first structure is a first grating at least partially overlapping the second structure, and/or wherein the second structure is a second grating at least partially overlapped by the first structure. 18 . The method of claim 12 , wherein obtaining the apparent characteristic comprises optically measuring diffraction. 19 . The method of claim 12 , further comprising adjusting a characteristic of the lithographic process based on the overlay error. 20 . A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer implementing the method of claim 1 .

Assignees

Inventors

Classifications

  • using photoelectric detection means · CPC title

  • Specially adapted optical and illumination features · CPC title

  • Dark field detection · CPC title

  • Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

  • Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors · CPC title

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What does patent US2016146740A1 cover?
A method to determine an overlay error between a first structure and a second structure, wherein the first structure and second structures are on different layers on a substrate and are imaged onto the substrate by a lithographic process, the method comprising: obtaining an apparent overlay error; obtaining a systematic error caused by a factor other than misalignment of the first and second st…
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G01N21/8806. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu May 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).