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Etch rate enhancement at low temperatures
US2016145149A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016145149-A1 |
| Application number | US-201414899602-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 20, 2014 |
| Priority date | Jun 21, 2013 |
| Publication date | May 26, 2016 |
| Grant date | — |
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- Title
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Abstract
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A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO 3 , and at least 10% H 3 PO 4 by volume constituted such that the ratio HF:HNO 3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.
First claim
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1 . A method of etching a glass material comprising: providing an etchant comprising 10-30% HF, 5-15% HNO 3 , and at least 10% H 3 PO 4 by volume further wherein the ratio HF:HNO 3 by volume is in the range of 1.7:1 to 2.3:1; providing a glass material to be etched; and contacting the glass material with the etchant. 2 . The method according to claim 1 , further comprising the step of controlling the temperature of the etchant to a temperature within the range of 20-30° C. 3 . The method according to claim 1 , wherein the step of providing a glass material to be etched comprises providing an aluminosilicate glass material to be etched. 4 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant wherein the ratio HF:HNO 3 by volume is in the range of 1.8:1 to 2.2:1. 5 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant wherein the ratio HF:HNO 3 by volume is in the range of 1.9:1 to 2.1:1. 6 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant wherein the ratio HF:HNO 3 by volume is in the range of 1.95:1 to 2.05:1. 7 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant comprising at least 20% H 3 PO 4 . 8 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant comprising at least 40% H 3 PO 4 . 9 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant comprising 15-25% HF and 7.5-12.5% HNO 3 . 10 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant comprising 19-21% HF and 9.5-10.5% HNO 3 . 11 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant containing only three acid components: HF, HNO 3 , and H 3 PO 4 . 12 . The method according to claim 1 wherein the step of providing an etchant comprises providing an etchant containing only water and three acid components: HF, HNO 3 , and H 3 PO 4 . 13 . The method according to claim 1 , further comprising the step of controlling the temperature of the etchant to a temperature within the range of 22-28° C. 14 . The method according to claim 1 , further comprising the step of applying ultrasound to the etchant. 15 . The method according to claim 1 , further comprising the step of applying ultrasound to the glass material to be etched.
Assignees
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Classifications
- C03C15/00Primary
Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title
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- What does patent US2016145149A1 cover?
- A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO 3 , and at least 10% H 3 PO 4 by volume constituted such that the ratio HF:HNO 3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed…
- Who is the assignee on this patent?
- Corning Inc
- What technology area does this patent fall under?
- Primary CPC classification C03C15/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu May 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).