Printed circuit board (pcb) with wrapped conductor
US-2015382460-A1 · Dec 31, 2015 · US
US2016144602A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016144602-A1 |
| Application number | US-201414903913-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 9, 2014 |
| Priority date | Jul 9, 2013 |
| Publication date | May 26, 2016 |
| Grant date | — |
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An encapsulated polymeric article is disclosed. The encapsulated polymeric article may include a polymer substrate and a metallic outer shell at least partially encapsulating the polymer substrate. The encapsulated polymeric article may be fabricated by a method comprising: 1) providing a mandrel in a shape of the encapsulated polymeric article, 2) shaping the metallic outer shell on the mandrel, 3) removing the mandrel from the metallic outer shell, and 4) molding the polymeric substrate into the metallic outer shell through a port formed in the metallic outer shell to provide the encapsulated polymeric article.
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What is claimed is: 1 . An encapsulated polymeric article, comprising: a polymer substrate; and an outer shell at least partially encapsulating the polymer substrate, the polymer substrate and the outer shell being in mechanical contact without being bonded to each other. 2 . The encapsulated polymeric article of claim 1 , wherein the outer shell is formed from a metallic material. 3 . The encapsulated polymeric article of claim 2 , wherein the outer shell fully encapsulates the polymer substrate. 4 . The encapsulated polymeric article of claim 2 , wherein the metallic material is selected from the group consisting of nickel, cobalt, copper, iron, gold, silver, palladium, rhodium, chromium, zinc, tin, cadmium, and an alloy of any of the foregoing elements comprising at least 50 wt.% of the alloy, and combinations thereof. 5 . The encapsulated polymeric article of claim 4 , wherein the polymer substrate is formed from a thermoplastic material. 6 . The encapsulated polymeric article of claim 5 , wherein the thermoplastic material is selected from the group consisting of polyetherimide, thermoplastic polyimide, polyether ether ketone, polyether ketone ketone, polysulfone, polyamide, polyphenylene sulfide, polyesters, polyimide, and combinations thereof. 7 . The encapsulated polymeric article of claim 4 , wherein the polymer substrate is formed from a thermoset material. 8 . The encapsulated polymeric article of claim 7 , wherein the thermoset material is selected from the group consisting of a condensation polyimide, an addition polyimide, an epoxy cured with an aliphatic amine, an aromatic amine, and/or an anhydride, a cyanate ester, a phenolic compound, a polyester, polybenzoxazine, a polyurethane, a polyacrylate, a polymethacrylate, a thermoset silicone, and combinations thereof. 9 . The encapsulated polymeric article of claim 4 , wherein the polymer substrate is reinforced with a reinforcement material selected from glass and carbon. 10 . An encapsulated polymeric article including a polymer substrate and a metallic outer shell at least partially encapsulating the polymer substrate, the encapsulated polymeric article being fabricated by a method comprising: providing a mandrel in a shape of the encapsulated polymeric article; shaping the metallic outer shell on the mandrel; removing the mandrel from the metallic outer shell; and molding the polymeric substrate into the metallic outer shell through a port formed in the metallic outer shell to provide the encapsulated polymeric article. 11 . The encapsulated polymeric article of claim 10 , wherein shaping the metallic outer shell on the mandrel comprises shaping the metallic outer shell on the mandrel by a method selected from the group consisting of electroforming, cold spraying, and plasma vapor deposition. 12 . The encapsulated polymeric article of claim 10 , wherein molding the polymeric substrate into the metallic outer shell comprises injecting a polymeric material into the metallic outer shell. 13 . The encapsulated polymeric article of claim 10 , wherein molding the polymeric substrate into the metallic outer shell comprises molding the polymeric substrate by compression molding. 14 . The encapsulated polymeric article of claim 10 , wherein the method further comprises introducing the port into the metallic outer shell prior to molding the polymeric substrate into the metallic outer shell. 15 . The encapsulated polymeric article of claim 10 , wherein the method further comprises attaching one or more additional features to the encapsulated polymeric article. 16 . The encapsulated polymeric article of claim 10 , wherein the method further comprises removing the port from the metallic outer shell after molding the polymeric substrate into the metallic outer shell. 17 . A method for fabricating an encapsulated polymeric article, comprising: providing a mandrel in a shape of the encapsulated polymeric article; shaping an outer shell on the mandrel; removing the mandrel from the outer shell; and molding a polymeric substrate into the outer shell through a port formed in the outer shell to provide the encapsulated polymeric article. 18 . The method of claim 17 , wherein shaping the outer shell on the mandrel comprises shaping the outer shell on the mandrel by a method selected from the group consisting of electroforming, cold spraying, and plasma vapor deposition. 19 . The method of claim 17 , wherein molding the polymeric substrate into the outer shell comprises injecting a polymeric material into the outer shell. 20 . The method of claim 17 , wherein molding the polymeric substrate into the outer shell comprises molding the polymeric substrate by compression molding.
Preforms or parisons characterised by their configuration, e.g. geometry, dimensions or physical properties · CPC title
the preform having one end closed · CPC title
using masking means · CPC title
by moulding the material · CPC title
the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould · CPC title
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