Anisotropic conductive film and display device having the same

Patent metadata

Field	Value
Publication number	US-2016143174-A1
Application number	US-201514942658-A
Country	US
Kind code	A1
Filing date	Nov 16, 2015
Priority date	Nov 18, 2014
Publication date	May 19, 2016
Grant date	—

Abstract

A display device includes: a substrate having a pad area; a conductive pad on the pad area; a circuit member on the conductive pad, the circuit member including a bump overlapping the conductive pad; and an anisotropic conductive film between the conductive pad and the bump, the anisotropic conductive film electrically connecting the conductive pad and the bump. The anisotropic conductive film includes: an adhesive layer; at least one conductive particle positioned within the adhesive layer; and a first guide pattern positioned at a surface of the adhesive layer adjacent to the conductive pad.

First claim

What is claimed is:

1 . A display device comprising:
a substrate having a pad area; a conductive pad on the pad area; a circuit member on the conductive pad, the circuit member comprising a bump overlapping the conductive pad; and an anisotropic conductive film between the conductive pad and the bump, the anisotropic conductive film electrically connecting the conductive pad and the bump, wherein the anisotropic conductive film comprises: an adhesive layer; at least one conductive particle positioned within the adhesive layer; and a first guide pattern positioned at a surface of the adhesive layer adjacent to the conductive pad.

2 . The display device of claim 1 , further comprising a second guide pattern positioned at another surface of the adhesive layer.

3 . The display device of claim 2 , wherein at least part of the first guide pattern overlaps the second guide pattern.

4 . The display device of claim 2 , wherein the first guide pattern and the second guide pattern are disposed within the adhesive layer.

5 . The display device of claim 4 , wherein the first guide pattern and the second guide pattern each have a hardness greater than a hardness of the adhesive layer.

6 . The display device of claim 1 , further comprising a resin layer on another surface of the adhesive layer, the resin layer having a first surface facing the adhesive layer and a second surface opposite to the first surface; and
a second guide pattern positioned at the second surface of the resin layer.

7 . The display device of claim 1 , wherein the conductive particles have a higher density between the first guide patterns than on the first guide pattern.

8 . The display device of claim 2 , further comprising a plurality of the conductive pads and a plurality of the bumps, ones of the conductive pads positioned to correspond to ones of the bumps so as to form pairs of the conductive pads and bumps, wherein the first guide pattern and the second guide pattern are disposed in alternating manner with the pairs of the conductive pads and bumps.

9 . The display device of claim 2 , further comprising a plurality of the conductive pads and a plurality of the bumps, wherein the first guide pattern and the second guide pattern are disposed in alternating manner with respect to at least one of the conductive pads and at least one of the bumps.

10 . The display device of claim 2 , wherein the first guide pattern and the second guide pattern each have a height less than a diameter of the conductive particle.

11 . The display device of claim 2 , wherein the first guide pattern and the second guide pattern are provided in one of a linear pattern and a mesh pattern.

12 . The display device of claim 1 , wherein the circuit member is one of a driving chip and a flexible printed circuit board.

13 . An anisotropic conductive film comprising:
a base film; an adhesive layer on the base film; at least one conductive particle positioned within the adhesive layer; and a first guide pattern positioned at a surface of the adhesive layer.

14 . The anisotropic conductive film of claim 13 , further comprising a second guide pattern positioned at another surface of the adhesive layer.

15 . The anisotropic conductive film of claim 14 , wherein the first guide pattern and the second guide pattern are disposed within the adhesive layer.

16 . The anisotropic conductive film of claim 15 , wherein the first guide pattern and the second guide pattern each have a hardness greater than a hardness of the adhesive layer.

17 . The anisotropic conductive film of claim 14 , wherein the first guide pattern is disposed within the adhesive layer, and
the second guide pattern protrudes from another surface of the adhesive layer.

18 . The anisotropic conductive film of claim 17 , wherein the first guide pattern has a hardness greater than a hardness of the adhesive layer, and the second guide pattern has a hardness substantially the same as the hardness of the adhesive layer.

19 . The anisotropic conductive film of claim 13 , further comprising a resin layer on another surface of the adhesive layer, the resin layer having a first surface facing the adhesive layer and a second surface opposite to the first surface; and
a second guide pattern positioned at the second surface of the resin layer.

20 . The anisotropic conductive film of claim 14 , wherein the first guide pattern and the second guide pattern each have a height less than a diameter of the conductive particle.

Assignees

• Samsung Display Co Ltd

Inventors

• Cho Youngmin

Classifications

• H05K7/06 Primary

  on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title

• H05K2201/09945

  Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title