Multilayer circuit board

Patent metadata

Field	Value
Publication number	US-2016143141-A1
Application number	US-201514619944-A
Country	US
Kind code	A1
Filing date	Feb 11, 2015
Priority date	Nov 14, 2014
Publication date	May 19, 2016
Grant date	—

Abstract

A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

First claim

What is claimed is:

1 . A multilayer circuit board, comprising:
a first substrate having a first side, a second side, a first pad, and a first circuit, wherein the first side and the second side are on opposite sides of the first substrate; the first pad is on the second side, and electrically connected to the first circuit, which is embedded in the first substrate; and a second substrate having a third side, a fourth side, a first through hole, a second pad, and a second circuit, wherein the third side and the fourth side are on opposite sides of the second substrate; the third side of the second substrate is laminated on the second side of the first substrate; the first through hole is opened at both the third side and the fourth side, and the first pad of the first substrate is in the first through hole; the second pad is on the fourth side, and electrically connected the second circuit, which is embedded in the second substrate.

2 . The multilayer circuit board of claim 1 , further comprising a third substrate having a fifth side, a sixth side, a second through hole, a third through hole, a third pad, and a third circuit; the fifth side and the sixth side are on opposite sides of the third substrate; the fifth side of the third substrate is laminated on the fourth side of the second substrate; both the second through hole and the third through hole are opened at both the fifth side and the sixth side of the third substrate; the second through hole is aligned with the first through hole of the second substrate, so that the first pad of the first substrate is exposed through the first through hole and the second through hole; the second pad of the second substrate is in the third through hole; the third pad is on the sixth side of the third substrate, and electrically connected to the third circuit, which is embedded in the third substrate.

3 . The multilayer circuit board of claim 1 , further comprising a fourth substrate having a seventh side, an eighth side, a fourth through hole, a fifth pad, and a fourth circuit, wherein first substrate further includes a fourth pad on the first side; the seventh side and the eighth side are on opposite sides of the fourth substrate; the eighth side of the fourth substrate is laminated on the first side of the first substrate; the fourth through hole is opened at both the seventh side and the eighth side, and the fourth pad of the first substrate is in the fourth through hole; the fifth pad is on the seventh side, and electrically connected the fourth circuit, which is embedded in the second substrate.

4 . The multilayer circuit board of claim 1 , further comprising a conductor received in the first through hole of the second substrate to touch the first pad.

5 . The multilayer circuit board of claim 4 , wherein the conductor is provided with a recess on a top end thereof.

6 . The multilayer circuit board of claim 5 , wherein the conductor includes a head, a rod, and an elastic member; the head is provided with the recess on a top end thereof; the rod is received in the first trough hole to touch the first pad; and the elastic member has opposite ends urging the head and the rod.

7 . The multilayer circuit board of claim 2 , further comprising two conductor, one of which is received in the first through hole of the second substrate and the second thought hole of the third substrate to touch the first pad, and the other of which is received in the third through hole of the third substrate to touch the second pad.

8 . The multilayer circuit board of claim 7 , wherein each of the conductors is provided with a recess on a top end thereof.

9 . The multilayer circuit board of claim 8 , wherein each of the conductors includes a head, a rod, and an elastic member; the head is provided with the recess on a top end thereof; the rod is received in the corresponding through hole to touch the correspond pad; and the elastic member has opposite ends urging the head and the rod.

10 . The multilayer circuit board of claim 3 , further comprising two conductor, one of which is received in the first through hole of the second substrate to touch the first pad, and the other of which is received in the fourth through hole of the fourth substrate to touch the fourth pad.

11 . The multilayer circuit board of claim 10 , wherein each of the conductors is provided with a recess on a top end thereof.

12 . The multilayer circuit board of claim 11 , wherein each of the conductors includes a head, a rod, and an elastic member; the head is provided with the recess on a top end thereof; the rod is received in the corresponding through hole to touch the correspond pad; and the elastic member has opposite ends urging the head and the rod.

Assignees

• Mpi Corp

Inventors

• Ku Wei-Cheng
• Lai Jun-Liang
• Ho Chih-Hao

Classifications

• H05K2201/10295

  Metallic connector elements partly mounted in a hole of the PCB · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H05K1/112 Primary

  directly combined with via connections · CPC title

• H05K2201/10265

  Metallic coils or springs, e.g. as part of a connection element · CPC title

• H05K1/0268 Primary

  for electrical inspection or testing · CPC title