Seamless earbud structures and methods for making the same

US2016142807A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016142807-A1
Application numberUS-201615006046-A
CountryUS
Kind codeA1
Filing dateJan 25, 2016
Priority dateMar 15, 2011
Publication dateMay 19, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

First claim

Opening claim text (preview).

1 - 27 . (canceled) 28 . Apparatus comprising: a housing providing a port member and a neck member extending away from the port member in a first direction; the port member comprises a port operative to direct sound out from the port member in a second direction; and the first direction and the second direction are skew. 29 . The apparatus of claim 28 , wherein: the housing comprises a first sub-enclosure coupled to a second sub-enclosure; the apparatus further comprises a component covering at least a portion of the housing; and the at least a portion of the housing comprises at least a portion of a junction between the coupled first and second sub-enclosures of the housing. 30 . The apparatus of claim 29 , wherein the at least a portion of the housing further comprises at least a portion of the port member. 31 . The apparatus of claim 30 , wherein the at least a portion of the housing further comprises at least a portion of the neck member. 32 . The apparatus of claim 29 , wherein the at least a portion of the housing further comprises at least a portion of the neck member. 33 . The apparatus of claim 28 , wherein the port member is a non-occluding member. 34 . The apparatus of claim 28 , wherein a first line extending along the first direction does not intersect a second line extending along the second direction. 35 . The apparatus of claim 34 , wherein the first line is not parallel to the second line. 36 . An earbud comprising: a housing providing a port member and a neck member extending away from the port member in a first direction, wherein: the port member comprises a port provided through the port member in a second direction and operative to direct sound out from the port member; and a first line comprising the first direction does not intersect a second line comprising the second direction. 37 . The earbud of claim 36 , wherein the first line is not parallel to the second line. 38 . The earbud of claim 36 , wherein: the housing comprises a first sub-enclosure coupled to a second sub-enclosure; the earbud further comprises a component covering at least a portion of the housing; and the at least a portion of the housing comprises at least a portion of a junction between the coupled first and second sub-enclosures of the housing. 39 . The earbud of claim 38 , wherein the at least a portion of the housing further comprises at least a portion of the port member. 40 . An earbud comprising: a port member defining at least a portion of a volume of a housing; and a driver assembly positioned within the volume of the housing, wherein: the port member comprises a port; the driver assembly is operative to direct sound through the port; a first periphery of the port member in the largest cross-section of the port member surrounds a portion of the driver assembly; and a second periphery of the port member in the smallest cross-section of the port member comprises the port. 41 . The earbud of claim 40 , wherein the largest cross-section of the port member is parallel to the smallest cross-section of the port member. 42 . The earbud of claim 40 , wherein: the port is provided through the port member in a first direction; and a first line comprising the first direction is perpendicular to the largest cross-section of the port member. 43 . The earbud of claim 42 , wherein the first line is perpendicular to the smallest cross-section of the port member. 44 . The earbud of claim 40 , wherein: the port is operative to direct the sound out from the housing in a first direction; and a first line comprising the first direction is perpendicular to the largest cross-section of the port member. 45 . The earbud of claim 44 , wherein the first line is perpendicular to the smallest cross-section of the port member. 46 . The earbud of claim 40 , wherein: a first line extends through the center of the largest cross-section of the port member; the first line is perpendicular to the largest cross-section of the port member; a second line extends through the center of the smallest cross-section of the port member; the second line is perpendicular to the smallest cross-section of the port member; and the first line is parallel to the second line. 47 . The earbud of claim 40 , wherein: the housing provides a port member and a neck member extending away from the port member in a first direction; the port is provided through the port member in a second direction; and a first line comprising the first direction does not intersect a second line comprising the second direction.

Assignees

Inventors

Classifications

  • Constructional aspects of the interconnection between earpiece and earpiece support (earpiece support for monophonic headphones H04R1/105; earpiece support for stereophonic headphones H04R5/0335) · CPC title

  • with molding of electrically insulating material · CPC title

  • Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion · CPC title

  • H04R1/1016Primary

    Earpieces of the intra-aural type · CPC title

  • Non-occlusive ear tips, i.e. leaving the ear canal open, for both custom and non-custom tips (H04R2460/11 takes precedence) · CPC title

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What does patent US2016142807A1 cover?
Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more …
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification H04R1/1016. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu May 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).