Method of Forming Semiconductor Device
US-2024379727-A1 · Nov 14, 2024 · US
US2016142660A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016142660-A1 |
| Application number | US-201514853948-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 14, 2015 |
| Priority date | Sep 12, 2014 |
| Publication date | May 19, 2016 |
| Grant date | — |
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The present invention relates to a single chip image sensor with both visible light image and ultraviolet light detection ability and methods to implement the single chip image sensor. In an embodiment, a single chip image sensor may comprise a first plurality of sensor cells provided on a substrate, the first plurality of sensor cells each including a photo detector sensitive to visible light, and a UV coating layer provided for the first plurality of sensor cells to convert incident UV light to visible light.
Opening claim text (preview).
1 . A single chip image sensor, comprising: a first plurality of sensor cells provided on a substrate, the first plurality of sensor cells each including a photo detector sensitive to visible light, and a UV coating layer provided for the first plurality of sensor cells to convert incident UV light to visible light. 2 . The single chip image sensor of claim 1 , further comprising: a second plurality of sensor cells provided on the substrate, the second plurality of sensor cells each also including a photo detector sensitive to visible light. 3 . The single chip image sensor of claim 1 , further comprising: a filter film disposed on the UV coating layer to block incident visible and infrared lights. 4 . The single chip image sensor of claim 2 , further comprising: a package cover disposed over the first and second plurality of sensor cells. 5 . The single chip image sensor of claim 4 , wherein the UV coating layer is provided on a portion of the package cover that covers the first plurality of sensor cells. 6 . The single chip image sensor of claim 4 , wherein the UV coating layer is provided between the package cover and the first plurality of sensor cells. 7 . The single chip image sensor of claim 2 , wherein the first and second plurality of sensor cells each further comprises: a color filter formed on the photo detector to allow light of a particular color to pass therethrough, and a micro-lens formed on the color filter to focus incident light onto the photo detector. 8 . The single chip image sensor of claim 7 , wherein the color filter includes a red, green or blue filter. 9 . The single chip image sensor of claim 7 , wherein the UV coating layer is formed within the first plurality of sensor cells. 10 . The single chip image sensor of claim 9 , wherein the color filters in the first plurality of sensor cells are replaced by the UV coating layer. 11 . The single chip image sensor of claim 2 , wherein the first and second plurality of sensor cells are arranged in an array of a rectangular shape, and the first plurality of sensor cells are arranged along a side of the rectangular shape. 12 . The single chip image sensor of claim 11 , wherein the second plurality of sensor cells includes a black region where the sensor cells are covered by a black layer so as to sense a dark current, and the first plurality of sensor cells and the second plurality of sensor cells in the black region are arranged along a same side of the rectangular shape. 13 . The single chip image sensor of claim 2 , wherein the second plurality of sensor cells are arranged in a rectangular region that is separated from or abuts a rectangular region where the first plurality of sensor cells are arranged. 14 . An electronic device including a single chip image sensor comprising: a first plurality of sensor cells provided on a substrate, the first plurality of sensor cells each including a photo detector sensitive to visible light, and a UV coating layer provided for the first plurality of sensor cells to convert incident UV light to visible light. 15 . The electronic device of claim 14 , further comprising: a second plurality of sensor cells provided on the substrate, the second plurality of sensor cells each also including a photo detector sensitive to visible light. 16 . The electronic device of claim 15 , further comprising: a filter film disposed on the UV coating layer to block incident visible and infrared lights. 17 . The electronic device of claim 15 , further comprising: a package cover disposed over the first and second plurality of sensor cells, wherein the UV coating layer is disposed above or below the package cover. 18 . The electronic device of claim 14 , wherein the electronic device is one of a cell phone, a tablet, a laptop, a personal digital assistant (PDA), a wearable device, a smart watch, or a camera. 19 . A method of making a single chip image sensor, comprising: forming a first plurality of sensor cells on a substrate, the first plurality of sensor cells each including a photo detector sensitive to visible light; and providing a UV coating layer for the first plurality of sensor cells, the UV coating layer being capable of converting incident UV light to visible light. 20 . The method of claim 19 , further comprising: forming a second plurality of sensor cells on the substrate, the second plurality of sensor cells each also including a photo detector sensitive to visible light.
by using optical black pixels · CPC title
Microlenses · CPC title
Colour filters · CPC title
Optical elements or arrangements associated with the image sensors · CPC title
of coatings or optical elements · CPC title
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