Composite electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-2016142033-A1
Application number	US-201514882189-A
Country	US
Kind code	A1
Filing date	Oct 13, 2015
Priority date	Nov 14, 2014
Publication date	May 19, 2016
Grant date	—

Abstract

A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.

First claim

What is claimed is:

1 . A composite electronic component comprising:
a common mode filter including a first body having a common mode choke coil; a multilayer ceramic capacitor array coupled to the common mode filter and including a second body in which a plurality of dielectric layers are stacked; first and third external electrodes disposed on a side surface of the first body and electrically connected to the common mode choke coil; second and fourth external electrodes disposed on an opposing side surface of the first body and electrically connected to the common mode choke coil; first and second dummy electrodes respectively disposed on the side surface and the opposing side surface of the first body and spaced apart from the first to fourth external electrodes; fifth and seventh external electrodes disposed on a side surface of the second body; sixth and eighth external electrodes disposed on an opposing side surface of the second body; and third and fourth dummy electrodes respectively disposed on the side surface and the opposing side surface of the second body and spaced apart from the fifth to eighth external electrodes; wherein the first external electrode is coupled to the third dummy electrode, the second external electrode is coupled to the fourth dummy electrode, the third external electrode is coupled to the fifth external electrode, the fourth external electrode is coupled to the sixth external electrode, the first dummy electrode is coupled to the seventh external electrode, and the second dummy electrode is coupled to the eighth external electrode.

2 . The composite electronic component of claim 1 , wherein in the multilayer ceramic capacitor array, a plurality of dummy dielectric layers are inserted between dielectric layers on which internal electrodes are disposed.

3 . The composite electronic component of claim 2 , wherein the dielectric layers and the dummy dielectric layers are of different compositions.

4 . The composite electronic component of claim 1 , wherein the second body includes first to fourth internal electrodes stacked therein and having leads exposed externally.

5 . The composite electronic component of claim 4 , wherein the fifth to eighth external electrodes are connected to the first to fourth internal electrodes, respectively.

6 . The composite electronic component of claim 4 , wherein:
the first to fourth internal electrodes are perpendicular to a mounting surface of the composite electronic component, and the fifth to eighth external electrodes respectively partially extend on at least one of the upper or lower surfaces of the second body.

7 . The composite electronic component of claim 1 , wherein the multilayer ceramic capacitor array is coupled to an upper portion of the common mode filter.

8 . The composite electronic component of claim 1 , wherein the common mode filter and the multilayer ceramic capacitor array are coupled to each other by a conductive adhesive.

9 . A board having a composite electronic component, the board comprising:
a printed circuit board on which a plurality of electrode pads are formed; a composite electronic component mounted on the printed circuit board; and solders connecting the electrode pads and the composite electronic component to each other, wherein the composite electronic component includes: a common mode filter including a first body having a common mode choke coil; a multilayer ceramic capacitor array coupled to the common mode filter and including a second body in which a plurality of dielectric layers are stacked; first and third external electrodes disposed on a side surface of the first body and electrically connected to the common mode choke coil; second and fourth external electrodes disposed on an opposing side surface of the first body and electrically connected to the common mode choke coil; first and second dummy electrodes respectively disposed on the side surface and the opposing side surface of the first body and spaced apart from the first to fourth external electrodes; fifth and seventh external electrodes disposed on a side surface of the second body; sixth and eighth external electrodes disposed on an opposing side surface of the second body; and third and fourth dummy electrodes respectively disposed on the side surface and the opposing side surface of the second body and spaced apart from the fifth to eighth external electrodes; wherein the first external electrode is coupled to the third dummy electrode, the second external electrode is coupled to the fourth dummy electrode, the third external electrode is coupled to the fifth external electrode, the fourth external electrode is coupled to the sixth external electrode, the first dummy electrode is coupled to the seventh external electrode, and the second dummy electrode is coupled to the eighth external electrode.

10 . The board of claim 9 , wherein in the multilayer ceramic capacitor array, a plurality of dummy dielectric layers are inserted between dielectric layers on which internal electrodes are disposed.

11 . The board of claim 10 , wherein the dielectric layers and the dummy dielectric layers are of different compositions.

12 . The board of claim 9 , wherein the second body includes first to fourth internal electrodes stacked therein and having leads exposed externally.

13 . The board of claim 12 , wherein the fifth to eighth external electrodes are connected to the first to fourth internal electrodes, respectively.

14 . The board of claim 12 , wherein:
the first to fourth internal electrodes are perpendicular to a mounting surface of the composite electronic component, and the fifth to eighth external electrodes respectively partially extend on at least one of the upper or lower surfaces of the second body.

15 . The board of claim 9 , wherein the multilayer ceramic capacitor array is coupled to an upper portion of the common mode filter.

16 . The board of claim 9 , wherein the common mode filter and the multilayer ceramic capacitor array are coupled to each other by a conductive adhesive.

Assignees

• Samsung Electro Mech

Inventors

• Chong Won Sik
• Park Jae Young
• Kim Jong Young
• Choi Woo Jin

Classifications

• H01G4/008

  Selection of materials · CPC title

• H03H7/0107

  Non-linear filters · CPC title

• H01G4/228

  Terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title