Package structure including a cavity coupled to an injection gas channel composed of a permeable material

Patent metadata

Field	Value
Publication number	US-2016137487-A1
Application number	US-201514938118-A
Country	US
Kind code	A1
Filing date	Nov 11, 2015
Priority date	Nov 13, 2014
Publication date	May 19, 2016
Grant date	—

Abstract

A packing structure including:
a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate; a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity; a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity; an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

First claim

1 . A packaging structure including at least:
a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate; a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity; a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity; an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

2 . The packaging structure according to claim 1 , wherein said part of the layer of the first material surrounds the cavity.

3 . The packaging structure according to claim 1 , further including at least one micro-device arranged in the cavity.

4 . The packaging structure according to claim 1 , wherein the second material is a metal.

5 . The packaging structure according to claim 1 , wherein the first material includes at least one of the following elements: semiconductor oxide, semiconductor nitride, and glass.

6 . The packaging structure according to claim 1 , wherein at least one part of the portion of the second material is surrounded by a second part of the layer of the first material.

7 . The packaging structure according to claim 1 , wherein the cap includes at least one second substrate.

8 . The packaging structure according to claim 7 , wherein the layer of the first material and the portion of the second material are arranged at the interface between the first substrate and the second substrate.

9 . The packaging structure according to claim 1 , wherein the layer of the first material is arranged between a support layer of the first substrate and an upper layer of the first substrate.

10 . The packaging structure according to claim 3 , wherein the layer of the first material is arranged between a support layer of the first substrate and an upper layer of the first substrate, wherein the upper layer of the first substrate is a semiconductor layer in which the micro-device is made.

11 . The packaging structure according to claim 10 , wherein the second material corresponds to a semiconductor similar to that of the upper layer of the first substrate.

12 . The packaging structure according to claim 1 , wherein the first substrate is of the SOI-type and the layer of the first material corresponds to the insulating layer of the first substrate.

13 . The packaging structure according to claim 1 , further including at least one plugging material arranged on and/or in the aperture such that the cavity is hermetically closed.

14 . The packaging structure according to claim 13 , wherein the aperture passes through said part of the layer of the first material and opens onto a portion of electrically conducting material, and the plugging material corresponds to an electrically conducting layer arranged at least in the aperture and electrically connecting the portion of the electrically conducting material to an electrical contact arranged outside the aperture.

15 . The packaging structure according to claim 1 , including several cavities formed between the cap and the first substrate and arranged adjacent to each other, wherein at least one dimension of each of the parts of the layer of the first material forming the parts of the wall of at least two of the cavities is different for each of said at least two of said cavities and/or wherein a dimension of a cross-section of the aperture associated with each of at least two of the cavities is different.

16 . The packaging structure according to claim 15 , wherein the portions of the second material surrounding each of the parts of the layer of the first material forming the part of the wall of each of the cavities are distinct from each other.

17 . A method for manufacturing a packaging structure, including at least the following steps of:
making at least one cap and at least one first substrate for being secured to each other by forming at least one cavity between the cap and the first substrate; making a layer of at least one first material permeable to at least one gas, arranged in the cap and/or in the first substrate and/or at an interface between the cap and the first substrate, and for forming at least one part of a wall of the cavity; making at least one portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material for forming said part of the wall of the cavity; securing the cap to the first substrate, forming the cavity; making at least one aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

18 . The manufacturing method according to claim 17 , further including, after the step of making the aperture, a step of injecting said gas into the cavity through the aperture and said part of the layer of the first material, and then a step of hermetically closing the cavity by forming at least one plugging material on and/or in the aperture.

Assignees

• Commissariat Energie Atomique

Inventors

• Nicolas Stephane

Classifications

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• B81C2203/0145

  Hermetically sealing an opening in the lid · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81C1/00285 Primary

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• B81B2207/097

  Interconnects arranged on the substrate or the lid, and covered by the package seal · CPC title