Integral hot melt adhesive packaging films and use thereof

Patent metadata

Field	Value
Publication number	US-2016137371-A1
Application number	US-201615004187-A
Country	US
Kind code	A1
Filing date	Jan 22, 2016
Priority date	May 17, 2012
Publication date	May 19, 2016
Grant date	—

Abstract

Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.

First claim

I/we claim:

1 . A method of forming an integral hot melt adhesive package comprising the steps of:
1. preparing the packaging film as an encapsulating vessel; 2. pumping or pouring the hot melt adhesive in a molten state into the packaging film, wherein the packaging film is in direct contact with a heat sink; 3. sealing the packaging film; and 4. cooling the sealed package; and wherein the packaging film comprises a polymer blend comprising at least 70 wt % of propylene and up to 15 wt % of ethylene content; and the packaging film has (a) a viscosity range of about 200,000 to 3,000,000 cps at 200° C.; (b) a peak melting temperature range of about 90 to 140° C.; (c) a Tm offset temperature below 149° C.; and (d) a storage modulus (G′) range of about 1×10 6 to about 1×10 8 Pascal at 100° C.; wherein the hot melt adhesive selected is from the group consisting of poly-alpha-olefins, rubbers, styrenic block-copolymers, ethylene-vinyl acetates, ethylene-butyl acetates, and mixtures thereof; and wherein the cooled sealed package is non-tacky.

2 . The method of forming an integral hot melt adhesive package of claim 1 wherein pumping or pouring the hot melt adhesive in a molten state is conducted at temperatures of about 150° C. or below.

3 . The method of forming an integral hot melt adhesive package of claim 1 wherein the heat sink is water.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Chen Jinyu
• Hu Yuhong
• Desai Darshak

Classifications

• B32B2270/00

  Resin or rubber layer containing a blend of at least two different polymers · CPC title

• C08J2423/08

  Copolymers of ethene (C08J2423/16 takes precedence) · CPC title

• Y10T428/1397

  Single layer [continuous layer] · CPC title

• C08J2323/08

  Copolymers of ethene (C08J2323/16 takes precedence) · CPC title

• B65B9/20

  the webs being formed into tubes in situ around the filling nozzles · CPC title