Thermal spreading for an externally pluggable electronic module

Patent metadata

Field	Value
Publication number	US-2016135332-A1
Application number	US-201414534273-A
Country	US
Kind code	A1
Filing date	Nov 6, 2014
Priority date	Nov 6, 2014
Publication date	May 12, 2016
Grant date	—

Abstract

A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.

First claim

1 . A cooling apparatus for dissipating heat from a heat-producing electronic module, the cooling apparatus comprising:
a thermally conductive shell having at least one surface in thermally conductive contact with the heat-producing electronic module, and configured to conduct heat away from the heat-producing electronic module; a first electrically insulative layer, positioned between the at least one surface of the thermally conductive shell and the heat-producing electronic module and configured to conduct heat from the heat-producing electronic module to the thermally conductive shell; an electrical cord attached to the heat-producing electronic module and containing a thermally conductive layer in thermally conductive contact with the thermally conductive shell, the thermally conductive layer configured to conduct heat away from the thermally conductive shell; a second electrically insulative layer, positioned between the thermally conductive layer and at least one electrical conductor within the electrical cord; and a third electrically insulative layer, positioned between the thermally conductive layer and an outer surface of the electrical cord, and configured to convectively dissipate heat from the thermally conductive layer.

2 . The apparatus of claim 1 , wherein the heat-producing electronic module is an optoelectronic module.

3 . The apparatus of claim 2 , wherein the optoelectronic module is a 100 Gb/s form factor pluggable (CXP) module.

4 . The apparatus of claim 1 , wherein the thermally conductive shell includes copper.

5 . The apparatus of claim 1 , wherein the thermally conductive shell includes aluminum.

6 . The apparatus of claim 1 , wherein the first electrically insulative layer includes mica.

7 . A system for dissipating heat from a heat-producing electronic module, the system comprising:
a chassis having at least one receptacle configured to receive a heat-producing electronic module; a heat-producing electronic module inserted into a receptacle of the at least one receptacle; a cooling apparatus configured to dissipate heat from the heat-producing electronic module, the cooling apparatus having:
a thermally conductive shell in thermally conductive contact with the heat-producing electronic module, and configured to conduct heat away from the heat-producing electronic module;
a first electrically insulative layer, positioned between the at least one surface of the thermally conductive shell and the heat-producing electronic module and configured to conduct heat from the heat-producing electronic module to the thermally conductive shell;
a first thermally conductive electrical cord attached to the heat-producing electronic module and containing a thermally conductive layer in thermally conductive contact with the thermally conductive shell, the thermally conductive layer configured to conduct heat away from the thermally conductive shell;
a second electrically insulative layer, positioned between the thermally conductive layer and at least one electrical conductor within the first thermally conductive electrical cord; and
a third electrically insulative layer, positioned between the thermally conductive layer and an outer surface of the first thermally conductive electrical cord, and configured to convectively dissipate heat from the thermally conductive layer; and
a fan operable to dissipate heat from the thermally conductive layer of the cooling apparatus by flowing cooling air across the first thermally conductive electrical cord attached to the heat-producing electronic module.

8 . The system of claim 7 , wherein the thermally conductive layer includes metal foil.

9 . The system of claim 7 , wherein the thermally conductive layer includes metal braid.

10 . The system of claim 7 , wherein the thermally conductive layer includes copper braid.

11 . The system of claim 7 , further comprising a thermally conductive housing that at least partially encloses and is in thermally conductive contact with the heat-producing electronic module.

12 . The system of claim 11 , wherein the thermally conductive housing is constructed from sheet metal.

13 . The system of claim 11 , further comprising a heat sink in thermally conductive contact with the thermally conductive housing and that is configured to dissipate heat from the heat-producing electronic module.

14 . The system of claim 7 , further comprising a second thermally conductive electrical cord attached to the heat-producing electronic module.

15 - 20 . (canceled)

Assignees

• IBM

Inventors

• Mann Phillip V
• O'Connell Kevin M
• Sinha Arvind K
• Stathakis Karl

Classifications

• H05K7/20418 Primary

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title